Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/08/2003US6589712 Method for forming a passivation layer using polyimide layer as a mask
07/08/2003US6589711 Dual inlaid process using a bilayer resist
07/08/2003US6589709 Exposing or treating the features lithographically patterned on a photoresist layer to a flood electron beam before an etch process which may cause mechanical deformation of the features
07/08/2003US6589707 Photoresist acrylate and norbornene-type monomers having a 1,3,5,7-tetrasilacycloctanyl moiety attached; oxygen etch resistance; high contrast ratio; semiconductors
07/08/2003US6589699 Transparent substrate with a light-shielding film and an antireflective film, both films made of a chromiun oxycarbide, a chromium oxycarbonitride or a combination
07/08/2003US6589644 Low dielectric constant materials and their production and use
07/08/2003US6589611 Forming a material along the sidewalls during the forming of the deposit over the substrate; impacting the material along the sidewalls with the activated species to treat the material and thereby decrease flaking
07/08/2003US6589610 Deposition chamber and method for depositing low dielectric constant films
07/08/2003US6589594 Method for filling a wafer through-via with a conductive material
07/08/2003US6589447 Forming pattern without using resist coating
07/08/2003US6589439 Hydroxylammonium salt
07/08/2003US6589435 Plasma etching method
07/08/2003US6589434 Method for manufacturing 3-D horn antenna using exposure apparatus
07/08/2003US6589414 Electrodepositing material on substrate and selective conversion of conductive portion by exposure to nitrogen-containing plasma; chromium-nitride-comprising diffusion barrier; semiconductors
07/08/2003US6589401 Apparatus for electroplating copper onto semiconductor wafer
07/08/2003US6589398 Pasting method for eliminating flaking during nitride sputtering
07/08/2003US6589386 Device for processing wafer
07/08/2003US6589385 Resist mask for measuring the accuracy of overlaid layers
07/08/2003US6589384 Solventless laminating adhesive with barrier properties
07/08/2003US6589365 Selectively applying a hydrogen peroxide solution onto the metallic member to oxidize the metallic member and to form the oxide film; irradiating a light beam towards the surface of the metallic member to oxidize surface
07/08/2003US6589364 Producing high quality crystal lattice uniformly incorpor-ating germanium and dopant within its structure; hetero-junction bipolar transistor
07/08/2003US6589362 Light emitting element
07/08/2003US6589361 For cleaning substrates, for use in semiconductor manufacturing
07/08/2003US6589360 Drying system for drying semiconductor wafers and method of drying wafers using the same
07/08/2003US6589359 Cleaning method and cleaning apparatus for substrate
07/08/2003US6589356 Method for cleaning a silicon-based substrate without NH4OH vapor damage
07/08/2003US6589354 Method and apparatus for in-situ lithography mask cleaning
07/08/2003US6589352 Self aligning non contact shadow ring process kit
07/08/2003US6589349 Apparatus for forming silicon oxide film and method of forming silicon oxide film
07/08/2003US6589338 Device for processing substrate
07/08/2003US6589337 Method of producing silicon carbide device by cleaning silicon carbide substrate with oxygen gas
07/08/2003US6589336 Production method for silicon epitaxial wafer and silicon epitaxial wafer
07/08/2003US6589335 Relaxed InxGa1-xAs layers integrated with Si
07/08/2003US6589101 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
07/08/2003US6589100 Rare earth salt/oxidizer-based CMP method
07/08/2003US6589099 Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry
07/08/2003US6588854 Nonlot based method for assembling integrated circuit devices
07/08/2003US6588649 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
07/08/2003US6588645 Continuous mode solder jet apparatus
07/08/2003US6588437 System and method for removal of material
07/08/2003US6588308 Rotary cutting blade; chips and associated connecting means, such as connection wires and solder balls which may be bonded to the connecting ends; products are clamped down on a supporting by using a vacuum
07/08/2003US6588232 Treatment device, laser annealing device, manufacturing apparatus, and manufacturing apparatus for flat display device
07/08/2003US6588123 Apparatus and method for preventing a wafer mapping system of an SMIF system from being polluted by corrosive gases remaining on wafers
07/08/2003US6588122 Minimal distance between ultraviolet radiator and substrate while irradiating in translational or rotational movement achieves intense and uniform illumination
07/08/2003US6588121 Vacuum processing apparatus
07/08/2003US6588098 Method for manufacturing an electronic device package
07/08/2003US6588097 Method of manufacturing multilayered ceramic substrate and green ceramic laminate
07/08/2003US6588043 Wafer cascade scrubber
07/08/2003CA2248250C Device for generating powerful microwave plasmas
07/08/2003CA2233616C A method of biaxially aligning crystalline material
07/08/2003CA2104374C Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method
07/03/2003WO2003055287A2 Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression
07/03/2003WO2003054976A1 Boron phosphide-based semiconductor device and production method thereof
07/03/2003WO2003054975A2 Baking oven for photovoltaic devices
07/03/2003WO2003054972A1 Variable capacitor and its manufacturing method
07/03/2003WO2003054971A1 Zener diode, zener diode circuit and method for production of a zener diode
07/03/2003WO2003054969A1 Electrically programmed mos transistor source/drain series resistance
07/03/2003WO2003054968A1 Body-tied silicon on insulator semiconductor device and method therefor
07/03/2003WO2003054966A1 Soi device with different silicon thicknesses
07/03/2003WO2003054965A2 Non-volatile memory and method of forming thereof
07/03/2003WO2003054964A2 Monos device having buried metal silicide bit line
07/03/2003WO2003054963A1 Fabrication of non-volatile memory cell
07/03/2003WO2003054962A1 Complementary mis device
07/03/2003WO2003054957A2 Electronic component and method for producing the same
07/03/2003WO2003054956A1 Chip and wafer integration process using vertical connections
07/03/2003WO2003054955A2 Silicon substrate having an insulating layer with partial regions and a corresponding assembly
07/03/2003WO2003054954A2 Electrical/optical integration scheme using direct copper bonding
07/03/2003WO2003054952A1 Composite spacer liner for improved transistor performance
07/03/2003WO2003054951A1 Semiconductor device comprising a thin oxide liner and method of manufacturing the same
07/03/2003WO2003054950A1 High voltage mos transistor
07/03/2003WO2003054949A1 Substrate processing method and substrate processing apparatus
07/03/2003WO2003054948A1 Nitride offset spacer to minimize silicon recess by using poly reoxidation layer as etch stop layer
07/03/2003WO2003054947A1 Ring mechanism, and plasma processing device using the ring mechanism
07/03/2003WO2003054946A1 A method of improving surface planarity prior to mram bit material deposition
07/03/2003WO2003054945A1 Method for ion beam fine patterning of inorganic multilayer resist, and semiconductor device, quantum device, micromachine component and fine structure manufactured by the method
07/03/2003WO2003054944A1 Novel use of alkaline earth metal salts
07/03/2003WO2003054943A1 Support substrate for thin-sheet work
07/03/2003WO2003054942A2 Method of introducing nitrogen into semiconductor dielectric layers
07/03/2003WO2003054941A1 Plasma treatment apparatus and control method thereof
07/03/2003WO2003054940A1 Plasma treatment apparatus, matching box, impedance matching device, and coupler
07/03/2003WO2003054939A1 Method for depositing iii-v semiconductor layers on a non iii-v substrate
07/03/2003WO2003054937A1 Method for making nitride semiconductor substrate and method for making nitride semiconductor device
07/03/2003WO2003054935A1 Method for fabricating semiconductor device
07/03/2003WO2003054934A1 Integrated semiconductor product comprising a metal-insulator-metal capacitor
07/03/2003WO2003054933A1 Integrated semiconductor product comprising a metal-insulator-metal capacitor
07/03/2003WO2003054932A1 Automatic calibration method for substrate carrier handling robot and jig for performing the method
07/03/2003WO2003054930A2 Device for etching, rinsing and drying substrates in ultra-clean atmosphere
07/03/2003WO2003054929A2 Method for depositing iii-v semiconductor layers on a non-iii-v substrate
07/03/2003WO2003054928A2 Porous low-k dielectric interconnect structures
07/03/2003WO2003054927A2 Structure and process for packaging rf mems and other devices
07/03/2003WO2003054925A2 Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein
07/03/2003WO2003054922A2 Image pick-up device and camera system comprising an image pick-up device
07/03/2003WO2003054921A2 Method for the production of iii-v laser components
07/03/2003WO2003054920A2 Method for the production of led bodies
07/03/2003WO2003054919A2 Method for the production of image sensors
07/03/2003WO2003054912A1 Method and apparatus comprising a magnetic filter for plasma processing a workpiece
07/03/2003WO2003054911A2 Plasma process apparatus
07/03/2003WO2003054886A2 Increased magnetic stability devices suitable for use as sub-micron memories
07/03/2003WO2003054869A1 Substrate treatment device
07/03/2003WO2003054749A1 Scaling method for a digital photolithography system