Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/13/2003CN1435867A Method for mfg. high voltage element
08/13/2003CN1435866A Method and device for mfg. buried insulator type semiconductor silicon carbide substrate
08/13/2003CN1435865A Insulation film mfg. device
08/13/2003CN1435864A Semiconductor device and mfg. method thereof
08/13/2003CN1435863A Film forming method/device, image-forming method and simeconductor device mfg. method
08/13/2003CN1435862A Method for mfg. semiconductor substrate
08/13/2003CN1435842A Film magnet memory with high precision data reading structure
08/13/2003CN1435841A Magnetic yoke structure capable of reducing programming energy consumption for MRAM apparatus and producing method thereof
08/13/2003CN1435814A Semiconductor display device, mfg. method thereof and active array display device
08/13/2003CN1435813A Semiconductor display device and mfg. method thereof
08/13/2003CN1435805A Drive circuit and display apparatus comprising same
08/13/2003CN1435733A Substrate processing method and device, developing method and method for mfg. semiconductor device
08/13/2003CN1435732A 化学处理装置 Chemical treatment apparatus
08/13/2003CN1435729A Positive photosensitive resin composition
08/13/2003CN1435728A Nanosize making die using spacer technique
08/13/2003CN1435720A Liquid crystal display device and mfg. method thereof
08/13/2003CN1435589A Gas supply device and method
08/13/2003CN1435297A Method for monitoring measuring chemicomechanical grinding
08/13/2003CN1118102C Insulating grid type semiconductor device and method of fabricating same
08/13/2003CN1118101C Semiconductor device with insulated grid electrode and method of fabricating same
08/13/2003CN1118100C Monobrid semiconductor IC device and checking method thereof
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/13/2003CN1118098C Semiconductor integrated circuit device
08/13/2003CN1118097C 半导体器件 Semiconductor devices
08/13/2003CN1118096C Method for mfg. semiconductor device having MOS transistor and bipolar transistor
08/13/2003CN1118095C Fabrication method of semiconductor device using CMP process
08/13/2003CN1118094C Device and method for connecting two electronic components
08/13/2003CN1118093C Method for preparation of printed IC board
08/13/2003CN1118092C Lamp annealing device and method
08/13/2003CN1118091C Integrated circuits and mfg. methods
08/13/2003CN1118090C Method and device for plasma treatment
08/13/2003CN1118089C Semiconductor wafer, semiconductor chip, method for mfg. them and IC card
08/13/2003CN1118088C Semiconductor apparatus and method for fabricating same
08/13/2003CN1118087C Method for preparing semiconductor substrate
08/13/2003CN1118086C Plasma processing apparatus and method for chamber etching of same
08/13/2003CN1118085C Semiconductor substrate and method of mfg. same
08/13/2003CN1118070C Non-volatile semiconductor memory
08/13/2003CN1118003C Photoresist scavenger composition
08/13/2003CN1117890C Nozzle-injector for arc plasma deposition apparatus
08/13/2003CN1117889C Plasma intensified chemical vapour deposition device
08/13/2003CN1117887C Chemical vapor deposition apparatus for mfg. semiconductor device and its driving method
08/13/2003CN1117818C Thermosetting encapsulants for electronics packaging
08/13/2003CN1117652C Abrasive processing apparatus and method for employing encoded abrasive product
08/12/2003USRE38215 Polishing apparatus
08/12/2003US6606739 Scaling method for a digital photolithography system
08/12/2003US6606738 Analytical model for predicting the operating process window for lithographic patterning techniques based on photoresist trim technology
08/12/2003US6606730 Method for determining an optimum position of block pins, and computer product
08/12/2003US6606575 Cross-correlation timing calibration for wafer-level IC tester interconnect systems
08/12/2003US6606574 Quality control method for product production apparatus
08/12/2003US6606532 Method of manufacturing system LSI and system LSI manufactured using the method
08/12/2003US6606524 System and method for controlling an in-line apparatus
08/12/2003US6606276 SRAM device using MIS transistors
08/12/2003US6606248 Universal memory module/PCB storage, transport, automation handling tray
08/12/2003US6606234 Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow
08/12/2003US6606195 Optical unit and optical instrument having the same
08/12/2003US6606154 Sample inspecting apparatus
08/12/2003US6606152 Determination of center of focus by diffraction signature analysis
08/12/2003US6606149 Optical system adjusting method for energy beam apparatus
08/12/2003US6606146 Stage device, exposure apparatus incorporating the stage device, and method of using the same
08/12/2003US6606145 Exposure apparatus, microdevice, photomask, and exposure method
08/12/2003US6606080 Semiconductor display device and electronic equipment
08/12/2003US6605986 Boosted voltage generating circuit and semiconductor memory device having the same
08/12/2003US6605983 Voltage conversion circuit
08/12/2003US6605981 Apparatus for biasing ultra-low voltage logic circuits
08/12/2003US6605967 Low power consumption output driver circuit and supply voltage detection circuit
08/12/2003US6605963 Semiconductor integrated circuit and method of switching source potential of transistor in semiconductor integrated circuit
08/12/2003US6605962 PLD architecture for flexible placement of IP function blocks
08/12/2003US6605956 Device and method for testing integrated circuit dice in an integrated circuit module
08/12/2003US6605955 Temperature controlled wafer chuck system with low thermal resistance
08/12/2003US6605933 Power metal oxide semiconductor integrated circuit
08/12/2003US6605875 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
08/12/2003US6605874 Multi-level metallization structure that uses a conductive shunt layer that is deposited upon a lower interconnect at the junction between the lower interconnect and an upper interconnect
08/12/2003US6605872 Method for fabricating a semiconductor device including a latch-up preventing conductive layer
08/12/2003US6605871 RF circuit chip and RF circuit device including the RF circuit chip
08/12/2003US6605870 Pressure-contact type semiconductor device
08/12/2003US6605867 Surface mount type semiconductor package and manufacturing method therefor
08/12/2003US6605865 Semiconductor package with optimized leadframe bonding strength
08/12/2003US6605863 Trimethylammonium fluoride solution to selectively etch a dielectric antireflective coating of silicon oxynitride or silicon oxide layer on tetraethylorthosilicate substrate
08/12/2003US6605862 Trench semiconductor devices
08/12/2003US6605861 Semiconductor device
08/12/2003US6605860 Semiconductor structures and manufacturing methods
08/12/2003US6605859 Buried Zener diode structure and method of manufacture
08/12/2003US6605858 Semiconductor power device
08/12/2003US6605857 Reducing magnetic coupling using triple well
08/12/2003US6605855 CVD plasma process to fill contact hole in damascene process
08/12/2003US6605854 Schottky diode with bump electrodes
08/12/2003US6605853 Semiconductor device having heat protection circuits
08/12/2003US6605852 Semiconductor device and method for manufacturing the same including forming a plurality of dummy convex regions on a matrix with a virtual linear line defining an angle
08/12/2003US6605848 Semiconductor device with metal gate electrode and silicon oxynitride spacer
08/12/2003US6605847 Semiconductor device having gate all around type transistor and method of forming the same
08/12/2003US6605846 Shallow junction formation
08/12/2003US6605845 Asymmetric MOSFET using spacer gate technique
08/12/2003US6605844 Semiconductor device
08/12/2003US6605843 Fully depleted SOI device with tungsten damascene contacts and method of forming same
08/12/2003US6605842 Semiconductor device and a method of manufacturing the same
08/12/2003US6605841 Method for producing an electrode by means of a field effect controllable semiconductor component and field-effect-controllable semiconductor component
08/12/2003US6605840 Scalable multi-bit flash memory cell and its memory array
08/12/2003US6605839 Multi-level type nonvolatile semiconductor memory device
08/12/2003US6605838 Process flow for thick isolation collar with reduced length
08/12/2003US6605836 Magnetoresistance effect device, magnetic memory apparatus, personal digital assistance, and magnetic reproducing head, and magnetic information