Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/14/2003US20030153161 Strained si based layer made by uhv-cvd, and devices therein
08/14/2003US20030153158 Method for increasing area of a trench capacitor
08/14/2003US20030153157 Low energy ion implantation into SiGe
08/14/2003US20030153156 Logic array and dynamic logic method
08/14/2003US20030153155 Fet having epitaxial silicon growth
08/14/2003US20030153154 Manufacturing method of semiconductor device
08/14/2003US20030153153 Method of fabricating flat-cell mask read-only memory devices
08/14/2003US20030153152 Self aligned method of forming non-volatile memory cells with flat word line
08/14/2003US20030153151 Memory device with quantum dot and method for manufacturing the same
08/14/2003US20030153150 Floating gate nitridation
08/14/2003US20030153149 Floating gate nitridation
08/14/2003US20030153148 Method for fabricating a gate structure of a flash memory
08/14/2003US20030153147 Semiconductor integrated circuit and method for manufacturing the same
08/14/2003US20030153146 Methods for forming capacitors of semiconductor devices
08/14/2003US20030153145 Integrated capacitor bottom electrode for use with conformal dielectric
08/14/2003US20030153144 Methods of selective oxidation conditions for dielectric conditioning
08/14/2003US20030153143 Electroless deposition of doped noble metals and noble metal alloys
08/14/2003US20030153142 Selective deposition of undoped silicon film seeded in chlorine and hydride gas for a stacked capacitor
08/14/2003US20030153139 Method to fabricate a single gate with dual work-functions
08/14/2003US20030153138 Semiconductor processing methods of forming integrated circuitry
08/14/2003US20030153137 Non-volatile memory device with a polarizable layer
08/14/2003US20030153136 Method of manufacturing semicontor device having trench isolation
08/14/2003US20030153135 Method for forming semiconductor memory device having a fuse
08/14/2003US20030153134 Semiconductor device, and a method of producing semiconductor device
08/14/2003US20030153133 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153132 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153131 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153130 Fabrication method of semiconductor integrated circuit device
08/14/2003US20030153129 Method for fabricating preplated nickel/palladium and tin leadframes
08/14/2003US20030153128 Semiconductor device and manufacturing the same
08/14/2003US20030153127 Method of manufacturing a semiconductor device
08/14/2003US20030153125 Semiconductor device having element isolation structure
08/14/2003US20030153121 Semiconductor package production method and semiconductor package
08/14/2003US20030153119 Integrated circuit package and method for fabrication
08/14/2003US20030153118 Polysilicon fet built on silicon carbide diode substrate
08/14/2003US20030153115 Micromachined device having electrically isolated components and a method for making the same
08/14/2003US20030153114 Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
08/14/2003US20030153112 Method for manufacturing light-emitting device using a group lll nitride compound semiconductor
08/14/2003US20030153111 Drive circuit of active matrix device and manufacturing method therefor
08/14/2003US20030153110 Thin film transistor substrate and method of manufacturing the same
08/14/2003US20030153107 Method for reworking metal layers on integrated circuit bond pads
08/14/2003US20030153106 Method for determining the location of a droplet on a component
08/14/2003US20030153105 Integrated circuit testing with a visual indicator
08/14/2003US20030153104 System and method for active control of spacer deposition
08/14/2003US20030153103 Bond pad structure comprising multiple bond pads with metal overlap
08/14/2003US20030153102 Method of controlling plasma etch process
08/14/2003US20030153101 Method for surface treatment and system for fabricating semiconductor device
08/14/2003US20030153100 Process for producing PZT films by chemical vapor deposition method
08/14/2003US20030152986 Method for sorting antifungal molecules acting on the glucanosyltransferase activity
08/14/2003US20030152874 Photoresist stripping composition and process for stripping resist
08/14/2003US20030152873 Fabrication method of semiconductor integrated circuit device
08/14/2003US20030152871 Multilayer; dielectric substrate, spacers and masking layer; etching patterns
08/14/2003US20030152865 Mixture containing acid generator, addition polymer
08/14/2003US20030152861 Positive photoresist composition
08/14/2003US20030152851 System, method and computer program product for instructing allocation of a plurality of exposure units
08/14/2003US20030152845 Mask blank, protective film therefor and method of patterning mask blank
08/14/2003US20030152813 Lanthanide series layered superlattice materials for integrated circuit appalications
08/14/2003US20030152783 Porous silica coating with low dielectric constant, semiconductor device and coating composition
08/14/2003US20030152714 Plasma thin-film deposition method
08/14/2003US20030152706 Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens
08/14/2003US20030152691 Aperture mask patterns; elongated web of flexible film; integrated circuits
08/14/2003US20030152445 Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
08/14/2003US20030152190 Exposing method and semiconductor device fabricated by the exposing method
08/14/2003US20030152130 Arrangement for temperature monitoring and regulation
08/14/2003US20030152123 Semiconductor laser element, semiconductor etchant, and method of fabricating the semiconductor laser element
08/14/2003US20030151948 Asymmetric band-gap engineered nonvolatile memory device
08/14/2003US20030151944 Magnetic switching element and a magnetic memory
08/14/2003US20030151941 Methods of reading ferroelectric memory cells
08/14/2003US20030151881 First conductive layer has a plurality of interleaved inductors; second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.
08/14/2003US20030151865 Electrostatic discharge protection circuit
08/14/2003US20030151822 Laser optical apparatus
08/14/2003US20030151750 Compensating for effects of variations in gas refractivity in interferometers
08/14/2003US20030151748 Scanning exposure method and apparatus, and device manufacturing method using the same
08/14/2003US20030151733 Method of calibrating and using a semiconductor processing system
08/14/2003US20030151730 Exposure apparatus and method, and device fabricating method using the same
08/14/2003US20030151650 Droplet ejection apparatus, a pattern formation apparatus, a wiring formation apparatus, a pattern formation medium, a droplet ejection method, a patterning method and a wiring formation method
08/14/2003US20030151539 Extraction of a binary code based on physical parameters of an integrated circuit
08/14/2003US20030151448 Negative voltage output charge pump circuit
08/14/2003US20030151444 Semiconductor device malfunction preventive circuit
08/14/2003US20030151439 Integrated circuit device implementing 90-degree phase shifter capable of generating output signals having phase difference therebetween at improved accuracy
08/14/2003US20030151421 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
08/14/2003US20030151372 RF plasma processing method and RF plasma processing system
08/14/2003US20030151371 Plasma processing apparatus and method for confining an RF plasma under very high gas flow and RF power Density conditions
08/14/2003US20030151360 Light-emitting device and method of manufacturing the same
08/14/2003US20030151358 Organic EL display device
08/14/2003US20030151314 Two-phase excitation linear motor
08/14/2003US20030151268 Intelligent integrated circuit wafer handling system with fail safe system
08/14/2003US20030151149 Semiconductor device
08/14/2003US20030151145 Method and components for flip-chip bonding
08/14/2003US20030151144 Semiconductor device and method of manufacturing semiconductor device
08/14/2003US20030151142 Subresolution features for a semiconductor device
08/14/2003US20030151141 External connection terminal and semiconductor device
08/14/2003US20030151140 Bump structure of a flip chip type semiconductor element mounted face down
08/14/2003US20030151135 Circuit device and manufacturing method of circuit device
08/14/2003US20030151129 Method and apparatus for conducting heat in a flip-chip assembly
08/14/2003US20030151119 Semiconductor device and method of manufacturing the same
08/14/2003US20030151118 Aperture masks for circuit fabrication
08/14/2003US20030151116 Semiconductor device incorporating elements formed of refractory metal-silicon-nitrogen and method for fabrication
08/14/2003US20030151115 Semiconductor device and production method therefor
08/14/2003US20030151112 Semiconductor device having one of patterned SOI and SON structure
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