Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/05/2003US20030102904 Semiconductor integrated circuit device
06/05/2003US20030102903 Voltage supply circuit
06/05/2003US20030102902 Semiconductor integrated circuit
06/05/2003US20030102898 Semiconductor integrated circuit with reduced leakage current
06/05/2003US20030102888 Input buffer circuit
06/05/2003US20030102886 Integrated series schottky and FET to allow negative drain voltage
06/05/2003US20030102885 Semiconductor integrated circuit and method for testing the same
06/05/2003US20030102882 Test apparatuses for semiconductor integrated circuits
06/05/2003US20030102881 Method and apparatus for reducing the current consumption of an electronic circuit
06/05/2003US20030102880 Semiconductor-device inspecting apparatus and a method for manufacturing the same
06/05/2003US20030102855 Supply voltage level detector
06/05/2003US20030102853 Complementary electronic system for lowering electric power consumption
06/05/2003US20030102811 Plasma coil
06/05/2003US20030102792 Lamp design
06/05/2003US20030102724 Single motor, multi-axis stage
06/05/2003US20030102682 Suction holding device
06/05/2003US20030102603 Molding of protective caps
06/05/2003US20030102587 Compression molding machine
06/05/2003US20030102577 Method of definition of two self-aligned areas at the upper surface of a substrate
06/05/2003US20030102576 Alignment pattern and method of forming the same
06/05/2003US20030102575 Resin-encapsulated semiconductor device and method for manufacturing the same
06/05/2003US20030102571 Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same
06/05/2003US20030102570 Electronic device and a method of manufacturing the same
06/05/2003US20030102567 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
06/05/2003US20030102566 Stereolithographic method for applying materials to electronic component substrates and resulting structures
06/05/2003US20030102565 Semiconductor integrated circuit device and a method of manufacturing the same
06/05/2003US20030102564 Trench mosfet having implanted drain-drift region and process for manufacturing the same
06/05/2003US20030102563 Semiconductor power device and method of formation
06/05/2003US20030102562 Semiconductor device and method of producing the same
06/05/2003US20030102561 Semiconductor device and method of production thereof
06/05/2003US20030102560 Wafer level package and method for manufacturing the same
06/05/2003US20030102559 Semiconductor substrate with contact pads; testing device
06/05/2003US20030102557 Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same
06/05/2003US20030102556 Semiconductor integrated circuit device
06/05/2003US20030102555 Electronic assembly with sandwiched capacitors and methods of manufacture
06/05/2003US20030102552 In-situ cap and method of fabricating same for an integrated circuit device
06/05/2003US20030102551 Semiconductor device and method for manufacturing
06/05/2003US20030102550 Semiconductor device having a signal lead exposed on the undersurface of a sealing resin with an air gap between the signal lead and a mounting substrate
06/05/2003US20030102548 Member for semiconductor package and semiconductor package using the same, and fabrication method thereof
06/05/2003US20030102547 Semiconductor device and production method thereof
06/05/2003US20030102545 Semiconductor device
06/05/2003US20030102544 Semiconductor module and production method therefor and module for IC cards and the like
06/05/2003US20030102538 Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices
06/05/2003US20030102537 Saw singulated leadless plastic chip carrier
06/05/2003US20030102533 Protection of exposed semiconductor chip using thin polymer coatings
06/05/2003US20030102532 Trimethylammonium fluoride solution to selectively etch a dielectric antireflective coating of silicon oxynitride or silicon oxide layer on tetraethylorthosilicate substrate
06/05/2003US20030102531 Stacked memory cell and process of fabricating same
06/05/2003US20030102530 Semiconductor wafer, method of manufacturing the same and semiconductor device
06/05/2003US20030102529 Diffusion of deterium in semiconductor forming passivation zones
06/05/2003US20030102528 Wafer surface that facilitates particle removal
06/05/2003US20030102525 Semiconductor device for integrated injection logic cell and process for fabricating the same
06/05/2003US20030102524 Low noise microwave transistor based on low carrier velocity dispersion control
06/05/2003US20030102522 Multilayer structure; metal, dielectric, metal layers
06/05/2003US20030102521 Semiconductor device
06/05/2003US20030102518 Finfet SRAM cell using low mobility plane for cell stability and method for forming
06/05/2003US20030102517 Semiconductor device with electrically coupled spiral inductors
06/05/2003US20030102516 Semiconductor device using junction leak current and its manufacture method
06/05/2003US20030102515 Memory cell arrays
06/05/2003US20030102514 Static random access memory and semiconductor device using mos transistors having channel region electrically connected with gate
06/05/2003US20030102512 Vertical bipolar transistor formed using CMOS processes
06/05/2003US20030102511 CMOS buffer circuit
06/05/2003US20030102509 Esd parasitic bipolar transistors with high resistivity regions in the collector
06/05/2003US20030102508 Poly-silicon layer of a thin film transistor and display device having the same
06/05/2003US20030102507 Semiconductor device and method for manufacturing the same
06/05/2003US20030102504 Method of forming different oxide thickness for high voltage transistor and memory cell tunnel dielectric
06/05/2003US20030102503 Polysilicon layers structure and method of forming same
06/05/2003US20030102501 Rhodium-rich integrated circuit capacitor electrode
06/05/2003US20030102500 Ferroelectric capacitor having upper electrode lamination and manufacture thereof
06/05/2003US20030102499 SOI semiconductor device and method of manufacturing the same
06/05/2003US20030102497 Multiple-plane finFET CMOS
06/05/2003US20030102494 Semiconductor device
06/05/2003US20030102492 Metal oxide semiconductor transistor with self-aligned channel implant
06/05/2003US20030102491 Bilayer silicon carbide based barrier
06/05/2003US20030102490 Semiconductor device and its manufacturing method
06/05/2003US20030102486 Semiconductor device with trench gate
06/05/2003US20030102483 Method of manufacturing optical semiconductor device
06/05/2003US20030102482 Strain balanced nitride heterojunction transistors and methods of fabricating strain balanced nitride heterojunction transistors
06/05/2003US20030102480 Semiconductor thin film and semiconductor device
06/05/2003US20030102479 Crystalline silicon thin film transistor panel for LCD and method of fabricating the same
06/05/2003US20030102478 Storage capacitor structure for LCD and OELD panels
06/05/2003US20030102475 Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same
06/05/2003US20030102473 Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate
06/05/2003US20030102472 Organic thin film transistor with siloxane polymer interface
06/05/2003US20030102471 Polymer positioned between semiconductor and barrier dielectric
06/05/2003US20030102469 Lithography patterns
06/05/2003US20030102466 Anisotropic conductive adhesive film
06/05/2003US20030102444 Determinating shape of surface; stamp for transferring electricity charging; fine geometric shapes
06/05/2003US20030102443 Esposure method, electron beam exposure apparatus and fabrication method of electronic device
06/05/2003US20030102440 Method of aligning a wafer in a photolithography process
06/05/2003US20030102438 Magnetic shunt assembly for an exposure apparatus
06/05/2003US20030102385 Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
06/05/2003US20030102358 Stacked chip connection using stand off stitch bonding
06/05/2003US20030102356 Method for producing a heat-conducting connection between two work pieces
06/05/2003US20030102354 Friction stir welding method and component part welded by the method
06/05/2003US20030102299 Ceramic heater
06/05/2003US20030102292 Positioning screen; irradiating with lasers; semiconductor
06/05/2003US20030102285 Resist pattern thickening material, resist pattern and forming method thereof, and semiconductor device and manufacturing method thereof
06/05/2003US20030102249 Method and apparatus for an air-cavity package
06/05/2003US20030102223 Electrolysis; forming multilayer substrates; controlling current density
06/05/2003US20030102208 Low pressure ionization; using magnet
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