Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/18/2003WO2003077308A1 Mold release layer transferring film and laminate film
09/18/2003WO2003077307A1 Electronic circuit device and porduction method therefor
09/18/2003WO2003077305A2 Method for making a semiconductor device by variable chemical mechanical polish downforce
09/18/2003WO2003077304A1 Plasma processing system and method for interrupting plasma processing
09/18/2003WO2003077303A1 Plasma processing method, seasoning end detection method, and plasma processing device
09/18/2003WO2003077302A1 Plasma processing device and plasma generating method
09/18/2003WO2003077301A1 Method of etching and etching apparatus
09/18/2003WO2003077300A1 Plasma processing apparatus
09/18/2003WO2003077298A1 Method of manufacturing nanowires and an electronic device
09/18/2003WO2003077297A1 Method for grinding rear surface of semiconductor wafer
09/18/2003WO2003077296A1 Dehydration drying method and apparatus, and substrate processing apparatus
09/18/2003WO2003077295A1 Method for dicing substrate
09/18/2003WO2003077294A1 Plasma processor
09/18/2003WO2003077293A1 High-frequency power supply structure and plasma cvd device using the same
09/18/2003WO2003077291A1 Semiconductor manufacturing method and device thereof
09/18/2003WO2003077290A1 Holder for semiconductor production system
09/18/2003WO2003077289A1 Radio-communication-adjustable apparatus, apparatus adjusting method, and apparatus adjusting system
09/18/2003WO2003077288A1 Substrate alignment apparatus
09/18/2003WO2003077285A2 Thin-film capacitor having multi-layer dielectric film including silicon dioxide and tantalum pentoxide
09/18/2003WO2003077258A2 Magnetic flux concentrating cladding material on conductive lines of mram
09/18/2003WO2003077257A1 Multi-stage per cell magnetoresistive random access memory
09/18/2003WO2003077078A2 Hub array system and method
09/18/2003WO2003077049A1 System for brokering fault detection data
09/18/2003WO2003077038A2 Reduced striae extreme ultraviolegt lithographic elements, a method of manufacturing the same and a method of measuring striae
09/18/2003WO2003077037A1 Refractive projection objective for immersion lithography
09/18/2003WO2003077036A1 High-aperture projection lens
09/18/2003WO2003077032A1 Method of passivating of low dielectric materials in wafer processing
09/18/2003WO2003077031A1 Lithography pattern shrink process and articles
09/18/2003WO2003077030A2 Detection of position and estimation of surface shape
09/18/2003WO2003077029A1 Negative photoresists for short wavelength imaging
09/18/2003WO2003077007A2 Objective lens consisting of crystal lenses
09/18/2003WO2003076978A2 Compensator for radially symmetric birefringence
09/18/2003WO2003076954A2 High resolution scanning magnetic microscope operable at high temperature
09/18/2003WO2003076891A2 Moiré method and measuring system for measuring the distortion of an optical imaging system
09/18/2003WO2003076538A1 Methanol-containing silica-based cmp compositions
09/18/2003WO2003076363A1 Method for manufacturing silicon carbide sintered compact jig and silicon carbide sintered compact jig manufactured by the method
09/18/2003WO2003076352A2 Method and apparatus for manufacturing silica-titania extreme ultraviolet elements
09/18/2003WO2003076330A2 Silicon carbide microelectromechanical devices with electronic circuitry
09/18/2003WO2003076141A1 End effecter for carrying sheet, carrier having the end effecter, and sheet processing system
09/18/2003WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
09/18/2003WO2003076120A1 Laser processing method
09/18/2003WO2003076119A1 Method of cutting processed object
09/18/2003WO2003076087A1 Electro-chemical cleaning process for electrical connectors
09/18/2003WO2003076086A1 Method and device for the decontamination of optical surfaces
09/18/2003WO2003076059A1 Gas mixer, gas reactor and surface modifying device
09/18/2003WO2003058158A3 Stereoscopic three-dimensional metrology system and method
09/18/2003WO2003044242A3 Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors
09/18/2003WO2003041144A3 Method for producing thin metal-containing layers having a low electrical resistance
09/18/2003WO2003041117A3 Integrated semiconductor component for conducting high-frequency measurements and the use thereof
09/18/2003WO2003038884A3 A method for bonding a pair of silicon wafers together and a semiconductor wafer
09/18/2003WO2003038864A3 Magneto-resistive bit structure and method of manufacturing therefor
09/18/2003WO2003034485A3 Multilevel poly-si tiling for semiconductor circuit manufacture
09/18/2003WO2003034484A3 A method for forming a layered semiconductor structure and corresponding structure
09/18/2003WO2003030246A3 Device for soldering contacts on semiconductor chips
09/18/2003WO2003019625A3 Method for thermally treating a substrate that comprises several layers
09/18/2003WO2003015121A3 Slit lens arrangement for particle beams
09/18/2003WO2003010805A3 Complementary iii-v structures and devices
09/18/2003WO2003009395A3 Multijunction solar cell
09/18/2003WO2003007355A3 Method for the production of contacts for integrated circuits and semiconductor component with said contacts
09/18/2003WO2003007349A3 High temperature substrate transfer robot
09/18/2003WO2003005411A3 Method for producing a stepped structure on a substrate
09/18/2003WO2002099873A3 Dual damascene multi-level metallization
09/18/2003WO2002099481A3 Semiconductor structure for an optically switched integrated device
09/18/2003WO2002095799A3 Thin films and production methods thereof
09/18/2003WO2002093201B1 Preferred crystal orientation optical elements from cubic materials
09/18/2003WO2002078054A3 Integrated circuit package with a capacitor
09/18/2003WO2002061806A3 Dram cell having a capacitor structure fabricated partially in a cavity and method for operating same
09/18/2003WO2002058153A9 Back illuminated imager with enhanced uv to near ir sensitivity
09/18/2003WO2002049103A3 Microelectronic package having bumpless laminated interconnection layer
09/18/2003WO2002035903A3 Electronic component, component mounting equipment, and component mounting method
09/18/2003US20030177468 Method of verifying IC mask sets
09/18/2003US20030177467 Opc mask manufacturing method, opc mask, and chip
09/18/2003US20030177464 Intergrated circuit layout method and program thereof permitting wire delay adjustment
09/18/2003US20030177462 Circuit design method and computer program product
09/18/2003US20030177461 Integrated circuit layout method and program for mitigating effect due to voltage drop of power supply wiring
09/18/2003US20030177459 Method of optimizing high performance CMOS integrated circuit designs for power consumption and speed
09/18/2003US20030177454 Method and program for designing semiconductor integrated circuits
09/18/2003US20030177423 Tranmission device, reception device, test circuit, and test method
09/18/2003US20030177415 Self-testing circuit in semiconductor memory device
09/18/2003US20030176979 For in-situ control of water content in hot phosphoric acid baths
09/18/2003US20030176623 Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components
09/18/2003US20030176599 Using an encapsulant-forming thermosetting resin (an epoxy resin) and an anhydride as crosslinker for the resin, crosslinks with resin that acts as a fluxing agent for soldering
09/18/2003US20030176408 For topical application, penetration
09/18/2003US20030176081 Chemical mechanical polishing of a metal layer with polishing rate monitoring
09/18/2003US20030176080 Hermetic silicon carbide
09/18/2003US20030176079 Periodic clamping method and apparatus to reduce thermal stress in a wafer
09/18/2003US20030176078 Substrate treating method and apparatus
09/18/2003US20030176077 Method for fabricating semiconductor capacitors
09/18/2003US20030176076 Methods of forming protective segments of material, and etch stops
09/18/2003US20030176075 Techniques for plasma etching silicon-germanium
09/18/2003US20030176074 Tandem etch chamber plasma processing system
09/18/2003US20030176073 Plasma etching of Ir and PZT using a hard mask and C12/N2/O2 and C12/CHF3/O2 chemistry
09/18/2003US20030176072 Polishing compositions for noble metals
09/18/2003US20030176070 Methods of forming protective seqments of material, and etch stops
09/18/2003US20030176069 Plasma processing apparatus and plasma processing method
09/18/2003US20030176068 Chemical mechanical polishing composition and process
09/18/2003US20030176067 Selectively etching integrated circuit dies having copper, using nonmetal halide gases and radiation beams, while supplying oxygen, nitrous oxide or ozone as scavengers; corrosion resistance
09/18/2003US20030176065 Aluminum-containing material and atomic layer deposition methods
09/18/2003US20030176064 Pre-ECD wet surface modification to improve wettability and reduce void defect
09/18/2003US20030176063 Lamination structure with copper wiring and its manufacture method
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