Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/12/2003US6605835 Ferroelectric memory and its method of fabrication
08/12/2003US6605833 Integrated circuit with circuit elements having different supply voltages
08/12/2003US6605832 Semiconductor structures having reduced contact resistance
08/12/2003US6605831 Field-effect semiconductor device
08/12/2003US6605830 Power semiconductor device including an IGBT with a MOS transistor as a current suppressing device incorporated therein
08/12/2003US6605827 Electrooptical substrate device and manufacturing method for same, electrooptical apparatus, electronic apparatus and manufacturing method for a substrate device
08/12/2003US6605824 Semiconductor drive
08/12/2003US6605816 Reticle and direct lithography writing strategy
08/12/2003US6605814 Apparatus for curing resist
08/12/2003US6605550 Substrate processing method and substrate processing apparatus
08/12/2003US6605549 Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics
08/12/2003US6605548 Process for etching gallium nitride compound based semiconductors
08/12/2003US6605546 Dual bake for BARC fill without voids
08/12/2003US6605545 Method for forming hybrid low-K film stack to avoid thermal stress effect
08/12/2003US6605544 Bonded sapphire polygon shield
08/12/2003US6605543 Process to control etch profiles in dual-implanted silicon films
08/12/2003US6605542 Forming an interlayer insulating film having a dual-damascene structure, a contact hole and a deep trench mask using an organic silicon film.
08/12/2003US6605541 Pitch reduction using a set of offset masks
08/12/2003US6605540 Process for forming a dual damascene structure
08/12/2003US6605539 Patterned surface then is processed into a useful feature such as a bottom electrode for a DRAM capacitor.
08/12/2003US6605538 Methods for forming ferroelectric capacitors
08/12/2003US6605537 Polishing of metal substrates
08/12/2003US6605536 Treatment of low-k dielectric films to enable patterning of deep submicron features
08/12/2003US6605535 Method of filling trenches using vapor-liquid-solid mechanism
08/12/2003US6605534 Selective deposition of a conductive material
08/12/2003US6605533 Process for forming low resistance metal silicide local interconnects
08/12/2003US6605531 Hole-filling technique using CVD aluminum and PVD aluminum integration
08/12/2003US6605530 Method for fabricating semiconductor integrated circuit
08/12/2003US6605529 Oscillating deposition parameter during formation of semiconductor material and incorporating hydrogen isotope into semiconductor material at interface
08/12/2003US6605528 Post passivation metal scheme for high-performance integrated circuit devices
08/12/2003US6605527 Reduced area intersection between electrode and programming element
08/12/2003US6605526 Wirebond passivation pad connection using heated capillary
08/12/2003US6605525 Stress buffer layer
08/12/2003US6605524 Bumping process to increase bump height and to create a more robust bump structure
08/12/2003US6605523 Manufacturing method for semiconductor device
08/12/2003US6605522 Method of manufacturing a semiconductor device having a protruding bump electrode
08/12/2003US6605521 Method of forming an oxide film on a gate side wall of a gate structure
08/12/2003US6605520 Method of forming silicon-germanium film
08/12/2003US6605519 Method for thin film lift-off processes using lateral extended etching masks and device
08/12/2003US6605518 Method of separating composite member and process for producing thin film
08/12/2003US6605517 Method for minimizing nitride residue on a silicon wafer
08/12/2003US6605516 Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
08/12/2003US6605515 Method for manufacturing thin-film capacitor for performing temperature compensation of junction capacitance of semiconductor device
08/12/2003US6605514 Planar finFET patterning using amorphous carbon
08/12/2003US6605513 Method of forming nickel silicide using a one-step rapid thermal anneal process and backend processing
08/12/2003US6605512 Manufacturing method of a semiconductor device
08/12/2003US6605511 Method of forming nitridated tunnel oxide barriers for flash memory technology circuitry and STI and LOCOS isolation
08/12/2003US6605510 Semiconductor device with both memories and logic circuits and its manufacture
08/12/2003US6605509 Method for forming smooth floating gate structure for flash memory
08/12/2003US6605508 Semiconductor device and method of manufacturing thereof
08/12/2003US6605507 Non-volatile semiconductor memory device and manufacturing method thereof
08/12/2003US6605506 Method of fabricating a scalable stacked-gate flash memory device and its high-density memory arrays
08/12/2003US6605505 Process for producing an integrated semiconductor memory configuration
08/12/2003US6605504 Method of manufacturing circuit with buried strap including a liner
08/12/2003US6605503 Method of manufacturing a semiconductor memory device having a capacitor with improved dielectric layer
08/12/2003US6605502 Isolation using an antireflective coating
08/12/2003US6605501 Method of fabricating CMOS device with dual gate electrode
08/12/2003US6605498 Semiconductor transistor having a backfilled channel material
08/12/2003US6605497 Method of manufacturing semiconductor device over glass substrate having heat resistance
08/12/2003US6605496 Method of fabricating a bottom-gate-type thin film transistor using a heat relaxation layer during laser crystallization
08/12/2003US6605495 Method of forming a thin film transistor liquid crystal display
08/12/2003US6605494 Method of fabricating thin film transistor
08/12/2003US6605493 Silicon controlled rectifier ESD structures with trench isolation
08/12/2003US6605491 Method for bonding IC chips to substrates with non-conductive adhesive
08/12/2003US6605490 Semiconductor device and production process thereof
08/12/2003US6605489 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
08/12/2003US6605488 Layout technique for semiconductor processing using stitching
08/12/2003US6605486 Bipolar transistor, semiconductor light emitting device and semiconductor device
08/12/2003US6605484 Process for optically erasing charge buildup during fabrication of an integrated circuit
08/12/2003US6605480 Wafer level packaging for making flip-chips
08/12/2003US6605479 Method of using damaged areas of a wafer for process qualifications and experiments, and system for accomplishing same
08/12/2003US6605478 Kill index analysis for automatic defect classification in semiconductor wafers
08/12/2003US6605477 Integrated circuit device including a layered superlattice material with an interface buffer layer
08/12/2003US6605417 Using aromatic sulfonic acid
08/12/2003US6605411 Method for formation of semiconductor device pattern, method for designing photo mask pattern, photo mask and process for photo mask
08/12/2003US6605409 Positive resist composition
08/12/2003US6605398 Methods and apparatus for controlling beam blur in charged-particle-beam microlithography
08/12/2003US6605397 Method of preparing pattern data to be used for different exposure methods
08/12/2003US6605392 X-ray mask structure, and X-ray exposure method and apparatus using the same
08/12/2003US6605362 Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
08/12/2003US6605355 Semiconductor connections
08/12/2003US6605352 Corrosion and erosion resistant thin film diamond coating and applications therefor
08/12/2003US6605345 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
08/12/2003US6605331 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
08/12/2003US6605315 Apply a bonding paste for chip bonding on a substrate and a method of using the bonding paste applicator.
08/12/2003US6605230 Stripping coatings or photoresists from wafer surfaces using mixtures of hydrogen fluoride or ammonium fluoride in sulfuric acid; efficiency
08/12/2003US6605226 Method for increased workpiece throughput
08/12/2003US6605225 Method and apparatus for fabricating three dimensional element from anisotropic material
08/12/2003US6605197 Filling semiconductor grooves with copper and/or alloys, wetting and barrier layers; damascene
08/12/2003US6605176 Aperture for linear control of vacuum chamber pressure
08/12/2003US6605175 Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber
08/12/2003US6605153 Coating film forming apparatus
08/12/2003US6605150 Low defect density regions of self-interstitial dominated silicon
08/12/2003US6604985 Abrasive article having a window system for polishing wafers, and methods
08/12/2003US6604673 Filling device and method for filling balls in the apertures of a ball-receiving element
08/12/2003US6604671 Bondhead lead clamp apparatus and method
08/12/2003US6604670 Lead penetrating clamping system
08/12/2003US6604624 Work conveying system
08/12/2003US6604555 Automatic refill system for ultra pure or contamination sensitive chemicals
08/12/2003US6604535 Substrate cleaning apparatus and method
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