Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/17/2003US6578893 Apparatus and methods for handling semiconductor wafers
06/17/2003US6578891 Substrate holder and substrate transfer apparatus using the same
06/17/2003US6578853 Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same
06/17/2003US6578772 Removes air bubbles by filtering the resist solution to prevent the occurrence of air bubbles
06/17/2003US6578755 Polymer collar for solder bumps
06/17/2003US6578753 Ultrasonic transducer for a bonding apparatus and method for manufacturing the same
06/17/2003US6578703 Magnetic latch transport loader
06/17/2003US6578600 Gas handling devices that are capable of supplying, evacuating and purging a process gas and are also capable of handling multiple process gases in a single gas handling device
06/17/2003US6578592 System that cleans semiconductor wafers with a chemical liquid or pure water to clean the wafers of contaminants including organic contaminants and metallic impurities
06/17/2003US6578589 Apparatus for manufacturing semiconductor wafer
06/17/2003US6578588 Unified strip/cleaning apparatus
06/17/2003US6578567 Wafer sawing apparatus
06/17/2003US6578515 Film formation apparatus comprising movable gas introduction members
06/17/2003US6578514 Modular device of tubular plasma source
06/17/2003US6578458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
06/17/2003US6578423 Acoustic detection of dechucking and apparatus therefor
06/17/2003US6578369 Process fluids are dispensed through a nozzle including a plurality of divergent orifices, particularly useful for efficiently generating a cryogenic aerosol
06/17/2003US6578287 Substrate cooling system and method
06/17/2003US6578264 Method for constructing a membrane probe using a depression
06/17/2003CA2285393C Device for conveying substrates through a substrate processing plant
06/17/2003CA2157033C Device for lacquering or coating of plates or disks
06/12/2003WO2003049513A1 Electric circuit module and method for its assembly
06/12/2003WO2003049512A1 Ball grid array package
06/12/2003WO2003049482A1 Optimizing data transfer in radio system
06/12/2003WO2003049201A1 Method of making thin silicon sheets for solar cells
06/12/2003WO2003049196A1 Nonvolatile semiconductor storage and its manufacturing method
06/12/2003WO2003049193A1 Strain balanced nitride heterojunction transistors and methods of fabricating strain balanced nitride heterojunction transistors
06/12/2003WO2003049192A1 Bipolar transistor and method for producing the same
06/12/2003WO2003049191A2 Bicmos structure, method for producing the same and bipolar transistor for a bicmos structure
06/12/2003WO2003049189A1 Pasted wafer and method for producing pasted wafer
06/12/2003WO2003049188A1 Semiconductor integrated circuit device and manufacturing method thereof
06/12/2003WO2003049186A2 Transistor metal gate structure that minimizes non-planarity effects and method of formation
06/12/2003WO2003049184A1 Semiconductor device and method for manufacturing the same
06/12/2003WO2003049182A2 Process for optically erasing charge buildup during fabrication of an integrated circuit
06/12/2003WO2003049181A1 Device for temporariily loading, keeping and unloading a container
06/12/2003WO2003049180A1 Electrostatic clampless holder module and cooling system
06/12/2003WO2003049179A1 Probe device and probe method
06/12/2003WO2003049178A2 Semiconductor power device metal structure and method of formation
06/12/2003WO2003049177A2 Method and device for encapsulating electronic components while exerting fluid pressure
06/12/2003WO2003049176A2 Method for defining a source and a drain and a gap inbetween
06/12/2003WO2003049173A1 Nitriding method for insulation film, semiconductor device and production method for semiconductor device, substrate treating device and substrate treating method
06/12/2003WO2003049172A1 Lanthanide series layered superlattice materials for integrated circuit applications
06/12/2003WO2003049171A1 Exhaust ring mechanism, and plasma treatment device using the exhaust ring mechanism
06/12/2003WO2003049169A1 Plasma etching method and plasma etching device
06/12/2003WO2003049167A1 Method of high pressure treatment
06/12/2003WO2003049166A1 Method and device for measuring film layer state, polishing device, and method of manufacturing semiconductor device
06/12/2003WO2003049165A1 Method of manufacturing optical device, and optical device
06/12/2003WO2003049164A1 Production method for semiconductor chip
06/12/2003WO2003049163A1 Method for suppressing transient enhanced diffusion of dopants in silicon
06/12/2003WO2003049161A1 Interconnects with improved barrier layer adhesion
06/12/2003WO2003049160A2 Method of producing integrated semiconductor components on a semiconductor substrate
06/12/2003WO2003049159A2 Methods of forming capacitors and methods of forming capacitor dielectric layers
06/12/2003WO2003049158A1 Arrangement comprising a capacitor
06/12/2003WO2003049157A1 Transfer member with electric conductivity and its manufacturing method
06/12/2003WO2003049156A2 System and method for micro electro mechanical etching
06/12/2003WO2003049155A1 System and method for laser micro- machining
06/12/2003WO2003049154A2 Integrated circuit processing system
06/12/2003WO2003049153A2 On chip smart capacitors
06/12/2003WO2003049147A2 Integrated circuits including metal oxide and hydrogen barrier layers and their method of fabrication
06/12/2003WO2003049142A1 Uniformity control for plasma doping systems
06/12/2003WO2003049140A1 Optical particle corrector
06/12/2003WO2003049134A1 Electron emitter, cold-cathode field electron emitter, and method for manufacturing cold-cathode field electron emission display
06/12/2003WO2003049121A1 Low voltage operation of static random access memory
06/12/2003WO2003049120A2 Magnetoresistive memory cell comprising a dynamic reference layer
06/12/2003WO2003048981A2 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid
06/12/2003WO2003048949A1 System for configuration and operation of adaptive integrated circuitry having fixed, application specific computational elements
06/12/2003WO2003048866A1 Composition for releasing a resist and method for manufacturing semiconductor device using the same
06/12/2003WO2003048865A1 Method for forming fine resist pattern
06/12/2003WO2003048864A1 Mask forming method and removing method, and semi-conductor device, electric circuit, display module, color filter and light emitting element produced by the techniques
06/12/2003WO2003048863A1 Positive resist composition and method of forming resist pattern
06/12/2003WO2003048862A1 Positive resist composition and method of forming resist pattern
06/12/2003WO2003048861A1 Positive resist composition and method of forming resist pattern from the same
06/12/2003WO2003048857A1 Photolithographic critical dimension control using reticle measurements
06/12/2003WO2003048839A1 Homogenizer
06/12/2003WO2003048788A1 Contact structure and production method thereof and probe contact assembly using same
06/12/2003WO2003048752A1 X-ray topographic system
06/12/2003WO2003048681A1 Compensating for effects of non-isotropics gas mixtures in interferometers
06/12/2003WO2003048680A1 A method of alignment by using interferometry
06/12/2003WO2003048430A1 Device and method for producing, removing or treating layers on a substrate
06/12/2003WO2003048429A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
06/12/2003WO2003048423A1 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
06/12/2003WO2003048414A1 Chemical vapor deposition reactor
06/12/2003WO2003048413A1 Mixer, and device and method for manufacturing thin-film
06/12/2003WO2003048412A1 Chemical vapor deposition vaporizer
06/12/2003WO2003048407A1 Gcib processing to improve interconnection vias and improved interconnection via
06/12/2003WO2003048012A1 Substrate processing apparatus with independently configurable integral load locks
06/12/2003WO2003047820A1 Scalar type robot for carrying flat plate-like object, and flat plate-like object processing system
06/12/2003WO2003047735A1 High flow rate bubbler system and method
06/12/2003WO2003035926A3 Improved precursors for chemical vapour deposition
06/12/2003WO2003025998A3 Method of forming a bond pad and structure thereof
06/12/2003WO2002099840A3 Inductively-coupled plasma processing system
06/12/2003WO2002097871A3 Structure and method for fabricating semiconductor devices
06/12/2003WO2002089538A3 Finned heat sink assemblies
06/12/2003WO2002061834A3 Electronic part
06/12/2003WO2002059944A8 Optimized liners for dual damascene metal wiring
06/12/2003WO2002041367B1 Self-aligned magnetic clad write line and method thereof
06/12/2003WO2001090446A3 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
06/12/2003US20030110461 Method and apparatus for laying out power supply wiring
06/12/2003US20030110411 Flash EEprom system
06/12/2003US20030109966 Semiconductor integrated circuit device