Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/19/2003US20030111708 Semiconductor devices and methods of fabricating the same
06/19/2003US20030111707 Semiconductor integrated circuit device
06/19/2003US20030111706 Power divider
06/19/2003US20030111704 Intrinsic layer is fully enclosed, and would minimize or eliminate leakage paths through the intrinsic layer
06/19/2003US20030111702 Eeprom cell array structure with specific floating gate shape
06/19/2003US20030111699 Methods and apparatus for inducing stress in a semiconductor device
06/19/2003US20030111696 Mask ROM cell and method of fabricating the same
06/19/2003US20030111695 Semiconductor memory device with a silicide layer formed on regions other than source regions
06/19/2003US20030111694 Semiconductor circuit
06/19/2003US20030111693 Body contact silicon-on-insulator transistor and method
06/19/2003US20030111691 CMOS thin film transistor and method of manufacturing the same
06/19/2003US20030111690 Semiconductor device and method of manufacturing the same
06/19/2003US20030111689 Using drain-extension technique for siliciding which avoids deterioration of lightly doped region of the source and drain diffusion regions
06/19/2003US20030111688 Semiconductor device and method of manufacturing the same
06/19/2003US20030111686 Method for forming asymmetric dual gate transistor
06/19/2003US20030111685 Non-volatile semiconductor memory device and manufacturing method thereof
06/19/2003US20030111684 Semiconductor devices and methods for fabricating the same
06/19/2003US20030111683 Method of fabricating transistor
06/19/2003US20030111682 Nonvolatile memory and processing system
06/19/2003US20030111681 Semiconductor memory device and its manufacturing method
06/19/2003US20030111680 Methods of forming memory cells, and memory cell arrays
06/19/2003US20030111678 CVD deposition of M-SION gate dielectrics
06/19/2003US20030111672 Non-volatile memory and method of forming thereof
06/19/2003US20030111671 A composite dummy electrode for use in flash memory, capable of further reducing a level difference produced on the top surface of an interlayer dielectric film formed on the top sides of the memory cell and the peripheral circuit sections
06/19/2003US20030111670 Method and system for molecular charge storage field effect transistor
06/19/2003US20030111668 Method of manufacturing semiconductor device including steps of forming groove and recess, and semiconductor device
06/19/2003US20030111665 Method of forming three-dimensional photonic band structures in solid materials
06/19/2003US20030111664 Semiconductor device
06/19/2003US20030111663 Thin film transistor and display device having the same
06/19/2003US20030111662 H:SiOC coated substrates
06/19/2003US20030111626 Magnetic memory device having magnetic shield layer, and manufacturing method thereof
06/19/2003US20030111619 Electron beam exposure apparatus and exposing method using an electron beam
06/19/2003US20030111618 Methods and devices for detecting a distribution of charged-particle density of a charged-particle beam in charged-particle-beam microlithography systems
06/19/2003US20030111617 Wafer pedestal tilt mechanism
06/19/2003US20030111614 Stage devices including linear motors that produce reduced beam-perturbing stray magnetic fields, and charged-particle-beam microlithography systems comprising same
06/19/2003US20030111613 Corrector for correcting first-order chromatic aberrations of the first degree
06/19/2003US20030111519 Fluxing compositions
06/19/2003US20030111516 Integrated quantum cold point coolers
06/19/2003US20030111458 Temperature adjusting system in exposure apparatus
06/19/2003US20030111447 Method and apparatus for repair of defects in materials with short laser pulses
06/19/2003US20030111440 Method of fabricating and a device that includes nanosize pores having well controlled geometries
06/19/2003US20030111439 Method of forming tapered electrodes for electronic devices
06/19/2003US20030111438 Process operation supplementation with oxygen
06/19/2003US20030111437 Process for packaging electronic devices using thin bonding regions
06/19/2003US20030111354 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte
06/19/2003US20030111263 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
06/19/2003US20030111180 Plasma etching apparatus
06/19/2003US20030111178 Diaphragm valve, substrate processing unit and substrate processing apparatus
06/19/2003US20030111177 Substrate receiving apparatus and method thereof
06/19/2003US20030111176 Apparatus for polishing semiconductor wafer
06/19/2003US20030111174 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination
06/19/2003US20030111154 Automated method of attaching flip chip devices to a substrate
06/19/2003US20030111105 Sheet manufacturing method, sheet, sheet manufacturing apparatus, and solar cell
06/19/2003US20030111098 An additional antifoaming agent supplying unit is operatively associated with the stripper storing unit for dispensing an antifoam agent
06/19/2003US20030111092 Placing a wafer having an edge in a process tank having a lid, closing the lid, filling the tank with a process liquid to a predetermined level below the edge of the wafer, applying acoustic energy to form a mist of process liquid
06/19/2003US20030111015 Reaction chamber with at least one HF feedthrough
06/19/2003US20030111014 Vaporizer/delivery vessel for volatile/thermally sensitive solid and liquid compounds
06/19/2003US20030111009 Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
06/19/2003US20030111008 Method for the epitaxy of (indium, aluminum, gallium) nitride on foreign substrates
06/19/2003US20030111007 Method for vaporizing and supplying
06/19/2003US20030110878 Conveying device
06/19/2003US20030110788 Method and apparatus for cooling an integrated circuit package using a cooling fluid
06/19/2003US20030110711 Polishing composition
06/19/2003US20030110658 Apparatus for monitoring a semiconductor wafer during a spin drying operation
06/19/2003US20030110649 Automatic calibration method for substrate carrier handling robot and jig for performing the method
06/19/2003US20030110629 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
06/19/2003US20030110628 Method for connection of circuit units
06/19/2003US20030110626 Method of locating conductive spheres utilizing screen and hopper of solder balls
06/19/2003US20030110625 Method of manufacturing multi-chip stacking package
06/19/2003US20030110623 Electronic component mounting apparatus and electronic component mounting method
06/19/2003US20030110622 Semiconductor device and method for producing the same, and anisotropic conductive circuit board
06/19/2003US20030110611 Method and apparatus for alignment of carriers, carrier handlers and semiconductor handling equipment
06/19/2003US20030110608 Pressing kit for substrate or lead frame of a semiconductor packaging
06/18/2003EP1320132A2 Continous antifuse material in memory structure
06/18/2003EP1320130A2 Semiconductor device and manufcaturing method thereof
06/18/2003EP1320129A1 Semiconductor electronic device and method of manufacturing thereof.
06/18/2003EP1320128A1 Method for making interconnect structures
06/18/2003EP1320127A2 Oxynitride device and method using non-stoichiometric silicon oxide
06/18/2003EP1320126A2 Method for dicing a semiconductor wafer using U-grooves
06/18/2003EP1320125A2 Seed layer processes for mocvd of ferroelectric thin films on high-K gate oxides
06/18/2003EP1320124A1 Method of determining heat treatment conditions
06/18/2003EP1320123A1 Manufacturing process of an electronic device comprising an inductive micro component
06/18/2003EP1320121A2 Semiconductor wafer transport method and apparatus
06/18/2003EP1320104A1 Magnetic memory device and manufacturing method thereof
06/18/2003EP1320102A2 Magnetic random access memory and method of operating the same
06/18/2003EP1319988A2 High luminosity source for EUV lithography
06/18/2003EP1319983A2 Advanced illumination system for use in microlithography
06/18/2003EP1319982A1 Lithographic apparatus , device manufacturing method, and computer program
06/18/2003EP1319732A1 Film formation apparatus and method and cleaning method
06/18/2003EP1319257A2 Magnetic layer system and a component comprising such a layer system
06/18/2003EP1319254A2 Method for producing a semiconductor-metal contact through a dielectric layer
06/18/2003EP1319252A2 Semiconductor device and method of forming a semiconductor device
06/18/2003EP1319249A2 Module, especially a wafer module
06/18/2003EP1319248A2 Control of separation between gate and storage node in vertical dram
06/18/2003EP1319247A2 Correction of overlay offset between inspection layers in integrated circuits
06/18/2003EP1319246A2 Reduced capacitance scaled hbt using a separate base post layer
06/18/2003EP1319245A2 Highly efficient capacitor structures with enhanced matching properties
06/18/2003EP1319243A2 Double dual slot load lock for process equipment
06/18/2003EP1319242A1 Damascene double gated transistors and related manufacturing methods
06/18/2003EP1319239A2 Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto
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