Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/20/2003EP1335801A1 AN i IN SITU /i MODULE FOR PARTICLE REMOVAL FROM SOLID-STATE SURFACES
08/20/2003EP1185722B1 Pecvd of tan films from tantalum halide precursors
08/20/2003EP1056594A4 A-site and/or b-site modified pbzrtio3 materials and films
08/20/2003EP1049820B1 Method for epitaxial growth on a substrate
08/20/2003EP1002335B1 Oxygen precipitating process without oxygen outdiffusion in silicon wafer
08/20/2003EP0989465B1 Method for one-shot removal of resist member and sidewall protection layer
08/20/2003EP0892840B1 A composition for cleaning and etching electronic display and substrate
08/20/2003EP0871975B1 Power segmented electrode
08/20/2003CN2567781Y Memory designed with carbon nano-pipe one-electron transistor and carbon nano-pipe transistor
08/20/2003CN2567768Y Encapsulation structure for chip on base plate
08/20/2003CN2567767Y Testing machine with continuous double-testing region
08/20/2003CN1437837A Ceramic substrate and its production method
08/20/2003CN1437769A Field effect transistor structure with partially isolated source/drain junctions and methods of making same
08/20/2003CN1437767A Ultra-late programming ROM and method of manufacture
08/20/2003CN1437765A Method for controlling well leakage for trench isolations of differing depths
08/20/2003CN1437764A Holding device for treated body
08/20/2003CN1437763A Abrasives for chemical mechanical polishing
08/20/2003CN1437761A Production method for semiconductor device
08/20/2003CN1437759A 电极组件 The electrode assembly
08/20/2003CN1437715A A substrate for and a process in connection with the product of structures
08/20/2003CN1437713A A method for individualised marking of circuit boards
08/20/2003CN1437711A System for calibrating timing of an integrated circuit wafer tester
08/20/2003CN1437710A Diagnosting reliability of vias by E-beam probing
08/20/2003CN1437659A Physical vapor deposition targets comprising Ti and Zr and using method
08/20/2003CN1437643A Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
08/20/2003CN1437520A Polishing pad
08/20/2003CN1437433A Inductance coupling plasma processing apparatus
08/20/2003CN1437406A Apparatus and method for controlling electronic program guide (EPG)
08/20/2003CN1437392A Correlation secondary sampling circuit and CMOS image sensor containing the same circuit
08/20/2003CN1437289A Integration of continuous self-aligning semiconductor photoelectronic device and mode spot converter
08/20/2003CN1437269A Gate module and its making process
08/20/2003CN1437265A Active CMOS pixel unit and its making process
08/20/2003CN1437261A Memory with quantum point and producing method thereof
08/20/2003CN1437260A Separate-gate flash memory unit and its making process
08/20/2003CN1437259A Separate-gate flash memory unit and its making process
08/20/2003CN1437257A 晶圆结构 Wafer structure
08/20/2003CN1437256A Semiconductor element and producing method thereof, and semiconductor device and producing method thereof
08/20/2003CN1437255A Semiconductor configuration and making process
08/20/2003CN1437253A Manufacture of separate-gate flash memory
08/20/2003CN1437252A Manufacture of stack-gate flash memory unit
08/20/2003CN1437251A Manufacture of stack-gate flash memory unit
08/20/2003CN1437250A Method for producing CMOS device
08/20/2003CN1437249A Buffer configuration and chip
08/20/2003CN1437248A Design of 3D ROM
08/20/2003CN1437247A Method of improving performance of flash memory
08/20/2003CN1437246A Manufacture of integrated circuit
08/20/2003CN1437245A Method for proving program with fast program
08/20/2003CN1437244A Method of improving surface flatness of embedded interlayer metal dielectric layer
08/20/2003CN1437243A Making process of embedded copper metal intraconnection
08/20/2003CN1437242A Isolator forming process
08/20/2003CN1437240A Centring mechanism, centring device, semi-coductor manufacturing device and centring method
08/20/2003CN1437239A Test equipment for packed semiconductor elements
08/20/2003CN1437238A Making process of flat-topped gold lug
08/20/2003CN1437237A Method of avoid fluorination of metal joint of semiconductor element
08/20/2003CN1437236A Plastic casing package method for electromagnetic device
08/20/2003CN1437235A Glue layer thickness controllable continuous glue-dropping process for packing solar cell
08/20/2003CN1437234A Chip pick-up device and producing method thereof and production apparatus of semiconductor
08/20/2003CN1437232A Chip package structure and its making process
08/20/2003CN1437231A Manufacture of metal-oxide semiconductor transistor
08/20/2003CN1437230A Electrostatic protection structure with defect area inside drain and its making process
08/20/2003CN1437229A Method for thermal processing silicon chip and silicon chip produced with the same method
08/20/2003CN1437228A Material for insulation film containing organic silane compound its producing method and semiconductor device
08/20/2003CN1437227A Mesolayer window etching process in the identical etching chamber
08/20/2003CN1437226A Manufacture of carbon-containing dielectric layer
08/20/2003CN1437225A Dry itching process for gallium nitrid compound semiconductor, etc.
08/20/2003CN1437224A Gaseous diffusion plate used in induction coupling plasma etching apparatus
08/20/2003CN1437222A Abrasive distributing system and chemomechanical abrading apparatus with the system
08/20/2003CN1437221A Manufacture of integrated self-aligned metal silicide gate of embedded DRAM
08/20/2003CN1437220A Shower nozzle type gas supply device and semiconductor device manufacturing equipment with nozzle type gas supply device
08/20/2003CN1437219A Filling container for solid organic metal compound use and its filling method
08/20/2003CN1437218A Apparatus equiped with clamping chuck and matching box
08/20/2003CN1437217A Microprobe making process
08/20/2003CN1437202A Manufacture of high-density laminated metal capacitor element
08/20/2003CN1437199A Thin film magnetic storage device for writing data into current to provide with multi-storage block
08/20/2003CN1437171A Panel display and method for producing panel display
08/20/2003CN1437151A 开工管理系统 Operating management system
08/20/2003CN1437108A Remote mask layout inspecting method via network
08/20/2003CN1437072A Method for raising processing range with eliminating auxiliary characteristic
08/20/2003CN1437071A Method for producing offset printing apparatus and device
08/20/2003CN1437070A Semiconductor element pattern transferring method
08/20/2003CN1437069A Photomask for off-axis illumination and its producing method
08/20/2003CN1437049A Method for producing liquid crystal display
08/20/2003CN1437044A LCD adhesion machine and method for producing LCD with the same adhering machine
08/20/2003CN1436819A Black composite particles for semiconductor sealing material use and semiconductor sealing material
08/20/2003CN1436630A Holding element for flat workpiece
08/20/2003CN1118886C Electric connector and producing method thereof
08/20/2003CN1118875C Memory unit device and producing method thereof
08/20/2003CN1118874C Semiconductor device and producing method thereof
08/20/2003CN1118872C Semiconductor device and producing method thereof
08/20/2003CN1118871C Method for forming metal interconnection
08/20/2003CN1118870C Method for producing semiconductor device
08/20/2003CN1118869C Integrated circuit contacts with fixed stringers
08/20/2003CN1118868C Semiconductor device and producing method thereof
08/20/2003CN1118867C Method and equipment for producing semiconductor device
08/20/2003CN1118866C Method for producing semiconductor device
08/20/2003CN1118865C Apparatus for cleaning semiconductor wafer
08/20/2003CN1118864C Method of producing semiconductor device utilizing phase change
08/20/2003CN1118863C Method of producing semiconductor device for preventing rising-up of siliside
08/20/2003CN1118833C Method for using resin package electronic element
08/20/2003CN1118826C Ferroelectric random access memory device with reference cell array blocks
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