Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/07/2003US20030146012 Semiconductor chip, chip stack package and manufacturing method
08/07/2003US20030145952 Method and apparatus for producing uniform process rates
08/07/2003US20030145951 Apparatus including chuck and matching box
08/07/2003US20030145950 Workpiece holding mechanism
08/07/2003US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer
08/07/2003US20030145947 Semiconductor device, method of manufacturing the same, manufacturing apparatus for the same, and electronic instrument
08/07/2003US20030145944 Method for fabricating LCD
08/07/2003US20030145943 Applying hot air to bond the webbing portion and the pool cover edge portion, applying pressure at same time, wrapping the webbing around an elongated filler member
08/07/2003US20030145940 Using a cured silicone; plasma treatment
08/07/2003US20030145939 Dual die bonder for a semiconductor device and a method thereof
08/07/2003US20030145902 Gas supply apparatus and gas supply method
08/07/2003US20030145878 Apparatus and method for wet cleaning or etching a flat substrate
08/07/2003US20030145875 Using cleaning compound and ozone vapors ; impregnating semiconductor wafer; removal
08/07/2003US20030145874 Removal liquid from wet semiconductor surfaces
08/07/2003US20030145791 Thermal processing apparatus
08/07/2003US20030145788 Plasma CVD apparatus
08/07/2003US20030145783 Single crystal GaN substrate, method of growing single crystal GaN and method of producing single crystal GaN substrate
08/07/2003US20030145674 Robot
08/07/2003US20030145461 Semiconductor device and method of manufacturing the same
08/07/2003US20030145460 Standoff arrangements to control distance and provide electrical function
08/07/2003US20030145459 Pressurizing method and pressurizing apparatus
08/07/2003US20030145409 Industrial sponge roller device having reduced residuals
08/07/2003DE20214521U1 Production of a semiconductor component used in the production of substrate-less luminescent diodes comprises separating a semiconductor layer from a substrate by irradiating with a laser beam having a plateau-shaped spatial beam profile
08/07/2003CA2474556A1 Enhanced photodetector
08/07/2003CA2473722A1 Cluster packaging of light emitting diodes
08/07/2003CA2473223A1 Charge controlled avalanche photodiode and method of making the same
08/06/2003EP1333501A2 Multi-terminal MOS varactor
08/06/2003EP1333499A2 Integrated circuit device including two types of photodiodes
08/06/2003EP1333494A2 Semiconductor device and method of fabricating a semiconductor assembly
08/06/2003EP1333493A2 Interconnect structure
08/06/2003EP1333490A2 Ball grid array package with patterned stiffener layer
08/06/2003EP1333487A2 System and method for aligning an integrated circuit die on an integrated circuit substrate
08/06/2003EP1333486A2 Semiconductor device having wiring line with hole, and manufacturing method thereof
08/06/2003EP1333485A2 Methods for dicing wafer stacks to provide access to interior structures
08/06/2003EP1333484A2 Interlayer between titanium nitride and high density plasma oxide
08/06/2003EP1333483A1 Method of etching dual damascene structure
08/06/2003EP1333482A2 Method for manufacturing a semiconductor silicon carbide on insulator substrate (SOI) and apparatus therefore
08/06/2003EP1333481A1 Process and device for soldering leads on substrates
08/06/2003EP1333480A2 Transfer molding process for an integrated circuit and pre-formed release film for use in this process
08/06/2003EP1333479A1 Channel write/erase flash memory cell and its manufacturing method
08/06/2003EP1333478A1 Method for manufacturing gallium nitride compound semiconductor element and gallium nitride compound semiconductor element
08/06/2003EP1333477A2 Use of fluorinated additives in the etching or polishing of integrated circuits
08/06/2003EP1333476A2 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
08/06/2003EP1333475A1 Method for manufacturing semiconductor device, substrate treater, and substrate treatment system
08/06/2003EP1333474A2 A method for forming a deep trench in a semiconductor substrate
08/06/2003EP1333473A1 Interpoly dielectric manufacturing process for non volatile semiconductor memories
08/06/2003EP1333472A2 Method for forming a cavity in a monocrystalline silicon substrate and semiconductor device with a cavity in a monocrystalline silicon substrate with an epitaxial cover layer
08/06/2003EP1333471A2 FeRam capacitor stack etch
08/06/2003EP1333470A1 Integrated capacitor having a silicon electrode and a method of forming the capacitor
08/06/2003EP1333469A1 Storage chamber, valve for evacuating gas and method of providing gas
08/06/2003EP1333468A2 Stage device and angle detecting device
08/06/2003EP1333466A2 Exposure apparatus, control method thereof, and device manufacturing method
08/06/2003EP1333444A1 Two transistor ferroelectric non-volatile memory
08/06/2003EP1333328A2 Plasma light source apparatus, exposure apparatus and its control method and device fabrication method
08/06/2003EP1333327A2 Stage system
08/06/2003EP1333324A2 Nano-size imprinting stamp
08/06/2003EP1333263A1 Device for carrying out a pull-test
08/06/2003EP1333224A2 Gas supply apparatus and gas supply method
08/06/2003EP1333111A1 Method for producing crystal thin plate and solar cell comprising crystal thin plate
08/06/2003EP1333080A2 Aqueous disperson containing silicon dioxide powder, coated with cerium oxide, process for its preparation and its use
08/06/2003EP1333050A1 Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same
08/06/2003EP1333008A2 Systems and methods for thermal isolation of a silicon structure
08/06/2003EP1332803A1 Chemical treating apparatus
08/06/2003EP1332653A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
08/06/2003EP1332652A2 Mechanism for prevention of neutron radiation in ion implanter beamline
08/06/2003EP1332517A1 Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials
08/06/2003EP1332516A1 Method for applying a substrate
08/06/2003EP1332515A2 Infrared end-point system for cmp
08/06/2003EP1332512A2 Ion beam deposition targets having an interlocking interface and a replaceable insert
08/06/2003EP1332502A2 Method for testing integrated circuits
08/06/2003EP1332499A2 Magnetoresistive memory (mram)
08/06/2003EP1332498A2 An analog functional module using magnetoresistive memory technology
08/06/2003EP1332407A1 Method for exposing a semiconductor wafer
08/06/2003EP1332406A2 Photoacid generators in photoresist compositions for microlithography
08/06/2003EP1332349A2 Automated processing system
08/06/2003EP1332330A1 Determination of center of focus by diffraction signature analysis
08/06/2003EP1332247A1 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation
08/06/2003EP1332243A2 Method and apparatus for electrodeposition or etching of uniform films with minimal edge exclusion on substrate
08/06/2003EP1332241A1 Electrostatically clamped edge ring for plasma processing
08/06/2003EP1332239A1 Deposition of thin films by laser ablation
08/06/2003EP1332119A1 Surface contouring by controlled application of processing fluid using marangoni effect
08/06/2003EP1332117A2 Glass member resistant to plasma corrosion
08/06/2003EP1332039A2 Device for sintering, removing material and/or labeling by means of electromagnetically bundled radiation and method for operating the device
08/06/2003EP1332008A2 Wafer container washing apparatus
08/06/2003EP1331989A2 Spheres and method of forming a plurality of spheres
08/06/2003EP1296800A4 Polishing pad with built-in optical sensor
08/06/2003EP1129415A4 Automatic generation of user definable memory bist circuitry
08/06/2003EP1123166A4 Method of removing organic materials from substrates
08/06/2003EP1086484A4 Slurry for chemical-mechanical polishing metal surfaces
08/06/2003EP1074047A4 Method for fabricating an electrically addressable silicon-on-sapphire light valve
08/06/2003EP1068636A4 Ultra-high resolution liquid crystal display on silicon-on-sapphire
08/06/2003EP1027157B1 Nanostructures
08/06/2003EP0968142A4 Reactive ion etching of silica structures
08/06/2003EP0943088B1 Wafer inspection system for distinguishing pits and particles
08/06/2003EP0898712B1 Wafer-level burn-in and test
08/06/2003EP0882289B1 Lateral magneto-electronic device exploiting a quasi-two-dimensional electron gas
08/06/2003EP0815586B1 Integrated circuits having mixed layered superlattice materials and precursor solutions for use in a process of making the same
08/06/2003CN2565235Y Tin bead placing device
08/06/2003CN2565149Y Connecting structure for forming mini bump on wafer
08/06/2003CN1435007A High sheet MOS resistor method and apparatus