Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/05/2003WO2003046997A1 Trench mosfet device with improved on-resistance
06/05/2003WO2003046996A1 Vertical mosfets having crossing trench-based gate electrodes that extend into deeper trench-based source electrodes and methods of forming same
06/05/2003WO2003046994A1 Method for producing cemented wafer
06/05/2003WO2003046993A1 Production method for soi wafer
06/05/2003WO2003046992A1 Soi wafer manufacturing method
06/05/2003WO2003046991A1 Semiconductor device and manufacturing method
06/05/2003WO2003046987A1 Unit semiconductor device, its manufacturing method, and three-dimensional laminated type semiconductor device
06/05/2003WO2003046986A2 Semiconductor device, and means for checking the authenticity
06/05/2003WO2003046985A1 Fib-protected semiconductor chip
06/05/2003WO2003046980A2 Forming defect prevention trenches in dicing streets
06/05/2003WO2003046979A2 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
06/05/2003WO2003046978A2 Method of implantation after copper seed deposition
06/05/2003WO2003046977A2 Insulation trench for an integrated circuit and method for production thereof
06/05/2003WO2003046976A1 Reliability evaluation tester, reliability evaluation test system, contactor, and reliability evaluation test method
06/05/2003WO2003046974A2 Capacitor and a method for producing a capacitor
06/05/2003WO2003046973A2 Combined methods of a thermal annealing and rapid thermal annealing
06/05/2003WO2003046972A2 Method for producing a layer on a substrate
06/05/2003WO2003046971A1 Method for forming an oxynitride spacer for a metal gate electrode using a pecvd process with a silicon-starving atmosphere
06/05/2003WO2003046970A1 Low temperature compatible wide-pressure-range plasma flow device
06/05/2003WO2003046969A1 Processing device, and gas discharge suppressing member
06/05/2003WO2003046968A1 Production method for silicon wafer and silicon wafer and soi wafer
06/05/2003WO2003046967A2 Method of forming a doped region in a semiconductor body comprising a step of amorphization by irradiation
06/05/2003WO2003046965A1 Specialized substrates for use in sequential lateral solidification processing
06/05/2003WO2003046964A1 Active matrix thin film transistor array backplane
06/05/2003WO2003046961A2 Photolithographic method for forming a structure in a semiconductor substrate
06/05/2003WO2003046960A1 Method and device for processing semiconductor wafer
06/05/2003WO2003046958A2 Wafer handling apparatus and method
06/05/2003WO2003046957A1 Heated vacuum support apparatus
06/05/2003WO2003046956A1 An integrated circuit resistant to the formation of cracks in a passivation layer
06/05/2003WO2003046954A2 Storage device
06/05/2003WO2003046953A2 Retaining device and method for supplying heat to or discharging heat from a substrate
06/05/2003WO2003046952A2 Semiconductor component handling device having an electrostatic dissipating film
06/05/2003WO2003046951A2 Performance polymer film insert molding for fluid control devices
06/05/2003WO2003046950A2 Semiconductor component handling device having a performance film
06/05/2003WO2003046948A2 Bipolar semiconductor device and method for production thereof
06/05/2003WO2003046947A2 Bipolar transistor
06/05/2003WO2003046924A1 Folded memory layers
06/05/2003WO2003046922A2 Semiconductor arrangement comprising transistors based on organic semiconductors and non-volatile read-write memory cells
06/05/2003WO2003046921A1 A method for making self-registering non-lithographic transistors with ultrashort channel lengths
06/05/2003WO2003046920A2 Method for producing a memory cell of a memory cell field in a semiconductor memory
06/05/2003WO2003046802A2 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof
06/05/2003WO2003046665A1 Defective pixel compensation method
06/05/2003WO2003046663A2 Characterization of the illumination angle distribution of a projection lighting system
06/05/2003WO2003046662A1 Imaging apparatus
06/05/2003WO2003046658A1 Method of extending the stability of a photoresist during direct writing of an image upon the photoresist
06/05/2003WO2003046634A1 Projection optical system, exposure device, and exposure method
06/05/2003WO2003046531A2 Method for detecting defects in substrates
06/05/2003WO2003046254A1 Method for the fabrication of silicon nitride, silicon oxynitride, and silicon oxide films by chemical vapor deposition
06/05/2003WO2003046253A1 Method for depositing silicon nitride films and silicon oxynitride films by chemical vapor deposition
06/05/2003WO2003046098A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
06/05/2003WO2003045840A2 Mesoporous materials and methods
06/05/2003WO2003045836A1 Differential stress reduction in thin films
06/05/2003WO2003045820A1 Front opening wafer carrier with path to ground effectuated by door
06/05/2003WO2003045673A1 Informational polymer film insert molding
06/05/2003WO2003045540A1 Apparatus and method for processing electronic component recursors
06/05/2003WO2003045539A1 Thin film membrane structure
06/05/2003WO2003036690A3 Identification code reader integrated with substrate carrier robot
06/05/2003WO2003015172A3 Method of manufacturing a non-volatile memory
06/05/2003WO2003014809A3 Electrostatic discharge protection for pixellated electronic device
06/05/2003WO2003007381A3 Low voltage threshold dynamic biasing
06/05/2003WO2003003418A3 Locator pin integrated with sensor for detecting semiconductor substrate carrier
06/05/2003WO2003001587A3 Method of transferring a substantially disc-shaped workpiece
06/05/2003WO2002103800A3 Integration of two memory types
06/05/2003WO2002100593A3 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
06/05/2003WO2002091449A3 Etching a substrate in a process zone
06/05/2003WO2002075782A3 Self-aligned, trenchless magnetoresistive random-access memory (mram) structure with sidewall containment of mram structure
06/05/2003WO2002069389A3 Semiconductor wafer with process control modules
06/05/2003WO2002063321A3 Test circuitry of an integrated circuit comprising only one selection element for each signal path
06/05/2003WO2002062111A3 Apparatus and method for atmospheric pressure reactive atom plasma processing for surface modification
06/05/2003WO2002061443A9 Nickel alloy probe card frame laminate
06/05/2003WO2002058112A9 Copper diffusion barriers
06/05/2003WO2002054491A3 Cu-pad/bonded/cu-wire with self-passivating cu-alloys
06/05/2003WO2002054483A3 A dual damascene integration scheme using a bilayer interlevel dielectric
06/05/2003WO2002051741A3 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
06/05/2003WO2002045166A3 Method for eliminating crack damage at interfaces in integrated circuits
06/05/2003WO2002045155A3 ELECTROLESS METHOD OF SEED LAYER DEPOSITION, REPAIR, AND FABRICATION OF Cu INTERCONNECTS
06/05/2003WO2002045142A3 Copper alloy interconnections for integrated circuits and methods of making same
06/05/2003WO2002037570A3 Semiconductor device and method of making same
06/05/2003WO2002032589A3 Porous layers and method for production thereof by means of spin-coating
06/05/2003WO2002021241A3 Circuit arrangement and a method for detecting an undesired attack on an integrated circuit
06/05/2003US20030106047 Program conversion system and semiconductor device developing system
06/05/2003US20030106037 Method for fabricating a semiconductor device
06/05/2003US20030106036 Wiring route determining apparatus, group determining apparatus, wiring route determining program storing medium and group determining program storing medium
06/05/2003US20030106028 Method for adding redundant vias on VLSI chips
06/05/2003US20030106027 Method for adding redundant vias on VLSI chips
06/05/2003US20030106002 Scan path circuit, integrated circuit, and integrated circuit checking method
06/05/2003US20030105991 Method for testing functional circuit block
06/05/2003US20030105949 Apparatus, method, system and executable module for configuration and operation of adaptive integrated circuitry having fixed, application specific computational elements
06/05/2003US20030105610 Method and apparatus for determining dot-mark-forming position of semiconductor wafer
06/05/2003US20030105547 System and method for modifying enclosed areas for ion beam and laser beam bias effects
06/05/2003US20030105264 Organosiloxanes
06/05/2003US20030104959 Chemical solution feeding apparatus and method for preparing slurry
06/05/2003US20030104771 Abraisive cleaning tool for removing contamination
06/05/2003US20030104769 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
06/05/2003US20030104766 Abrasive machine and method of abrading work piece
06/05/2003US20030104765 Resin diamond blade and optical waveguide manufacturing method using the blade
06/05/2003US20030104762 Polishing method and electropolishing apparatus
06/05/2003US20030104761 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
06/05/2003US20030104760 Optical monitoring in a two-step chemical mechanical polishing process
06/05/2003US20030104710 Gate dielectric and method
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