Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/21/2003US20030157755 Method of manufacturing semiconductor device
08/21/2003US20030157754 Semiconductor device and fabrication method thereof
08/21/2003US20030157752 Method for producing an antifuse and antifuse for the selective electrical connection of adjacent conductive regions
08/21/2003US20030157750 has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation
08/21/2003US20030157748 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
08/21/2003US20030157747 Semiconductor build-up package
08/21/2003US20030157746 Composite structure for electronic microsystems and method for production of said composite structure
08/21/2003US20030157745 Silicon carbide semiconductor devices with a regrown contact layer
08/21/2003US20030157743 Process for forming a storage electrode
08/21/2003US20030157741 Display apparatus and its manufacturing method
08/21/2003US20030157739 Electrically pumped long-wavelength vcsel and methods of fabrication
08/21/2003US20030157738 Method for manufacturing gallium nitride compound semiconductor
08/21/2003US20030157736 Semiconductor processing device, semiconductor processing system and semiconductor processing management method
08/21/2003US20030157735 Thermal characterization compensation
08/21/2003US20030157734 Method of patterning ferroelectric layers
08/21/2003US20030157733 Method of molecular-scale pattern imprinting at surfaces
08/21/2003US20030157453 Boat for heat treatment and vertical heat treatment apparatus
08/21/2003US20030157440 Process of forming a micro-pattern of a metal or a metal oxide
08/21/2003US20030157438 Forming a first UBM (under ball metallurgy) over an active surface of wafer; second UBM is formed over first UBM; part of second UBM is removed to expose first UBM; solders are formed to cover second UBM and first UBM not covered by second UBM
08/21/2003US20030157437 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module
08/21/2003US20030157436 Method for forming a hard mask in a layer on a planar device
08/21/2003US20030157431 Photoresists useful in micro-lithography; for pattern formation on semiconductor wafers
08/21/2003US20030157430 Fluorine-containing photosensitive polymer having hydrate structure and resist composition comprising the same
08/21/2003US20030157428 Photoresist compositions particularly suitable for short wavelength imaging
08/21/2003US20030157426 Glass frit wafer bonding process and packages formed thereby
08/21/2003US20030157424 Can form ultrafine resist patterns of not more than half a micron in photolithography
08/21/2003US20030157423 Copolymer, polymer mixture, and radiation-sensitive resin composition
08/21/2003US20030157376 III-V nitride substrate boule and method of making and using the same
08/21/2003US20030157359 Metal plate and method of shaping the same
08/21/2003US20030157341 Efficiency
08/21/2003US20030157340 Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
08/21/2003US20030157311 Mesoporous films having reduced dielectric constants
08/21/2003US20030157272 Method of manufacturing integrated circuit, and substrate with integrated circuit formed by the method of manufacturing integrated circuit
08/21/2003US20030157267 Providing a porous dielectric material; plasma curing the porous dielectric material with a fluorine-free plasma gas to produce fluorine-free plasma cured porous dielectric material
08/21/2003US20030157250 Hyrdrothermal treatment of nanostructured films
08/21/2003US20030157248 Mesoporous materials and methods
08/21/2003US20030157034 Dental acid etchant composition and method of use
08/21/2003US20030156969 Coupling electroconductive pads
08/21/2003US20030156928 Local store for a wafer processing station
08/21/2003US20030156804 Hermetic high frequency module and method for producing the same
08/21/2003US20030156749 Pattern inspecting apparatus and pattern inspecting method
08/21/2003US20030156743 Fingerprint sensor apparatus and manufacturing method thereof
08/21/2003US20030156680 Arrangement for storing and transporting at least one optical component
08/21/2003US20030156610 Carbon doped GaAsSb suitable for use in tunnel junctions of long-wavelength VCSELs
08/21/2003US20030156460 Self-aligned split-gate flash memory cell and its contactless memory array
08/21/2003US20030156457 Memory device trapping charges in insulating film to store information in non-volatile manner
08/21/2003US20030156450 Semiconductor memory device using magnetoresistive effect
08/21/2003US20030156449 Thin film magnetic memory device having communication function, and distribution management system and manufacturing step management system each using thereof
08/21/2003US20030156448 Magnetic thin-film memory device for quick and stable reading data
08/21/2003US20030156444 Shared global word line magnetic random access memory
08/21/2003US20030156442 Semiconductor memory device and multi-chip module comprising the semiconductor memory device
08/21/2003US20030156402 Method for making a build-up package of a semiconductor die and structure formed from the same
08/21/2003US20030156380 Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same
08/21/2003US20030156378 Multilayer lithography
08/21/2003US20030156271 Mask holder for irradiating UV-rays
08/21/2003US20030156239 Display apparatus and method for manufacturing the same
08/21/2003US20030156084 Display apparatus in which characteristics of a plurality of transistors are made to differ from one another
08/21/2003US20030155962 Semiconductor device
08/21/2003US20030155941 Systems and methods for testing a plurality of circuit devices
08/21/2003US20030155908 Test mark and electronic device incorporating the same
08/21/2003US20030155821 Displacement device
08/21/2003US20030155820 Magnetically shielded linear motors, and stage apparatus comprising same
08/21/2003US20030155663 Adhesives, adhesive films and electric devices
08/21/2003US20030155662 Semiconductor device and fabrication method therefor
08/21/2003US20030155661 Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module
08/21/2003US20030155660 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/21/2003US20030155657 Manufacturing method of semiconductor device
08/21/2003US20030155654 Diamond pn junction diode and method for the fabrication thereof
08/21/2003US20030155652 Semiconductor device and its manufacturing method
08/21/2003US20030155651 Microwave monolithic integrated circuit package
08/21/2003US20030155648 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
08/21/2003US20030155647 Single substrate with package zones; bonding semiconductor chips; encapsulation; cutting apart
08/21/2003US20030155646 Chip-component accommodating device and examining apparatus having the same
08/21/2003US20030155645 Semiconductor device and manufacturing the same
08/21/2003US20030155644 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
08/21/2003US20030155642 Unique feature design enabling structural integrity for advanced low k semiconductor chips
08/21/2003US20030155640 Integrated circuit package
08/21/2003US20030155639 Multilayer; transparent substrate, light receiver chips, hermetic sealing with polymer, die bonding chips
08/21/2003US20030155638 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
08/21/2003US20030155636 Molded stiffener for thin substrates
08/21/2003US20030155630 Integrated inductive circuits
08/21/2003US20030155628 Low forward voltage drop schottky barrier diode and manufacturing method therefor
08/21/2003US20030155626 Photolithography process using multiple anti-reflective coatings
08/21/2003US20030155621 Semiconductor device and method for fabricating the same
08/21/2003US20030155620 Structure of semiconductor electronic device and method of manufacturing the same
08/21/2003US20030155619 Multilayer; intakes, drains, channels; complementary logic gates; gallium arsenide substarte overcoated with silicon, dielectric
08/21/2003US20030155618 Method of simultaneously making a pair of transistors with insulated grids having respectively a fine oxide and a thick oxide, and corresponding integrated circuit comprising such a pair of transistors
08/21/2003US20030155617 Integrated inductive circuits
08/21/2003US20030155616 Electro-optical device and semiconductor circuit
08/21/2003US20030155615 Structure of a semiconductor integrated circuit and method of manufacturing the same
08/21/2003US20030155614 Charge pump device; multilayer silicone stack
08/21/2003US20030155613 Semiconductor device and method of manufacturing the same
08/21/2003US20030155612 Display device
08/21/2003US20030155611 Process for fabricating a self-aligned vertical bipolar transistor
08/21/2003US20030155610 Semiconductor component with enhanced avalanche resistance
08/21/2003US20030155609 Self-aligned punch through stop for 6F2 rotated hybrid dram cell
08/21/2003US20030155608 Method for manufacturing flash memory device
08/21/2003US20030155607 Semiconductor integrated circuit
08/21/2003US20030155606 Method to alter chalcogenide glass for improved switching characteristics
08/21/2003US20030155604 Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
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