Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/29/2003US20030098705 Electric circuit system
05/29/2003US20030098702 Probe card and probe contact method
05/29/2003US20030098700 Probe card device and probe for use therein
05/29/2003US20030098684 Handler for tape carrier packages and method of traveling tape carrier package tape
05/29/2003US20030098531 Method and apparatus of producing thin film of metal or metal compound
05/29/2003US20030098514 Packages for semiconductor die
05/29/2003US20030098513 Method for bonding inner leads to bond pads without bumps and structures formed
05/29/2003US20030098511 Simply inserting the optical fiber into a through hole of a silicon wafer to be passively aligned with an optical device chip
05/29/2003US20030098509 Semiconductor device, semiconductor element and method for producing same
05/29/2003US20030098508 120 Degree bump placement layout for an integrated circuit power grid
05/29/2003US20030098506 Semiconductor device having a semiconductor chip and a lead substrate connected with each other through pads and patterned lead wires without short-circuiting the pads
05/29/2003US20030098503 Frame for semiconductor package
05/29/2003US20030098501 Semiconductor with a stress reduction layer and manufacturing method therefor
05/29/2003US20030098499 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pad, semiconductor device components including same, and methods for fabricating same
05/29/2003US20030098497 Barrier layers for protecting metal oxides from hydrogen degradation
05/29/2003US20030098495 Semiconductor device
05/29/2003US20030098494 Wafer level packaging for making flip-chips
05/29/2003US20030098493 Isolating trench and manufacturing process
05/29/2003US20030098492 Semiconductor device structure and method for forming
05/29/2003US20030098491 Semiconductor device with trench isolation and fabrication method thereof
05/29/2003US20030098489 High temperature processing compatible metal gate electrode for pFETS and methods for fabrication
05/29/2003US20030098487 Semiconductor device with metal gate electrode and silicon oxynitride spacer
05/29/2003US20030098486 Semiconductor device manufacture method including process of implanting impurity into gate electrode independently from source /drain and semiconductor device manufactured by the method
05/29/2003US20030098485 Nonvolatile semiconductor memory device
05/29/2003US20030098484 Semiconductor device and method for fabricating the same
05/29/2003US20030098483 Vertical internally-connected trench cell (V-ICTC) and formation method for semiconductor memory devices
05/29/2003US20030098482 Reduction of damage in semiconductor container capacitors
05/29/2003US20030098481 Capacitor array structure for semiconductor devices
05/29/2003US20030098480 Atomic layer deposition of capacitor dielectric
05/29/2003US20030098479 Novel MOS transistor structure and method of fabrication
05/29/2003US20030098478 Field effect transistor and fabrication method
05/29/2003US20030098477 Field-effect type compound semiconductor device and method for fabricating the same
05/29/2003US20030098473 Semiconductor device and method for fabricating the same
05/29/2003US20030098471 Method for manufacturing a low-profile semiconductor device
05/29/2003US20030098470 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
05/29/2003US20030098467 Interconnect structure for an integrated circuit and corresponding fabrication method
05/29/2003US20030098466 Capacitor element, method for manufacturing the same, semiconductor device and method for manufacturing the same
05/29/2003US20030098465 Heterojunction bipolar transistor and method for production thereof
05/29/2003US20030098464 Resist material, resist pattern and forming method for the same, and a semiconductor device and manufacturing method for the same
05/29/2003US20030098462 III-V nitride semiconductor device, and protection element and power conversion apparatus using the same
05/29/2003US20030098461 Utilizing atomic layer deposition for programmable device
05/29/2003US20030098458 Semiconductor device and its manufacturing method
05/29/2003US20030098454 Semiconductor device having a solid-state image sensor
05/29/2003US20030098446 Composition for the chemical-mechanical polishing of metal and metal/dielectric structures with high selectivity
05/29/2003US20030098434 Method of fabricating a copper damascene structure
05/29/2003US20030098426 Wire bonding method and apparatus
05/29/2003US20030098424 System to reduce heat-induced distortion of photomasks during lithography
05/29/2003US20030098385 Spool gripper, spool handling unit with spool gripper, and method of handling spool using same
05/29/2003US20030098372 Multi-sectored flat board type showerhead used in CVD apparatus
05/29/2003US20030098333 Wire bonding device and wire bonding method
05/29/2003US20030098330 Wire bonding apparatus
05/29/2003US20030098300 Molding heater for heating semiconductor wafer and fabrication method thereof
05/29/2003US20030098299 Ceramic heater
05/29/2003US20030098292 Process for low temperature, dry etching, and dry planarization of copper
05/29/2003US20030098291 Layer-by-layer etching apparatus using neutral beam and etching method using the same
05/29/2003US20030098288 Plasma processing method
05/29/2003US20030098253 Spool case for bonding wire, and method of handling spool using same
05/29/2003US20030098241 Process and apparatus for manufacturing a semiconductor device
05/29/2003US20030098127 Plasma processing apparatus
05/29/2003US20030098126 Etching apparatus using neutral beam
05/29/2003US20030098125 Method of and apparatus for performing sequential processes requiring different amounts of time in the manufacturing of semiconductor devices
05/29/2003US20030098066 Poppet valve with heater
05/29/2003US20030098048 Prevents an occurrence of unprocessed portions on a substrate subjected to a liquid processing
05/29/2003US20030098047 Edge supporting devices for transferring materials in an immersion processing system (such as supporting and handling semiconductor wafers, during various wet processing, cleaning and drying operations)
05/29/2003US20030098046 Enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure
05/29/2003US20030098043 Device and method for treating semiconductor wafers
05/29/2003US20030098040 Rotating the semiconductor substrate, supplying a cleaning liquid to an edge section of the substrate for cleaning edge and a side section of the substrate, applying an ultrasonic wave to cleaning liquid supplied to edge secation
05/29/2003US20030098039 Device for deposition with chamber cleaner and method for cleaning the chamber
05/29/2003US20030097987 Plasma CVD apparatus conducting self-cleaning and method of self-cleaning
05/29/2003US20030097985 Vacuum processing apparatus and control method therefor
05/29/2003US20030097983 Coating film forming apparatus
05/29/2003US20030097977 In-situ post epitaxial treatment process
05/29/2003US20030097976 Mixing first precursor and a coordinating solvent to form first mixture, exposing it to a reaction promoter, heating the first mixture and introducing second precursor into first mixture to form second mixture, resulting in nanoparticles
05/29/2003US20030097888 Fabrication method for sample to be analyzed
05/29/2003US20030097750 Manufacturing method of electronic circuit including multilayer circuit board
05/29/2003US20030097748 Apparatus for assembling integrated circuit packages
05/29/2003US20030097742 Auxiliary tool for dismantling a guide ring and application method of the same
05/29/2003CA2409237A1 Process for the manufacture of an electronic component containing an inductive micro-component
05/29/2003CA2409232A1 Process for the manufacture of an electronic component containing an inductive micro-component
05/28/2003EP1315407A2 Dielectric structure
05/28/2003EP1315215A2 Floating gate field effect transistor
05/28/2003EP1315214A2 Semiconductor memory having storage cells storing multiple bits and a method of driving the same
05/28/2003EP1315212A1 Semiconductor device and its manufacturing method
05/28/2003EP1315211A1 A method for manufacturing charge coupled image sensors
05/28/2003EP1315210A1 Multi-threshold mis integrated circuit device and circuit design method thereof
05/28/2003EP1315204A2 A dual gate oxide process with reduced thermal redistribution of thin-gate channel implant profiles due to thick-gate oxyde
05/28/2003EP1315203A2 Semiconductor device with different bonding configurations
05/28/2003EP1315202A1 Method of fabricating a Schottky diode on a silicon carbide substrate
05/28/2003EP1315201A1 Radial antenna and plasma processing apparatus comprising the same
05/28/2003EP1315200A1 CMOS semiconductor devices with selectable gate thickness and methods for manufacturing such devices
05/28/2003EP1315199A1 Formation of high-mobility silicon-germanium structures by low-energy plasma enhanced chemical vapor deposition
05/28/2003EP1315198A1 Pod cover removing-installing apparatus
05/28/2003EP1315194A2 Plasma CVD apparatus and method with self-cleaning capability
05/28/2003EP1315170A2 Multibit memory device
05/28/2003EP1315044A1 Resist composition and method for manufacturing a semiconductor device using the resist composition
05/28/2003EP1315043A1 Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof
05/28/2003EP1314707A2 Aluminum nitride ceramics, members for use in a system for producing semiconductors, corrosion resistant members and conductive members
05/28/2003EP1314206A1 A spin filter and a memory using such a spin filter
05/28/2003EP1314204A1 Indium gallium nitride channel high electron mobility transistors, and method of making the same
05/28/2003EP1314203A2 Trench mosfet with structure having low gate charge