Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/10/2003US6576515 Method of forming transistor gate
06/10/2003US6576514 Method of forming a three-dimensional polysilicon layer on a semiconductor wafer
06/10/2003US6576513 Nand-type flash memory device and method of forming the same
06/10/2003US6576512 Method of manufacturing an EEPROM device
06/10/2003US6576511 Method for forming nitride read only memory
06/10/2003US6576510 Method of producing a semiconductor memory device using a self-alignment process
06/10/2003US6576509 Semiconductor integrated circuit device and method of manufacturing the same
06/10/2003US6576508 Formation of a frontside contact on silicon-on-insulator substrate
06/10/2003US6576507 Selectively removable filler layer for BiCMOS process
06/10/2003US6576506 Electrostatic discharge protection in double diffused MOS transistors
06/10/2003US6576505 Method for transferring and stacking of semiconductor devices
06/10/2003US6576502 Method for forming LDD/offset structure of thin film transistor
06/10/2003US6576501 Double side polished wafers having external gettering sites, and method of producing same
06/10/2003US6576500 Method of plasma-processing a board, chip attachment to the board and resin encapsulation of the chip
06/10/2003US6576499 Electronic device assembly and a method of connecting electronic devices constituting the same
06/10/2003US6576496 Method and apparatus for encapsulating a multi-chip substrate array
06/10/2003US6576495 Microelectronic assembly with pre-disposed fill material and associated method of manufacture
06/10/2003US6576494 Recessed encapsulated microelectronic devices and methods for formation
06/10/2003US6576493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
06/10/2003US6576490 Method for micro-fabricating a pixelless infrared imaging device
06/10/2003US6576487 Method to distinguish an STI outer edge current component with an STI normal current component
06/10/2003US6576486 Unlanded process in semiconductor manufacture
06/10/2003US6576485 Contact structure and production method thereof and probe contact assembly using same
06/10/2003US6576483 Backside cannelure to provide for wafer shift detection
06/10/2003US6576482 One step deposition process for the top electrode and hardmask in a ferroelectric memory cell
06/10/2003US6576481 Method of manufacturing semiconductor devices
06/10/2003US6576479 Method for forming vertical ferroelectric capacitor comprising forming ferroelectric material in gap between electrodes
06/10/2003US6576408 Thermosetting anti-reflective coatings comprising aryl urethanes of hydroxypropyl cellulose
06/10/2003US6576405 High aspect ratio photolithographic method for high energy implantation
06/10/2003US6576404 Carbon-doped hard mask and method of passivating structures during semiconductor device fabrication
06/10/2003US6576403 Method for forming a thin film transistor with a lightly doped drain structure
06/10/2003US6576398 Pattern formation material and method
06/10/2003US6576394 Negative-acting chemically amplified photoresist composition
06/10/2003US6576393 Composition for resist underlayer film and method for producing the same
06/10/2003US6576381 Semiconductor device
06/10/2003US6576380 Extreme ultraviolet soft x-ray projection lithographic method and mask devices
06/10/2003US6576379 Phaseshift mask and manufacturing the same
06/10/2003US6576377 Photo mask pattern designing method, resist pattern fabricating method and semiconductor device manufacturing method
06/10/2003US6576375 Chromium and chromium oxide laminate, antireflective film
06/10/2003US6576374 Mask blank and method of fabricating phase shift mask from the same
06/10/2003US6576345 Dielectric films with low dielectric constants
06/10/2003US6576334 Bonding materials
06/10/2003US6576318 Method to fabricate smooth-surfaced crystalline phase-change layer for atomic resolution storage device
06/10/2003US6576301 Micromachining tool over the first abrasive layer, irradiating a beam of electrothermal energy to form a deposition pattern thereon, depositing conductive material in the deposition pattern forming a horizontal portion of the contactor
06/10/2003US6576300 High modulus, low dielectric constant coatings
06/10/2003US6576293 Method to improve copper thin film adhesion to metal nitride substrates by the addition of water
06/10/2003US6576292 Method of forming highly adhesive copper thin films on metal nitride substrates via CVD
06/10/2003US6576288 Resin film forming method and resin film forming apparatus employing said method
06/10/2003US6576202 Highly efficient compact capacitance coupled plasma reactor/generator and method
06/10/2003US6576178 Resin sealing apparatus and resin sealing method
06/10/2003US6576152 Dry etching method
06/10/2003US6576151 Etching of silicon nitride by anhydrous halogen gas
06/10/2003US6576149 Method and device for parting laminated substrate for liquid crystal cell
06/10/2003US6576147 Method of layout compaction
06/10/2003US6576138 Method for purifying semiconductor gases
06/10/2003US6576113 Method of electroplating of high aspect ratio metal structures into semiconductors
06/10/2003US6576110 Use with metal film plating; having a planar electric field generating portion coated with an inert material such as tantalum that is impervious to electrolyte solution and an electrolyte solution chemical reaction portion
06/10/2003US6576081 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A
06/10/2003US6576073 Adhesive control during stiffener attachment to provide co-planarity in flip chip packages
06/10/2003US6576066 Supercritical drying method and supercritical drying apparatus
06/10/2003US6576065 Grasping element for placement and removal
06/10/2003US6576064 Support apparatus for semiconductor wafer processing
06/10/2003US6576063 Apparatus and method for use in manufacturing a semiconductor device
06/10/2003US6576061 Apparatus and method for processing a substrate
06/10/2003US6576060 Protective gas shield apparatus
06/10/2003US6576057 Method and apparatus for application of spray adhesive to a leadframe for chip bonding
06/10/2003US6576055 Method and apparatus for controlling air over a spinning microelectronic substrate
06/10/2003US6576053 Method of forming thin film using atomic layer deposition method
06/10/2003US6575825 CMP polishing pad
06/10/2003US6575820 Chemical mechanical polishing apparatus
06/10/2003US6575739 Configurable wafer furnace
06/10/2003US6575737 A transfer chamber is provided. The transfer chamber has a temperature adjustment plate located in an upper portion of the chamber, a substrate handler located in a lower portion of the chamber, and a rotatable substrate carriage adapted so
06/10/2003US6575691 Transfer arm
06/10/2003US6575689 Automated semiconductor immersion processing system
06/10/2003US6575687 Wafer transport system
06/10/2003US6575622 Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using an in-situ wafer temperature optical probe
06/10/2003US6575351 Work/head positioning apparatus for ball mount apparatus
06/10/2003US6575348 Wire bonding apparatus with spurious vibration suppressing structure
06/10/2003US6575185 Collapsible structures
06/10/2003US6575178 Cleaning and drying method and apparatus
06/10/2003US6575177 Semiconductor substrate cleaning system
06/10/2003US6575035 Apparatus and method for measuring internal stress of reticle membrane
06/10/2003US6574862 Method for coupling PCB sheet
06/10/2003US6574860 Forming printed circuits from pastes for protective coatings
06/10/2003US6574859 Interconnection process for module assembly and rework
06/10/2003US6574858 Method of manufacturing a chip package
06/10/2003US6574857 Assembly device
06/10/2003CA2234031C Dual-walled exhaust tube for vacuum pump
06/10/2003CA2133082C Integrated micromechanical sensor element
06/05/2003WO2003047325A1 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/05/2003WO2003047312A1 Ceramic heater
06/05/2003WO2003047306A2 Radial power megasonic transducer
06/05/2003WO2003047163A2 Semiconductor device having a byte-erasable eeprom memory
06/05/2003WO2003047075A1 Linear motor armature and linear motor
06/05/2003WO2003047037A2 Fabrication of a high resolution biological molecule detection device with aluminum electrical conductors
06/05/2003WO2003047004A1 Semiconductor texturing process
06/05/2003WO2003047001A1 Self-alignment of seperated regions in a lateral mosfet structure of an integrated circuit
06/05/2003WO2003047000A1 Semiconductor device and production method therefor
06/05/2003WO2003046999A1 Semiconductor device and manufacturing method thereof
06/05/2003WO2003046998A1 High temperature processing compatible metal gate electrode for pfets and method for fabrication
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