Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/30/2003US6627366 Electron beam exposure method having good linearity with respect to producing fine patterns
09/30/2003US6627360 Carbonization process for an etch mask
09/30/2003US6627357 Reticle
09/30/2003US6627263 Film forming apparatus and film forming method
09/30/2003US6627115 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
09/30/2003US6627093 Method of manufacturing a vertical metal connection in an integrated circuit
09/30/2003US6627067 Rapid, reliable and inexpensive characterization of such as nucleic acids; increased temperature, bias voltage operating range and chemical environment accommodation; reduced noise levels; durable
09/30/2003US6627056 Method and apparatus for ionized plasma deposition
09/30/2003US6627052 Electroplating apparatus with vertical electrical contact
09/30/2003US6627050 Method and apparatus for depositing a tantalum-containing layer on a substrate
09/30/2003US6627039 Plasma processing methods and apparatus
09/30/2003US6627038 Processing chamber
09/30/2003US6627037 Method of detaching article fixed through pressure sensitive adhesive double coated sheet
09/30/2003US6627020 Method for sinter distortion control
09/30/2003US6627001 Method for cleaning a semiconductor wafer
09/30/2003US6626998 Plasma generator assembly for use in CVD and PECVD processes
09/30/2003US6626994 Silicon wafer for epitaxial wafer, epitaxial wafer, and method of manufacture thereof
09/30/2003US6626968 For manufacturing semiconductor device
09/30/2003US6626967 Polishing composition and polishing method employing it
09/30/2003US6626739 Polishing method and polishing apparatus
09/30/2003US6626734 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
09/30/2003US6626656 Apparatus for encasing array packages
09/30/2003US6626280 Tray-positioning device
09/30/2003US6626236 Substrate temperature control plate and substrate temperature control apparatus comprising same
09/30/2003US6626189 Method of processing substrates using pressurized mist generation
09/30/2003US6626187 Cleaning the reaction chamber by removing high molecular weight micro-particles; inserting a photoresist coated wafer and introducing a mixture of hydrogen and nitrogen; reacting the gases with photoresist on the dummy
09/30/2003US6626186 Method for stabilizing the internal surface of a PECVD process chamber
09/30/2003US6625901 Apparatus and method for drying a thin substrate
09/30/2003US6625899 Vacuum processing apparatus
09/30/2003US6625898 Variable method and apparatus for alignment of automated workpiece handling systems
09/30/2003US6625883 Method for making a bump structure
09/30/2003US6625882 System and method for reinforcing a bond pad
09/30/2003US6625880 Method for producing printed wiring board
09/30/2003US6625862 Method of manufacturing a processing apparatus
09/30/2003US6625836 Apparatus and method for cleaning substrate
09/30/2003US6625835 Disk cascade scrubber
09/30/2003CA2313155C Group iii-v nitride semiconductor growth method and vapor phase growth apparatus
09/26/2003CA2423527A1 Method for forming micro groove structure
09/26/2003CA2413666A1 Charge-giving body, and pattern-formed body using the same
09/25/2003WO2003079566A2 Drain activated/deactivated ac coupled bandpass rf switch
09/25/2003WO2003079463A2 Programmable structure, an array including the structure, and methods of forming the same
09/25/2003WO2003079456A1 Method for producing substrate material and semiconductor device including plasma processing
09/25/2003WO2003079455A1 Lateral junctiion field-effect transistor and its manufacturing method
09/25/2003WO2003079454A1 Detector arrangement, method for the detection of electrical charge carriers and use of an ono field effect transistor of r detection of an electrical charge
09/25/2003WO2003079453A1 Trench dmos transistor having improved trench structure
09/25/2003WO2003079452A1 Three dimensional integrated circuits using sub-micron thin-film diodes
09/25/2003WO2003079451A1 Gate dielectric and method therefor
09/25/2003WO2003079447A1 Process for producing bonding wafer
09/25/2003WO2003079446A1 Hard mask process for memory device without bitline shorts
09/25/2003WO2003079445A1 Complementary schottky junction transistors and methods of forming the same
09/25/2003WO2003079444A1 Semiconductor device and its manufacturing method
09/25/2003WO2003079441A1 Active matrix display devices, and their manufacture
09/25/2003WO2003079440A1 Active matrix electroluminescent display devices, and their manufacture
09/25/2003WO2003079439A2 Chip stack with intermediate cavity
09/25/2003WO2003079437A2 Semiconductor device having a bond pad and method therefor
09/25/2003WO2003079434A2 Semiconductor device having a wire bond pad and method therefor
09/25/2003WO2003079431A1 Semiconductor device and its manufacturing method, circuit board, and electric apparatus
09/25/2003WO2003079430A1 Semiconductor device and its manufacturing method, circuit board and electronic apparatus
09/25/2003WO2003079429A1 Production method for semiconductor integrated circuit device
09/25/2003WO2003079428A1 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
09/25/2003WO2003079426A1 Ozone treating method and ozone treating system
09/25/2003WO2003079425A1 Methods used in fabricating gates in integrated circuit device structures
09/25/2003WO2003079424A1 Method for fabricating a semiconductor device having different metal silicide portions
09/25/2003WO2003079423A1 Thermally induced reflectivity switch for laser thermal processing
09/25/2003WO2003079422A1 Vaporizer, various devices using the same, and vaporizing method
09/25/2003WO2003079421A1 Method of depositing cvd thin film
09/25/2003WO2003079420A1 Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire
09/25/2003WO2003079419A1 Mask storage device, exposure device, and device manufacturing method
09/25/2003WO2003079417A2 Mim capacitor with metal nitride electrode materials and method of formation
09/25/2003WO2003079416A1 Laser assisted direct imprint lithography
09/25/2003WO2003079415A2 Methods for fabricating strained layers on semiconductor substrates
09/25/2003WO2003079413A2 High k dielectric film and method for making
09/25/2003WO2003079412A2 Facilities connection bucket for pre-facilitation of wafer fabrication equipment
09/25/2003WO2003079411A2 Use of light emitting chemical reactions for control of semiconductor production processes
09/25/2003WO2003079410A2 Supporting control gate connection on a package using additional bumps
09/25/2003WO2003079407A2 Wafer-level coated copper stud bumps
09/25/2003WO2003079405A2 Method for forming thin film layers by simultaneous doping and sintering
09/25/2003WO2003079404A2 An improved substrate holder for plasma processing
09/25/2003WO2003079374A2 Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles
09/25/2003WO2003079367A1 Semiconductor memory device and control method of semiconductor memory device
09/25/2003WO2003079366A2 Self-aligned via contact for magnetic memory element
09/25/2003WO2003079365A1 Data storage circuit, data write method in the data storage circuit, and data storage device
09/25/2003WO2003079364A1 Magnetic storage device using ferromagnetic tunnel junction element
09/25/2003WO2003079292A1 Defect inspection method
09/25/2003WO2003079240A2 System and method for placement of dummy metal fills while preserving device matching and/or limiting capacitance increase
09/25/2003WO2003079117A1 Full phase shifting mask in damascene process
09/25/2003WO2003079112A1 Method of producing an etch-resistant polymer structure using electron beam lithography
09/25/2003WO2003078987A1 Mutli-detector defect detection system and a method for detecting defects
09/25/2003WO2003078910A1 Electric heater for thermal treatment furnace
09/25/2003WO2003078859A2 Reinforced chemical mechanical planarization belt
09/25/2003WO2003078698A1 Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it
09/25/2003WO2003078688A1 Porous material and process for producing the same
09/25/2003WO2003078681A1 Device for depositing thin layers on a substrate
09/25/2003WO2003078678A1 Method for forming interconnection metal layer, method for selectively forming metal, apparatus for selectively forming metal, and substrate apparatus
09/25/2003WO2003078677A2 Device for targeted application of deposition material to a substrate
09/25/2003WO2003078301A2 Micro-electromechanical systems
09/25/2003WO2003078104A1 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
09/25/2003WO2003078103A1 Polishing equipment, and method of manufacturing semiconductor device using the equipment
09/25/2003WO2003054957A3 Electronic component and method for producing the same
09/25/2003WO2003052817B1 Method of bonding and transferring a material to form a semiconductor device