Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/03/2003WO2003054632A1 Method and apparatus for image formation
07/03/2003WO2003054631A1 Method for optimizing the imaging characteristics of at least two optical elements and photolithographic production process
07/03/2003WO2003054628A1 A low-cost lithography
07/03/2003WO2003054622A1 Thin film transistor substrate for liquid crystal display (lcd) and method of manufacturing the same
07/03/2003WO2003054564A2 Probe card covering system and method
07/03/2003WO2003054256A2 Method and device for depositing crystalline layers on crystalline substrates
07/03/2003WO2003054255A1 Electrolytic processing apparatus and method
07/03/2003WO2003054247A2 Cleaning gas composition for semiconductor production equipment and cleaning method using the gas
07/03/2003WO2003054097A1 Polishing pad
07/03/2003WO2003053844A1 Method and device for producing a component with a mobile structure
07/03/2003WO2003053791A2 Apparatus and method for monitoring environment within a container
07/03/2003WO2003053673A1 Semiconductor with coordinatively irregular structures
07/03/2003WO2003053633A1 Air platen for leading edge and trailing edge control
07/03/2003WO2003053602A1 Copper polishing cleaning solution
07/03/2003WO2003036686A3 Method of patterning electrically conductive polymers
07/03/2003WO2003032434B1 Plasma production device and method and rf driver circuit
07/03/2003WO2003032398A3 Field effect transistor having periodically doped channel
07/03/2003WO2003031096A3 Patterned structure reproduction using nonsticking mold
07/03/2003WO2003007336A3 Wafer boat with arcuate wafer support arms
07/03/2003WO2002103337A3 Electron beam apparatus and method for using said apparatus
07/03/2003WO2002097889B1 Semiconductor device and a method therefor
07/03/2003WO2002091451A3 Methods of forming gap fill and layers formed thereby
07/03/2003WO2002088413B1 Sputter targets comprising ti and zr
07/03/2003WO2002075329A3 Support member assembly for electroconductive contact members
07/03/2003WO2002056364A8 Conductor reservoir volume for integrated circuit interconnects
07/03/2003US20030126582 Pattern correction method and manufacturing method of semiconductor device
07/03/2003US20030126581 User interface for a network-based mask defect printability analysis system
07/03/2003US20030126579 Digital design using selection operations
07/03/2003US20030126567 Apparatus, method and pattern for evaluating semiconductor device characteristics
07/03/2003US20030126566 Method for inspecting accuracy in stitching pattern elements using CAD or pattern reference data
07/03/2003US20030126563 Method for designing a system LSI
07/03/2003US20030126534 Distributed interface for parallel testing of multiple devices using a single tester channel
07/03/2003US20030125920 LSI design verification apparatus, LSI design verification method, and LSI design verification program
07/03/2003US20030125903 Method and system for statistical comparison of a plurality of testers
07/03/2003US20030125851 Automotive code reader
07/03/2003US20030125832 System, process, apparatus and program for controlling special lot carrying in semiconductor carrying facility
07/03/2003US20030125511 For semiconductors; high transmittance; improved dry etching resistance, adhesiveness, and wettability
07/03/2003US20030125184 Glass ceramic product with variably adjustable zero crossing of the CTE-T curve
07/03/2003US20030124960 Polishing method
07/03/2003US20030124959 Method for copper CMP using polymeric complexing agents
07/03/2003US20030124957 Substrate polishing apparatus
07/03/2003US20030124878 Wafer drying method
07/03/2003US20030124877 Method of heat-treating nitride compound semiconductor layer and method of producing semiconductor device
07/03/2003US20030124876 Apparatus and method for use in manufacturing a semiconductor device
07/03/2003US20030124875 Method for forming dielectric film of capacitor
07/03/2003US20030124874 Method of forming low dielectric constant insulation film for semiconductor device
07/03/2003US20030124873 Method of annealing an oxide film
07/03/2003US20030124872 Combined gate cap or digit line and spacer deposition using HDP
07/03/2003US20030124871 Interfacial layer for gate electrode and high-k dielectric layer and methods of fabrication
07/03/2003US20030124870 Forming low k dielectric layers
07/03/2003US20030124869 Method of forming emitter tips on a field emission display
07/03/2003US20030124868 Pattern forming method
07/03/2003US20030124867 Solution for ruthenium chemical mechanical planarization
07/03/2003US20030124865 Method for forming pattern using printing process
07/03/2003US20030124864 Semiconductor device and its manufacturing method
07/03/2003US20030124863 Method of forming insulating layer and method of fabricating thin film transistor using the same
07/03/2003US20030124862 Method of polishing copper layer of substrate
07/03/2003US20030124861 Method for manufacturing metal line contact plug semiconductor device
07/03/2003US20030124860 Method for forming metal lines of semiconductor device
07/03/2003US20030124859 Fiber materials of the present invention have been found to be able exhibit superior softness
07/03/2003US20030124858 Fabrication method for semiconductor integrated circuit device
07/03/2003US20030124857 Apparatus for assembling a post-CMP cleaning brush
07/03/2003US20030124856 Methods and apparatus for conditioning and temperature control of a processing surface
07/03/2003US20030124855 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
07/03/2003US20030124854 Method for interconnecting magnetoresistive memory bits
07/03/2003US20030124853 Anisotropic etching method and apparatus
07/03/2003US20030124852 Composition and method for planarizing surfaces
07/03/2003US20030124851 Etching solution for etching Cu and Cu/Ti metal layer of liquid crystal display device and method of fabricating the same
07/03/2003US20030124850 Polishing slurry for use in CMPof SiC series compound, polishing method, and method of manufacturing semiconductor device
07/03/2003US20030124849 Micro corner cube array, method of making the micro corner cube array, and display device
07/03/2003US20030124847 Double pattern and etch of poly with hard mask
07/03/2003US20030124846 Multi-step process for depositing copper seed layer in a via
07/03/2003US20030124845 Local interconnect structures and methods for making the same
07/03/2003US20030124844 Method to form self-aligned silicide with reduced sheet resistance
07/03/2003US20030124843 Forming method of silicide film
07/03/2003US20030124842 Dual-gas delivery system for chemical vapor deposition processes
07/03/2003US20030124841 Method for fabricating semiconductor device
07/03/2003US20030124840 Material deposition from a liquefied gas solution
07/03/2003US20030124839 Process for fabricating a semiconductor device
07/03/2003US20030124838 Method of forming cooper damascene interconnect
07/03/2003US20030124837 Methods of making electromechanical three-trace junction devices
07/03/2003US20030124836 Method to avoid via poisoning in dual damascene process
07/03/2003US20030124835 Integrated chip package structure using silicon substrate and method of manufacturing the same
07/03/2003US20030124834 Method and system of wire bonding for use in fabrication of semiconductor package
07/03/2003US20030124833 Bump fabrication process
07/03/2003US20030124832 Method of making a bump on a substrate without ribbon residue
07/03/2003US20030124831 Method of forming a bump
07/03/2003US20030124830 Semiconductor integrated circuit device and manufacturing method of that
07/03/2003US20030124829 Interconnection method entailing protuberances formed by melting metal over contact areas
07/03/2003US20030124828 System for improving thermal stability of copper damascene structure
07/03/2003US20030124827 System for preventing excess silicon consumption in ultra shallow junctions
07/03/2003US20030124826 Method of manufacturing a transistor in a semiconductor device
07/03/2003US20030124825 Method of forming a gate electrode in a semiconductor device
07/03/2003US20030124824 High yield and high speed CMOS process
07/03/2003US20030124823 System for reducing segregation and diffusion of halo implants into highly doped regions
07/03/2003US20030124822 Method for fabricating semiconductor device with improved refresh characteristics
07/03/2003US20030124821 Versatile system for forming shallow semiconductor device features
07/03/2003US20030124820 Systems and methods for epitaxially depositing films on a semiconductor substrate
07/03/2003US20030124819 Method of manufacturing photovoltaic element and apparatus therefor
07/03/2003US20030124817 Apparatus for fabricating compound semiconductor device
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