Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/03/2003US6571469 Method for manufacturing modular board
06/03/2003US6571468 Precise alignment of interconnect layer in semiconductors
06/03/2003US6571461 Linear guide with an air bearing having provision for heating a support element of the linear guide to maintain fluid gap
06/03/2003US6571448 Apparatus for attaching sand papers on dummy wafers
06/03/2003CA2246193C Precision dispensing process control
06/03/2003CA2145358C Circuit for controlling the voltages between well and sources of mos logic transistors, and system for slaving the power supply
05/2003
05/30/2003WO2003044875A1 Improved patterning of electrodes in oled devices with shaped pillars
05/30/2003WO2003044869A1 Transistor and semiconductor memory comprising it
05/30/2003WO2003044868A1 Semiconductor storage device, its manufacturing method and operating method, and portable electronic apparatus
05/30/2003WO2003044867A1 Thick-film semiconductor device and its manufacturing method
05/30/2003WO2003044866A1 Trench mosfet device with polycrystalline silicon source contact structure
05/30/2003WO2003044865A1 Trench mosfet having low gate charge
05/30/2003WO2003044863A1 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications
05/30/2003WO2003044861A1 Heterojunction semiconductor device and method of manufacturing such device
05/30/2003WO2003044860A1 Method of forming ultra shallow junctions
05/30/2003WO2003044859A1 Multi-chip circuit module and method for producing the same
05/30/2003WO2003044858A2 Semiconductor device and method of enveloping an integrated circuit
05/30/2003WO2003044856A1 Protective layer in memory device and method therefor
05/30/2003WO2003044855A2 Polysilicon gate doping level variation for reduced leakage current
05/30/2003WO2003044854A1 Semiconductor device, method for generating semiconductor device pattern, method for semiconductor device, and pattern generator for semiconductor device
05/30/2003WO2003044853A2 Substrate contact in soi and method therefor
05/30/2003WO2003044852A2 Estimating reliability of components for testing and quality optimization
05/30/2003WO2003044851A2 Method and apparatus for utilizing integrated metrology data as feed-forward data
05/30/2003WO2003044850A1 Apparatus for molding a semiconductor wafer and process therefor
05/30/2003WO2003044849A2 Integrated void-free process for assembling a solder bumped chip
05/30/2003WO2003044848A1 Method of applying no-flow underfill
05/30/2003WO2003044847A1 Method of forming narrow trenches in semiconductor substrates
05/30/2003WO2003044846A1 Method for forming trench mosfet device with low parasitic resistance
05/30/2003WO2003044845A1 Silicon epitaxial wafer and manufacturing method thereof
05/30/2003WO2003044844A1 Compositions and methods for forming dielectric layers using a colloid
05/30/2003WO2003044843A2 Forming low k dielectric layers
05/30/2003WO2003044842A1 Etching method and apparatus
05/30/2003WO2003044841A2 Method of dicing a complex topologically structured wafer
05/30/2003WO2003044840A1 Reactive codoping of gaalinp compound semiconductors
05/30/2003WO2003044839A2 Formation of high-mobility silicon-germanium structures by low-energy plasma enhanced chemical vapor deposition
05/30/2003WO2003044838A1 Method of manufacturing high-mobility organic thin films using organic vapor phase deposition
05/30/2003WO2003044837A2 Ion imlantation method and apparatus
05/30/2003WO2003044834A2 Sonic transducers bonded with polymers and methods of making same for efficient sonic energy transfer
05/30/2003WO2003044833A2 Method for limiting divot formation in post shallow trench isolation processes
05/30/2003WO2003044801A1 A ferroelectric or electret memory circuit
05/30/2003WO2003044800A2 Asymmetric mram cell and bit design for improving bit yield
05/30/2003WO2003044762A1 Active matrix substrate, electro-optical apparatus, and electronic device
05/30/2003WO2003044733A1 Method for making a module comprising at least an electronic component
05/30/2003WO2003044602A2 Laser beam pattern generator with compensation of rotational scan errors
05/30/2003WO2003044600A1 Spin-on anti-reflective coatings for photolithography
05/30/2003WO2003044598A1 Compensating for effects of variations in gas refractivity in interferometers
05/30/2003WO2003044570A1 Dispersion management optical lithography crystals for below 160nm optical lithography & method thereof
05/30/2003WO2003044246A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
05/30/2003WO2003044242A2 Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors
05/30/2003WO2003044089A1 Thermosetting resin compositions useful as underfill sealants
05/30/2003WO2003044079A1 Spin-on-glass anti-reflective coatings for photolithography
05/30/2003WO2003044077A1 Spin-on-glass anti-reflective coatings for photolithography
05/30/2003WO2003043944A1 Below 160nm optical lithography crystal materials and methods of making
05/30/2003WO2003043810A2 Nanocrystal structures
05/30/2003WO2003043780A2 Method for polishing a substrate surface
05/30/2003WO2003043774A1 A wire bonder for ball bonding insulated wire and method of using same
05/30/2003WO2003043751A1 An apparatus and method for cleaning glass substrates using a cool hydrogen flame
05/30/2003WO2003032431A3 Switch circuit and method of switching radio frequency signals
05/30/2003WO2003017374A3 Memory cell
05/30/2003WO2003017352A3 Providing current control over wafer borne semiconductor devices using overlayer patterns
05/30/2003WO2003016922A3 Electronic circuit and method for testing
05/30/2003WO2003015248A3 Low-voltage punch-through bi-directional transient-voltage suppression devices having surface breakdown protection and methods of making the same
05/30/2003WO2003009343A3 Plating apparatus
05/30/2003WO2003007398A9 Progressive aligned deposition
05/30/2003WO2003005440A3 Non-volatile memory
05/30/2003WO2003005433A3 Integrated circuit device including a layered superlattice material with an interface buffer layer
05/30/2003WO2003000456A3 Method for carrying out local laser-induced etching of solid materials
05/30/2003WO2002103752A3 Metal-assisted chemical etch to produce porous group iii-v materials
05/30/2003WO2002103226A3 Floating seal pick and place system and unit therefor
05/30/2003WO2002101834A3 An intermediate manufacture for a dual gate logic device
05/30/2003WO2002101822A3 Interconnection in semiconductor device and method for manufacturing the same
05/30/2003WO2002095798A3 Fibre optic wafer probe
05/30/2003WO2002093745A3 Reconfigurable logic device
05/30/2003WO2002093649A3 Electronic module and method for assembling same
05/30/2003WO2002093622A3 Substrate transport container
05/30/2003WO2002092211A3 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
05/30/2003WO2002086970A3 Semiconductor device and method of manufacturing the same
05/30/2003WO2002084706A3 Integrated magnetoresistive semiconductor memory arrangement
05/30/2003WO2002082496A3 Method and system for controlling beam scanning in an ion implantation device
05/30/2003WO2002078091A3 Field effect transistor structure and method of manufacture
05/30/2003WO2002071482A3 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit
05/30/2003WO2002069049A3 Simultaneous imaging of two reticles
05/30/2003WO2002052634A3 Method for characterising and simulating a chemical-mechanical polishing process
05/30/2003WO2002045167A3 Thin films for magnetic devices
05/30/2003WO2002003461A3 Ball limiting metallurgy for input/outputs and methods of fabrication
05/30/2003WO1999067158A3 Integrated roller transport pod and asynchronous conveyor
05/30/2003CA2467815A1 Method for making a module comprising at least an electronic component
05/30/2003CA2467005A1 Nanocrystal structures
05/29/2003US20030101424 Method for automatically laying out semiconductor integrated circuit
05/29/2003US20030101399 Hold time error correction method and correction program for integrated circuits
05/29/2003US20030101396 Delay fault test circuitry and related method
05/29/2003US20030101037 Simulation apparatus and simulation method
05/29/2003US20030101013 Apparatus and method for characterizing features at small dimensions
05/29/2003US20030100824 Architecture tool and methods of use
05/29/2003US20030100695 Organic polymer for organic anti-reflective coating layer and preparation thereof
05/29/2003US20030100691 Porous low k (<2.0) thin film derived from homo-transport-polymerization
05/29/2003US20030100459 To remove photoresists during semiconductor device manufacturing
05/29/2003US20030100250 Pads for CMP and polishing substrates
05/29/2003US20030100247 Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use
05/29/2003US20030100223 Power-interface assembly of susceptor for use in semiconductor fabrication apparatus
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