Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/12/2003US6604493 Liquid material vaporizing and feeding apparatus
08/12/2003US6604492 Vaporizer
08/12/2003CA2360303C Process for the preparation of pure citalopram
08/12/2003CA2162189C Insulator for integrated circuits and process
08/12/2003CA2115659C Pyroelectric sensor and fabrication process
08/07/2003WO2003065783A1 Chip removal device chip, placing system and method for removing chips from a wafer
08/07/2003WO2003065779A1 Method for embedding a component in a base
08/07/2003WO2003065778A1 Method for embedding a component in a base and forming a contact
08/07/2003WO2003065766A2 Heating in a vacuum atmosphere in the presence of a plasma
08/07/2003WO2003065526A1 Quantum well structure and semiconductor element using it and production method of semiconductor element
08/07/2003WO2003065473A1 Electronic devices containing organic semiconductor materials
08/07/2003WO2003065466A1 Organic semiconductor device and method
08/07/2003WO2003065465A2 Boron phosphide-based semiconductor device, production method thereof, light-emitting diode and boron phosphide-based semiconductor layer
08/07/2003WO2003065459A1 Semiconductor device
08/07/2003WO2003065458A2 Electronic device
08/07/2003WO2003065457A2 Cluster packaging of light emitting diodes
08/07/2003WO2003065454A2 Split-gate power module and method for suppressing oscillation therein
08/07/2003WO2003065451A1 Flip chip die bond pads, die bond pad placement and routing optimization
08/07/2003WO2003065450A2 Integrated circuits with backside contacts and methods for their fabrication
08/07/2003WO2003065447A2 No-flow underfill encapsulant
08/07/2003WO2003065444A1 Reduction of negative bias temperature instability in narrow width pmos using f2 implantation
08/07/2003WO2003065443A2 Probe station
08/07/2003WO2003065442A1 Arrangement structure of inspection devices
08/07/2003WO2003065441A1 Prober
08/07/2003WO2003065439A1 Silicon epitaxial wafer and its production method
08/07/2003WO2003065438A1 Pgo solutions for the preparation of pgo thin films via spin coating
08/07/2003WO2003065437A2 Method for forming high quality oxide layers of different thickness in one processing step
08/07/2003WO2003065436A1 Semiconductor component with an insulating layer and method for the production of a semiconductor component with an insulating layer
08/07/2003WO2003065435A1 Etching method
08/07/2003WO2003065434A1 Method of treating surface, semiconductor device, process for producing semiconductor device, and apparatus for treatment
08/07/2003WO2003065432A1 Electrolytic processing apparatus and substrate processing apparatus and method
08/07/2003WO2003065431A1 Method of spin etching wafers with an alkali solution
08/07/2003WO2003065430A1 Method of processing semiconductor wafer
08/07/2003WO2003065429A1 GaN COMPOUND SEMICONDUCTOR CRYSTAL MAKING METHOD
08/07/2003WO2003065426A1 Semiconductor wafer manufacturing method, semiconductor wafer manufacturing order acceptance method, and semiconductor wafer manufacturing order acceptance system
08/07/2003WO2003065423A2 Electroless deposition apparatus and method
08/07/2003WO2003065422A1 High-frequency device using oxidized porous silicon layer
08/07/2003WO2003065421A1 Method of and device for the placement of miniature components on a carrier for miniature components
08/07/2003WO2003065420A2 Method for producing a semiconductor element
08/07/2003WO2003065419A2 Plasma etching of ni-containing materials
08/07/2003WO2003065418A2 Planar avalanche photodiode
08/07/2003WO2003065417A2 Charge controlled avalanche photodiode and method of making the same
08/07/2003WO2003065416A2 Enhanced photodetector
08/07/2003WO2003065411A2 Method of fabricating three-dimensional components using endpoint detection
08/07/2003WO2003065131A2 Method and apparatus for electron density measurement and verifying process status
08/07/2003WO2003065120A2 Microcontact printing
08/07/2003WO2003065119A2 Overlay measurements using periodic gratings
08/07/2003WO2003065064A2 Predictive, adaptive power supply for an integrated circuit under test
08/07/2003WO2003064977A2 Multiple degree of freedom interferometer
08/07/2003WO2003064966A1 Interference measuring method, interference measuring device, production method for projection optical system, projection optical system, and projection aligner
08/07/2003WO2003064962A2 Multi-axis interferometer
08/07/2003WO2003064900A1 Gate valve seal assembly
08/07/2003WO2003064734A1 Electrolytic processing apparatus and method
08/07/2003WO2003064725A1 Gas distribution showerhead
08/07/2003WO2003064724A1 Process for tungsten deposition by pulsed gas flow cvd
08/07/2003WO2003064722A1 Copper alloy sputtering target and method for manufacturing the target
08/07/2003WO2003064581A1 Methods and compositions for chemically treating a substrate using foam technology
08/07/2003WO2003064551A1 Compositions and methods for chemical-mechanical planarization o f noble-metal-featured substrates. these treated substrates
08/07/2003WO2003064544A2 Liquid crystal-templated conducting organic polymers
08/07/2003WO2003064495A2 Planarized microelectronic substrates
08/07/2003WO2003064493A1 No flow underfill composition
08/07/2003WO2003064108A1 Polishing head, polishing device and polishing method
08/07/2003WO2003064065A1 Method for reducing the formation of contaminants during supercritical carbon dioxide processes
08/07/2003WO2003064064A1 Megasonic probe energy director
08/07/2003WO2003064059A2 Integration of titanium and titanium nitride layers
08/07/2003WO2003041150A8 Two-step etching method for hard mask removal
08/07/2003WO2003030227A3 Method of semiconductor nanoparticle synthesis
08/07/2003WO2003028081A3 Method for etching structures in an etching body by means of a plasma
08/07/2003WO2003027690A9 Test structures for estimating dishing and erosion effects in copper damascene technology
08/07/2003WO2003025945A3 Compensation of a bias magnetic field in a storage surface of a magnetoresistive storage cell
08/07/2003WO2003021643A3 Semiconductor material handling system
08/07/2003WO2003021642A3 Method and apparatus for processing a wafer
08/07/2003WO2003019649A3 Strip conductor arrangement and method for producing a strip conductor arrangement
08/07/2003WO2003015182A3 Fin field effect transistor and method for producing a fin field effect transistor
08/07/2003WO2003011521A3 Electro-chemical polishing apparatus
08/07/2003WO2003010602A8 Photosensitive resin composition
08/07/2003WO2003009380A3 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
08/07/2003WO2003003428A3 Apparatus, process and method for mounting and treating a substrate
08/07/2003WO2002103783A3 Method of forming low resistance vias
08/07/2003WO2002089205A3 Relay connector for an electronic component and a method for producing the same
08/07/2003WO2002089181A3 Modification to fill layers for inlaying semiconductor patterns
08/07/2003WO2002084755A3 Keepers for mram electrodes
08/07/2003WO2002075781A3 Method of forming silicide contacts and device incorporating same
08/07/2003WO2002061802A9 Metal-to-metal antifuse structure and fabrication method
08/07/2003WO2002054481A3 Use of endpoint system to match individual processing stations within a tool
08/07/2003WO2002050888A3 Method for making electronic devices including silicon and ltcc
08/07/2003WO2002047166A3 Esd protection devices
08/07/2003WO2002047162A3 Microelectronic package having an integrated heat sink and build-up layers
08/07/2003WO2002045127A3 Methods of endpoint detection for wafer planarization
08/07/2003WO2002044445A9 Method for depositing especially, crystalline layers and device for carrying out the method
08/07/2003WO2002035586A3 Monitoring substrate processing using reflected radiation
08/07/2003WO2002031861A3 Substrate processing in an immersion, scrub and dry system
08/07/2003WO2002029890A3 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
08/07/2003WO2002027404A8 Mitigation of multilayer defects on a reticle
08/07/2003WO2002015267A3 Integrated circuit package including opening exposing portion of an ic
08/07/2003WO2002013342A3 Silicon wafer with embedded optoelectronic material for monolithic oeic
08/07/2003US20030149953 Integrated circuit cell library
08/07/2003US20030149943 Semiconductor integrated circuit device having pipeline stage and designing method therefor
08/07/2003US20030149915 Testability analysis system and method, and design for testability system and method
08/07/2003US20030149555 Method of simulation
1 ... 4601 4602 4603 4604 4605 4606 4607 4608 4609 4610 4611 4612 4613 4614 4615 4616 4617 4618 4619 4620 4621 ... 6590