Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/19/2003US6607966 Forming silicon storage nodes on silicon substrates; heating the silicon substrate to a temperature sufficient to drive dopants from the doped oxide into the silicon layer
08/19/2003US6607965 Forming nitrogen-comprising layer on surface of rugged polysilicon substrate to form dielectric material; subjecting substrate to dry oxidation using nitric oxide or nitrous oxide to form second portion of dielectric material
08/19/2003US6607964 Method of manufacturing semiconductor device
08/19/2003US6607963 Method for forming capacitor of semiconductor device
08/19/2003US6607962 Globally planarized backend compatible thin film resistor contact/interconnect process
08/19/2003US6607961 Method of definition of two self-aligned areas at the upper surface of a substrate
08/19/2003US6607960 Bipolar transistor manufacturing method
08/19/2003US6607959 Integrated circuit devices having trench isolation structures and methods of fabricating the same
08/19/2003US6607958 Semiconductor device and method of manufacturing the same
08/19/2003US6607957 Method for fabricating nitride read only memory
08/19/2003US6607955 Method of forming self-aligned contacts in a semiconductor device
08/19/2003US6607954 Methods of fabricating cylinder-type capacitors for semiconductor devices using a hard mask and a mold layer
08/19/2003US6607953 Structural integrity enhancement of dielectric films
08/19/2003US6607952 Semiconductor device with a disposable gate and method of manufacturing the same
08/19/2003US6607951 Method for fabricating a CMOS image sensor
08/19/2003US6607950 MIS transistors with a metal gate and high-k dielectric and method of forming
08/19/2003US6607949 Method for fabricating polysilicon thin film transistor with improved electrical characteristics
08/19/2003US6607948 Method of manufacturing a substrate using an SiGe layer
08/19/2003US6607947 Method of manufacturing a semiconductor device with fluorinated layer for blocking alkali ions
08/19/2003US6607946 Process for growing a dielectric layer on a silicon-containing surface using a mixture of N2O and O3
08/19/2003US6607944 Method of making memory cell arrays
08/19/2003US6607943 Low profile ball grid array package
08/19/2003US6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method
08/19/2003US6607939 Method of making a multi-layer interconnect
08/19/2003US6607938 Wafer level stack chip package and method for manufacturing same
08/19/2003US6607935 Method for fabricating array substrate for X-ray detector
08/19/2003US6607931 Method of producing an optically transparent substrate and method of producing a light-emitting semiconductor chip
08/19/2003US6607927 Method and apparatus for monitoring in-line copper contamination
08/19/2003US6607926 Method and apparatus for performing run-to-run control in a batch manufacturing environment
08/19/2003US6607925 Hard mask removal process including isolation dielectric refill
08/19/2003US6607865 Positive photosensitive resin composition
08/19/2003US6607863 Exposure method of production of density filter
08/19/2003US6607836 Mixture of aluminum nitride and complex oxide of aluminum and samarium
08/19/2003US6607790 Plasma-enhanced vapor deposition of halogen and silicon dioxide from tetraethoxysilane and halogen compound
08/19/2003US6607785 Bubbler
08/19/2003US6607780 Forming opening by photolithography; filling opening with nonconductive paste; placing green sheet on support; filling through hole with conductive paste
08/19/2003US6607676 Heating an aromatic polyimide to carbonize the polyimide; incorporating into carbonized polyimide one or more hetero atoms other than carbon atom which are selected from the group consisting of boron, aluminum, gallium and indium
08/19/2003US6607675 Method of etching carbon-containing silicon oxide films
08/19/2003US6607654 Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect
08/19/2003US6607650 Method of forming a plated layer to a predetermined thickness
08/19/2003US6607640 Supplying heating or cooling backside inert gas to mounted biased support maintaining pressure thereby improving thickness uniformity and morphology of sputter depositing metal seed layer; semiconductors
08/19/2003US6607634 Reticle adapter for a reactive ion etch system
08/19/2003US6607633 Plasma generating device and plasma processing apparatus comprising such a device
08/19/2003US6607620 Greensheet carriers and processing thereof
08/19/2003US6607604 Method and apparatus for treating substrates
08/19/2003US6607602 Device for processing semiconductor wafers
08/19/2003US6607593 Method of manufacturing a mono-crystalline silicon ball
08/19/2003US6607435 Fan filter unit control system and clean room provided with same
08/19/2003US6607427 Dressing apparatus and polishing apparatus
08/19/2003US6607426 Polishing apparatus
08/19/2003US6607424 Aqueous polishing mixture for chemical mechanical polishing of semiconductor substrates, having pH under 5.0, that comprises blend of at least two polyacrylic acids, one with low number average molecular weight and one with high, in specified ratio
08/19/2003US6607422 Endpoint detection with light beams of different wavelengths
08/19/2003US6607381 Auxiliary heat-insulating jig
08/19/2003US6607380 Substrate conveying system and device manufacturing method using the same
08/19/2003US6607173 Film on a surface of a mold used during semiconductor device fabrication
08/19/2003US6607118 Apparatus and method for ball release
08/19/2003US6607117 Solder ball attaching system and method
08/19/2003US6607112 Wire bonding apparatus
08/19/2003US6607072 Wheel and conveyor system for transporting semiconductor wafers
08/19/2003US6607019 Method and apparatus for application of adhesive tape to semiconductor devices
08/19/2003US6607001 System of reducing water spotting and oxide growth on a semiconductor structure
08/19/2003US6606985 Dual-cutting method devoid of useless strokes
08/19/2003US6606883 Method for producing fused silica and doped fused silica glass
08/19/2003US6606802 Cleaning efficiency improvement in a high density plasma process chamber using thermally hot gas
08/19/2003CA2205221C Plasma cvd method and apparatus
08/19/2003CA2131696C Semiconductor epitaxial substrate
08/14/2003WO2003067946A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
08/14/2003WO2003067939A1 Plasma processing equipment
08/14/2003WO2003067759A1 Digital electronic circuit with low power consumption
08/14/2003WO2003067680A1 Method of producing organic semiconductor device
08/14/2003WO2003067676A2 Enhanced photo-emf sensor with high bandwidth and large field of view
08/14/2003WO2003067668A2 Memory cell
08/14/2003WO2003067666A1 Semiconductor device and method for fabricating the same
08/14/2003WO2003067665A2 Cellular mosfet devices and their manufacture
08/14/2003WO2003067664A1 Field-effect transistor and method for manufacturing it
08/14/2003WO2003067662A1 Stiction alleviation using passivation layer patterning
08/14/2003WO2003067661A1 Capacitor-less 1-transistor dram cell and method for producing the same
08/14/2003WO2003067660A1 Semiconductor device and its manufacturing method
08/14/2003WO2003067659A1 Device for connecting an ic terminal to a reference potential
08/14/2003WO2003067656A1 Semiconductor chip mounting board, its manufacturing method, and semiconductor module
08/14/2003WO2003067655A1 Method and structure for forming an hbt
08/14/2003WO2003067654A1 Semiconductor chip pickup device
08/14/2003WO2003067653A2 Monitoring of contact hole production
08/14/2003WO2003067651A1 Test wafer and method for investigating elecrostatic discharge induced wafer defects
08/14/2003WO2003067650A1 Method for manufacturing electric contact element for testing electro device and electric contact element thereby
08/14/2003WO2003067649A1 Chip mounting method and device using it
08/14/2003WO2003067648A2 Semiconductor device and method of manufacturing the same
08/14/2003WO2003067647A2 Method and device for protecting electronic, optoelectronic and/or electromechanical microcomponents
08/14/2003WO2003067646A2 Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration
08/14/2003WO2003067644A1 Homoepitaxial layers of p-type zinc oxide and the fabrication thereof
08/14/2003WO2003067643A1 Etching method and etching apparatus
08/14/2003WO2003067642A1 Device for producing inductively coupled plasma and method thereof
08/14/2003WO2003067641A1 Polishing pad, polishing device, and polishing method
08/14/2003WO2003067640A2 Method for the production of a memory cell and structure thereof
08/14/2003WO2003067639A2 Method for producing a memory cell
08/14/2003WO2003067638A1 Method for manufacturing silicon nitride film using chemical vapor deposition apparatus of single chamber type
08/14/2003WO2003067637A2 Methods of treating a silicon carbide substrate for improved epitaxial deposition
08/14/2003WO2003067636A1 Surface treating device and surface treating method
08/14/2003WO2003067635A2 Reactor assembly and processing method
08/14/2003WO2003067634A1 Article for use in a semiconductor processing chamber and method of fabricating the same
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