Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/23/2003US6624501 Capacitor and semiconductor device
09/23/2003US6624500 Thin-film electronic component and motherboard
09/23/2003US6624498 Micromagnetic device having alloy of cobalt, phosphorus and iron
09/23/2003US6624497 Semiconductor device with a reduced mask count buried layer
09/23/2003US6624496 Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
09/23/2003US6624495 Adjustable threshold isolation transistor
09/23/2003US6624494 Method for fabricating a power semiconductor device having a floating island voltage sustaining layer
09/23/2003US6624493 Biasing, operation and parasitic current limitation in single device equivalent to CMOS, and other semiconductor systems
09/23/2003US6624492 Semiconductor circuit device having gate array area and method of making thereof
09/23/2003US6624489 Formation of silicided shallow junctions using implant through metal technology and laser annealing process
09/23/2003US6624488 Epitaxial silicon growth and usage of epitaxial gate insulator for low power, high performance devices
09/23/2003US6624486 Method for low topography semiconductor device formation
09/23/2003US6624483 Semiconductor device having an insulated gate and a fabrication process thereof
09/23/2003US6624482 Method for creating a useful bipolar junction transistor from a parasitic bipolar junction transistor on a MOSFET
09/23/2003US6624480 Arrangements to reduce charging damage in structures of integrated circuits
09/23/2003US6624479 Semiconductor device having a protective circuit
09/23/2003US6624478 High mobility transistors in SOI and method for forming
09/23/2003US6624477 Semiconductor device and method for manufacturing the same
09/23/2003US6624476 Semiconductor-on-insulator (SOI) substrate having selective dopant implant in insulator layer and method of fabricating
09/23/2003US6624475 SOI low capacitance body contact
09/23/2003US6624474 Semiconductor device with scalable withstanding voltage
09/23/2003US6624473 Thin-film transistor, panel, and methods for producing them
09/23/2003US6624472 Semiconductor device with voltage sustaining zone
09/23/2003US6624470 Semiconductor device and a method for manufacturing same
09/23/2003US6624469 Vertical MOS transistor having body region formed by inclined ion implantation
09/23/2003US6624468 Semiconductor device including insulated gate field effect transistors
09/23/2003US6624466 Implant method for forming Si3N4 spacer
09/23/2003US6624465 Multi-layer spacer technology for flash EEPROM
09/23/2003US6624464 Highly integrated non-volatile memory cell array having a high program speed
09/23/2003US6624462 Dielectric film and method of fabricating the same
09/23/2003US6624461 Memory device
09/23/2003US6624460 Memory device with low resistance buried bit lines
09/23/2003US6624459 Silicon on insulator field effect transistors having shared body contact
09/23/2003US6624458 Semiconductor device having a ferroelectric capacitor and fabrication process thereof
09/23/2003US6624457 Stepped structure for a multi-rank, stacked polymer memory device and method of making same
09/23/2003US6624456 Frame shutter pixel with an isolated storage node
09/23/2003US6624455 Semiconductor device and method of manufacturing the same including drain pinned along channel width
09/23/2003US6624454 Semiconductor device having a flip-chip construction
09/23/2003US6624452 Gallium nitride-based HFET and a method for fabricating a gallium nitride-based HFET
09/23/2003US6624451 High frequency field effect transistor with carrier extraction to reduce intrinsic conduction
09/23/2003US6624450 Semiconductor device and method for forming the same
09/23/2003US6624446 Thin film transistor for liquid crystal display and method of manufacturing the same
09/23/2003US6624445 Semiconductor device and method of manufacturing the same
09/23/2003US6624443 Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation film
09/23/2003US6624441 Homoepitaxial layers of p-type zinc oxide and the fabrication thereof
09/23/2003US6624440 Field effect transistor
09/23/2003US6624430 Phase shifting using an apparatus having electron generators, focusing lenses and deflection controllers for adjustment of radiation beams
09/23/2003US6624426 Split magnetic lens for controlling a charged particle beam
09/23/2003US6624393 Method and apparatus for preparing semiconductor wafers for measurement
09/23/2003US6624216 Contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst; to protect and reinforce interconnections between an electronic component and a substrate in a microelectronic device
09/23/2003US6624095 Method for manufacturing a semiconductor device
09/23/2003US6624094 Method of manufacturing an interlayer dielectric film using vacuum ultraviolet CVD with Xe2 excimer lamp and silicon atoms
09/23/2003US6624093 Method of producing high dielectric insulator for integrated circuit
09/23/2003US6624092 Method for forming low dielectric constant insulating layer with foamed structure
09/23/2003US6624091 Methods of forming gap fill and layers formed thereby
09/23/2003US6624090 Method of forming plasma nitrided gate dielectric layers
09/23/2003US6624089 Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
09/23/2003US6624088 Method of forming low dielectric silicon oxynitride spacer films highly selective to etchants
09/23/2003US6624087 Etchant for patterning indium tin oxide and method of fabricating liquid crystal display device using the same
09/23/2003US6624086 Effective solution and process to wet-etch metal-alloy films in semiconductor processing
09/23/2003US6624085 Semiconductor structure, capacitor, mask and methods of manufacture thereof
09/23/2003US6624084 Plasma processing equipment and plasma processing method using the same
09/23/2003US6624083 Method for removing contaminant compounds respectively having benzene ring therein from surface of si layer and method for producing semiconductor device including step for removing contaminant compounds
09/23/2003US6624082 Systems and methods for two-sided etch of a semiconductor substrate
09/23/2003US6624081 Enhanced etching/smoothing of dielectric surfaces
09/23/2003US6624080 Method of fabricating nickel etching mask
09/23/2003US6624079 Method for forming high resistance resistor with integrated high voltage device process
09/23/2003US6624078 Methods for analyzing the effectiveness of wafer backside cleaning
09/23/2003US6624076 Semiconductor device and method for fabricating the same
09/23/2003US6624075 Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed
09/23/2003US6624074 Method of fabricating a semiconductor device by calcium doping a copper surface using a chemical solution
09/23/2003US6624073 Optimized TaCN thin film diffusion barrier for copper metallization
09/23/2003US6624072 Organometallic compound mixtures in chemical vapor deposition
09/23/2003US6624071 Pattern of an organic molecular film is formed on a substrate, a solution for forming a thin film applied, and the thin film is selectively formed on the organic molecular film pattern
09/23/2003US6624070 Plating catalysts
09/23/2003US6624069 Methods of forming integrated circuit capacitors having doped HSG electrodes
09/23/2003US6624068 Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography
09/23/2003US6624067 Process for removing a silicon-containing material through use of a byproduct generated during formation of a diffusion barrier layer
09/23/2003US6624066 Reliable interconnects with low via/contact resistance
09/23/2003US6624065 Method of fabricating a semiconductor device using a damascene metal gate
09/23/2003US6624064 Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application
09/23/2003US6624063 Semiconductor device having low dielectric layer and method of manufacturing thereof
09/23/2003US6624062 Wiring structure in semiconductor device and method for forming the same
09/23/2003US6624061 Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant film
09/23/2003US6624060 Method and apparatus for pretreating a substrate prior to electroplating
09/23/2003US6624059 Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond
09/23/2003US6624058 Semiconductor device and method for producing the same
09/23/2003US6624057 Method for making an access transistor
09/23/2003US6624055 Method for forming a plane structure
09/23/2003US6624054 Multi-layer structure for reducing capacitance and manufacturing method thereof
09/23/2003US6624053 Damascene-type interconnection structure and its production process
09/23/2003US6624052 Process for annealing semiconductors and/or integrated circuits
09/23/2003US6624051 Semiconductor thin film and semiconductor device
09/23/2003US6624050 Method of manufacturing semiconductor device
09/23/2003US6624049 Semiconductor device and method of manufacturing the same
09/23/2003US6624048 Die attach back grinding
09/23/2003US6624047 Substrate and method of manufacturing the same
09/23/2003US6624046 Three dimensional processor using transferred thin film circuits
09/23/2003US6624045 Thermal conducting trench in a seminconductor structure and method for forming the same
09/23/2003US6624044 Method for manufacturing semiconductor device having trench filled with polysilicon