Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/12/2003WO2003075360A1 Magnetoresistive switch effect element and magnetosensitive device comprising it
09/12/2003WO2003075359A1 Semiconductor storage device
09/12/2003WO2003075358A1 Semiconductor storage
09/12/2003WO2003075357A1 Soi mosfet junction degradation using multiple buried amorphous layers
09/12/2003WO2003075356A1 Contact portion of semiconductor device, and method for manufacturing the same, thin film transistor array panel for display device including the contact portion, and method for manufacturing the same
09/12/2003WO2003075355A1 Self-aligning method for producing a double-gate mosfet
09/12/2003WO2003075353A1 Semiconductor device
09/12/2003WO2003075352A1 Semiconductor device and production method therefor
09/12/2003WO2003075350A1 Integrated read-only memory, method for operating said read-only memory and corresponding production method
09/12/2003WO2003075349A1 Stacked die semiconductor device
09/12/2003WO2003075345A2 Raised extension structure for high performance cmos
09/12/2003WO2003075343A1 Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate
09/12/2003WO2003075340A2 Method for obtaining metal to metal contact between a metal surface and a bonding pad.
09/12/2003WO2003075339A1 B-stageable underfill encapsulant and method for its application
09/12/2003WO2003075338A1 Underfill encapsulant for wafer packaging and method for its application
09/12/2003WO2003075337A1 Fluxless assembly of chip size semiconductor packages
09/12/2003WO2003075336A1 Process for producing silicon single crystal layer and silicon single crystal layer
09/12/2003WO2003075335A1 Method for forming thin film
09/12/2003WO2003075334A1 Method for dry etching a semiconductor wafer
09/12/2003WO2003075333A1 Electrode for dry etching a wafer
09/12/2003WO2003075332A1 Polishing composition and method for forming wiring structure
09/12/2003WO2003075331A1 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
09/12/2003WO2003075329A2 Method of forming a semiconductor device having an energy absorbing layer and corresponding structure
09/12/2003WO2003075326A2 A semiconductor device having different metal-semiconductor portions formed in a semiconductor region and a method for fabricating the semiconductor device
09/12/2003WO2003075325A1 Pedestal for mounting semiconductor fabrication equipments
09/12/2003WO2003075324A1 A method for the wet treatment of disk-like objects
09/12/2003WO2003075323A2 Device and method for anisotropically plasma etching a substrate
09/12/2003WO2003075321A2 An apparatus and method for measuring a property of a layer in a multilayered structure
09/12/2003WO2003075319A2 Self-aligned transistor and diode topologies
09/12/2003WO2003075279A1 A memory cell
09/12/2003WO2003075202A2 Association of process context with configuration document for manufacturing process
09/12/2003WO2003075190A1 Back end of line clone test vehicle
09/12/2003WO2003075099A2 Method and system for overlay measurement
09/12/2003WO2003075098A2 Prevention of contamination of optical elements and cleaning said elements
09/12/2003WO2003075096A2 Refractive projection lens
09/12/2003WO2003075094A1 Fluorinated copolymers for microlithography
09/12/2003WO2003075093A1 Halogenated anti-reflective coatings
09/12/2003WO2003075068A1 Lighting system comprising a nested collector for annularly illuminating an exit pupil
09/12/2003WO2003075049A2 Refractive projection objective
09/12/2003WO2003075028A1 Integrated circuit with test circuit
09/12/2003WO2003075026A1 Device with board abnormality detecting circuit
09/12/2003WO2003075025A1 Electronic component testing apparatus
09/12/2003WO2003075024A1 Insert and electronic component handler comprising it
09/12/2003WO2003075023A1 Electronic part test apparatus
09/12/2003WO2003074974A2 Evaluating a multi-layered structure for voids
09/12/2003WO2003074759A1 Apparatus for manufacturing semiconductor or liquid crystal
09/12/2003WO2003074756A1 Disk-like member holding device
09/12/2003WO2003074755A1 Method for formation of titanium nitride films
09/12/2003WO2003074601A2 Printing of organic conductive polymers containing additives
09/12/2003WO2003074228A1 Advanced chemical mechanical polishing system with smart endpoint detection
09/12/2003WO2003050864A3 Method for copper cmp using polymeric complexing agents
09/12/2003WO2003049186A3 Transistor metal gate structure that minimizes non-planarity effects and method of formation
09/12/2003WO2003049182A3 Process for optically erasing charge buildup during fabrication of an integrated circuit
09/12/2003WO2003041133A3 Electrothermal self-latching mems switch and method
09/12/2003WO2003034470A3 Semiconductor structure with improved smaller forward voltage loss and higher blocking capability
09/12/2003WO2003030225A3 Semiconductor chip with multiple rows of bond pads
09/12/2003WO2003028090A3 Integration of barrier layer and seed layer
09/12/2003WO2003021661B1 Process for making a mim capacitor
09/12/2003WO2003017334A3 Dynamic control of wafer processing paths in semiconductor manufacturing processes
09/12/2003WO2003006718B1 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
09/12/2003WO2003001572A3 Positioning device
09/12/2003WO2002103776A3 Method for relating photolithography overlay target damage and chemical mechanical planarization (cmp) fault detection to cmp tool identification
09/12/2003WO2002101828A3 Method for melting down solder material that is applied to connection points
09/12/2003WO2002097869A3 Method and apparatus to correct wafer drift
09/12/2003WO2002086622A3 Ion-beam deposition process for manufacturing binary photomask blanks
09/12/2003WO2002086621A3 Ion-beam deposition process for manufacturing multilayered attenuated phase shift photomask blanks
09/12/2003WO2002086620A3 Ion-beam deposition process for manufacturing attenuated phase shift photomask blanks
09/12/2003WO2002060643A9 Spherical drive assembly for chemical mechanical planarization
09/12/2003WO2002050890A3 Electroconductive connection between a chip and a coupling element in addition to a security element containing a connection of said type
09/12/2003WO2002044816A3 Antireflective layer for use in microlithography
09/12/2003WO2002044441A3 Method and device for the metered delivery of low volumetric flows
09/12/2003WO2002041677A3 Cooling device, method for the production thereof, and device for carrying out this method
09/11/2003WO2003075342A2 Methodology for repeatable post etch cd in a production tool
09/11/2003WO2003075330A1 Method of forming different silicide portions on different silicon-containing regions in a semiconductor device
09/11/2003WO2003074995A2 Method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes and systems for accomplishing same
09/11/2003US20030172365 Chip arrangement determining apparatus and method
09/11/2003US20030172364 Software programmable multiple function integrated circuit module
09/11/2003US20030172332 Systems and methods for facilitating testing of pad drivers of integrated circuits
09/11/2003US20030171972 Scheduling system and method
09/11/2003US20030171885 System for brokering fault detection data
09/11/2003US20030171837 Semiconductor fabricating apparatus
09/11/2003US20030171836 Semiconductor manufacturing apparatus, management apparatus therefor, component management apparatus therefor, and semiconductor wafer storage vessel transport apparatus
09/11/2003US20030171490 Polymer blend and associated methods of preparation and use
09/11/2003US20030171456 Epoxy resins
09/11/2003US20030171081 Polishing pad
09/11/2003US20030171076 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
09/11/2003US20030171075 Method for processing semiconductor wafer and semiconductor wafer
09/11/2003US20030171071 Polishing apparatus
09/11/2003US20030171070 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
09/11/2003US20030171008 Method for aligning structures on a semiconductor substrate
09/11/2003US20030171007 1:1 Projection system and method for laser irradiating semiconductor films
09/11/2003US20030171005 Semiconductor device and manufacturing method thereof
09/11/2003US20030171004 Deposition method of dielecrtric films having a low dielectric constant
09/11/2003US20030171003 Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
09/11/2003US20030171002 Method of manufacturing a semiconductor device and method of forming a film
09/11/2003US20030171001 Method of manufacturing semiconductor devices
09/11/2003US20030171000 Method for reducing reactive ion etching (RIE) lag in semiconductor fabrication processes
09/11/2003US20030170998 Etching method of hardly-etched material and semiconductor fabricating method and apparatus using the method
09/11/2003US20030170997 Method for removing Si-needles of wafer
09/11/2003US20030170994 Planarizing method for fabricating gate electrodes
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