Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/21/2003US20030155603 Finger metal-insulator-metal capacitor with local interconnect
08/21/2003US20030155601 Multilayer; electroconductive layer filling contact hole, electrode, dielectric, electrode
08/21/2003US20030155600 NMOS ESD protection device with thin silicide and methods for making same
08/21/2003US20030155599 Twin-cell flash memory structure and method
08/21/2003US20030155598 Flip feram cell and method to form same
08/21/2003US20030155597 Bismuth strontium tantalate; heat treatment
08/21/2003US20030155596 Smiconductor device and method for fabricating the same
08/21/2003US20030155595 Semiconductor device and method of manufacturing the same
08/21/2003US20030155594 Semiconductor display device and manufacturing method method thereof
08/21/2003US20030155593 Photodiode and method of manufacturing the same
08/21/2003US20030155592 Channel, barrier electrode, intakes, drains; high speed integrated circuits
08/21/2003US20030155591 Field effect transistor and method for producing a field effect transistor
08/21/2003US20030155589 Silver-selenide/chalcogenide glass stack for resistance variable memory
08/21/2003US20030155586 Methods and devices using group III nitride compound semiconductor
08/21/2003US20030155585 Semiconductor device and liquid jet apparatus using the same
08/21/2003US20030155584 Method of preparing nitrogen containing semiconductor material
08/21/2003US20030155578 Heterostructure with rear-face donor doping
08/21/2003US20030155575 III nitride compound semiconductor element an electrode forming method
08/21/2003US20030155574 Semiconductor devices formed of III-nitride compounds, lithium-niobate-tantalate, and silicon carbide
08/21/2003US20030155573 Semiconductor device and manufacturing method therefor
08/21/2003US20030155572 Thin film transistor and method for manufacturing thereof
08/21/2003US20030155571 Method of manufacturing a semiconductor device and liquid crystal display
08/21/2003US20030155568 Process for producing semiconductor article using graded epitaxial growth
08/21/2003US20030155556 Rigid, hardness adhesive; reliable adhesive; connecting semiconductor chips; heat resistance, waterproofing
08/21/2003US20030155534 Maskless particle-beam system for exposing a pattern on a substrate
08/21/2003US20030155533 Ion implanting method and apparatus
08/21/2003US20030155525 Electron beam apparatus and high-voltage discharge prevention method
08/21/2003US20030155523 Quantum wells; etching, writing using electron beams; forming semiconductors
08/21/2003US20030155522 Electron beam generating apparatus and electron beam exposure apparatus
08/21/2003US20030155408 Sacrificial seed layer process for forming c4 solder bumps
08/21/2003US20030155405 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/21/2003US20030155392 Apparatus for cutting liquid crystal display panels and cutting method using the same
08/21/2003US20030155391 Method for cutting liquid crystal display panel
08/21/2003US20030155335 Radiation with short laser pulses; supplying gases
08/21/2003US20030155333 Method and apparatus for cutting a substrate using laser irradiation
08/21/2003US20030155329 Method for improved plasma etching control
08/21/2003US20030155280 Semiconductor device inspection system
08/21/2003US20030155249 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
08/21/2003US20030155246 Activation surfaces using scanning tunnel microscope; forming deposits
08/21/2003US20030155236 Sputter device
08/21/2003US20030155229 Hafnium silicide target for gate oxide film formation and its production method
08/21/2003US20030155080 Microchip fabrication chamber wafer detection
08/21/2003US20030155079 Plasma processing system with dynamic gas distribution control
08/21/2003US20030155078 Plasma processing apparatus, and electrode plate, electrode supporting body, and shield ring thereof
08/21/2003US20030155077 Substrate processing apparatus
08/21/2003US20030155076 Semiconductor processing system
08/21/2003US20030155073 Distributed control system for semiconductor manufacturing equipment
08/21/2003US20030155072 RTA chamber with in situ reflective index monitor
08/21/2003US20030155069 Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method
08/21/2003US20030155000 Removing water, desorption by feeding second polar gas molecules, inert gas, nitrogen, or ammonia; processing semiconductor and microelectronics
08/21/2003US20030154999 Method for preventing chemical attack on a copper containing semiconductor wafer
08/21/2003US20030154922 C-chuck insulator strip
08/21/2003US20030154921 Contains flax pulp; no increase in loading material promoting combustion
08/21/2003US20030154912 Method of producing a body of semiconductor material having a reduced mean free path length
08/21/2003US20030154908 Manufacturing method and apparatus
08/21/2003US20030154880 Solvated ruthenium precursors for direct liquid injection of ruthenium and ruthenium oxide
08/21/2003US20030154723 Apparatus for the real-time monitoring and control of a wafer temperature
08/21/2003US20030154659 Polishing composition
08/21/2003US20030154597 Process and apparatus for disengaging semiconductor die from an adhesive film
08/21/2003DE10233916C1 Production of vertical transistor in the upper section of trench having single crystalline substrate with trench, lining the lower section of the trench with storage dielectric, filling with conducting material and further processing
08/21/2003DE10220647C1 Semiconductor wafer peripheral edge shaping method has material removed from peripheral edge of wafer until surface layer applied to inner part of one of its major surfaces is reached
08/21/2003CA2475948A1 Multi power supply circuit protection apparatus and method
08/21/2003CA2473836A1 Deflectable microstructure and method of manufacturing the same through bonding of wafers
08/20/2003EP1337138A2 Structure for retaining cut-processed components and a method of washing
08/20/2003EP1337134A2 Terminal structure having large peel strength of land portion and ball
08/20/2003EP1336988A1 Polishing device and method of manufacturing semiconductor device
08/20/2003EP1336987A2 Protection layer to prevent under-layer damage during deposition
08/20/2003EP1336986A2 Method of separating a thin semicondcutor die from a wafer
08/20/2003EP1336985A1 Sputtering cathode, and device and method for coating a substrate with a plurality of layers
08/20/2003EP1336984A2 Method and apparatus for providing modulated bias power to a plasma etch reactor
08/20/2003EP1336983A2 Electron beam apparatus and high-voltage discharge prevention method
08/20/2003EP1336970A2 Memory cell and wordline driver for embedded dram in asic process
08/20/2003EP1336911A1 Circuit arrangement for controlling a constant current through a load
08/20/2003EP1336899A1 Lithographic apparatus, alignment method and device manufacturing method
08/20/2003EP1336898A2 Exposure apparatus and method, and device fabricating method using the same
08/20/2003EP1336887A1 Catadioptric system and exposure device having this system
08/20/2003EP1336668A1 Method for forming insulation film
08/20/2003EP1336247A1 Electronic device, semiconductor device comprising such a device and method of manufacturing such a device
08/20/2003EP1336203A2 Vertical junction field effect semiconductor diodes
08/20/2003EP1336201A1 Integrated circuit configuration that is protected against analysis, and method for producing the configuration
08/20/2003EP1336200A2 Method for eliminating crack damage at interfaces in integrated circuits
08/20/2003EP1336195A2 Method of forming shallow trench isolation in silicon
08/20/2003EP1336194A1 A method for attaching an integrated circuit on a silicon chip to a smart label
08/20/2003EP1336193A2 Bright field image reversal for contact hole patterning
08/20/2003EP1336191A2 Stepped upper electrode for plasma processing uniformity
08/20/2003EP1336190A2 Hybrid scanning system and methods for ion implantation
08/20/2003EP1336189A1 Device, set and method for carrying a gas or a liquid to a surface through a tube
08/20/2003EP1336188A2 Extraction and deceleration of low energy beam with low beam divergence
08/20/2003EP1336179A1 Integrated magnetoresistive semiconductor memory system
08/20/2003EP1336131A1 Optical recording materials
08/20/2003EP1336130A2 Mitigation of multilayer defects on a reticle
08/20/2003EP1336095A2 Measurement of surface defects
08/20/2003EP1336094A2 Measurement of surface defects
08/20/2003EP1335998A2 Atomic layer doping apparatus and method
08/20/2003EP1335997A1 Method and device for controlling the surface temperatures of substrates in a chemical vapour deposition reactor
08/20/2003EP1335994A2 Physical vapor deposition target assemblies, and methods of forming physical vapor deposition target assemblies
08/20/2003EP1335885A1 Method for anodic bonding at low temperatures
08/20/2003EP1335816A1 Edge-gripping pre-aligner
08/20/2003EP1335814A1 Semiconductor wafer, polishing apparatus and method
08/20/2003EP1335806A1 Improved passivating etchants for metallic particles
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