Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/25/2003US20030178723 Semiconductor device and method of manufacturing the same
09/25/2003US20030178721 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
09/25/2003US20030178718 Hermetically enhanced plastic package for microelectronics and manufacturing process
09/25/2003US20030178716 Light thin stacked package semiconductor device and process for fabrication thereof
09/25/2003US20030178715 Multilayer; substrates, passivation layer, adhesive
09/25/2003US20030178714 Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
09/25/2003US20030178709 Method of manufacturing semiconductor device
09/25/2003US20030178708 Leadframe and method for manufacturing resin-molded semiconductor device
09/25/2003US20030178706 Semiconductor integrated circuit
09/25/2003US20030178702 Light emitting semiconductor device and method of fabricating the same
09/25/2003US20030178701 Devices with patterned wells and method for forming same
09/25/2003US20030178700 Silicon bipolar transistor, circuit arrangement and method for production of a silicon bipolar transistor
09/25/2003US20030178697 Prevent impurities from being generated by contactors while etching dielectric
09/25/2003US20030178696 Multilayer; dielectrics, electrodes, spacers
09/25/2003US20030178692 Reduced terminal testing system
09/25/2003US20030178690 Titanium boride gate electrode and interconnect
09/25/2003US20030178689 Asymmetric semiconductor device having dual work function gate and method of fabrication
09/25/2003US20030178688 Stacked spacer structure and process
09/25/2003US20030178687 Mask read-only memory and fabrication thereof
09/25/2003US20030178686 Stacked capacitor-type semiconductor storage device and manufacturing method thereof
09/25/2003US20030178685 Arsenic dopes; controlling concentration; creep resistance
09/25/2003US20030178684 Semiconductor device and method for fabricating the same
09/25/2003US20030178683 Semiconductor device
09/25/2003US20030178682 Semiconductor device and method of manufacturing the semiconductor device
09/25/2003US20030178681 Strained fin FETs structure and method
09/25/2003US20030178680 Silicon-on-insulator structure and method of reducing backside drain-induced barrier lowering
09/25/2003US20030178679 Semiconductor device and method of manufacturing the same
09/25/2003US20030178678 Doping methods for fully-depleted soi structures, and device comprising the resulting doped regions
09/25/2003US20030178677 Dielectric overcoating silicone substrate; positioning barrier; strain layer at interface
09/25/2003US20030178675 Semiconductor device and method of manufacturing same
09/25/2003US20030178674 Semiconductor device and its manufacturing method
09/25/2003US20030178673 Structures of and methods of fabricating trench-gated MIS devices
09/25/2003US20030178671 Semiconductor memory device and manufacturing method thereof
09/25/2003US20030178670 Finfet CMOS with NVRAM capability
09/25/2003US20030178669 Storage of electrical charges; multilayer, semiconductor substrate, channel zones, embedded barrier, dielectric
09/25/2003US20030178668 Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried bit-line and raised source line, and a memory array made thereby
09/25/2003US20030178666 Semiconductor device with analog capacitor and method of fabricating the same
09/25/2003US20030178665 Semiconductor device with improved capacitive element and method of forming the same
09/25/2003US20030178664 Method of making non volatile memory with a protective metal line
09/25/2003US20030178663 Semiconductor device and method of manufacturing the same
09/25/2003US20030178662 Trench cell for a DRAM cell array
09/25/2003US20030178661 Memory cell structure with trench capacitor and method for fabrication thereof
09/25/2003US20030178660 Semiconductor memory cell and semiconductor memory device
09/25/2003US20030178659 Semiconductor device and method of manufacturing the same
09/25/2003US20030178658 Semiconductor memory and method of manufacture thereof
09/25/2003US20030178656 Manufacturing method of electro line for liquid crystal display device
09/25/2003US20030178655 Dual sided power amplifier
09/25/2003US20030178652 Non-volatile memory device and fabrication method thereof
09/25/2003US20030178651 Charge-coupled device and method of fabricating the same
09/25/2003US20030178650 Display device
09/25/2003US20030178647 Semiconductor device with dummy patterns
09/25/2003US20030178646 High-voltage transistor with buried conduction layer
09/25/2003US20030178644 Reinforced bond-pad substructure and method for fabricating the same
09/25/2003US20030178640 Semiconductor device and method of manufacturing the same
09/25/2003US20030178639 Inductive storage capacitor
09/25/2003US20030178638 Semiconductor mounting system
09/25/2003US20030178637 Method for integrating compound semiconductor with substrate or high thermal conductivity
09/25/2003US20030178634 Method for manufacturing gallium nitride compound semiconductor
09/25/2003US20030178633 Doped group III-V nitride materials, and microelectronic devices and device precursor structures comprising same
09/25/2003US20030178629 Semiconductor light emission element, semiconductor composite element and process for producing semiconductor light emission element
09/25/2003US20030178626 Semiconductor light-emitting element and method of manufacturing the same
09/25/2003US20030178624 Semiconductor device with minimal short-channel effects and low bit-line resistance
09/25/2003US20030178622 Biased, triple-well fully depleted SOI structure, and various methods of making and operating same
09/25/2003US20030178618 Semiconductor device, method of manufacturing the same, and apparatus for manufacturing semiconductor
09/25/2003US20030178587 Chemical-mechanical polishing apparatus and method for controlling the same
09/25/2003US20030178579 Stage devices exhibiting reduced deformation, and microlithography systems comprising same
09/25/2003US20030178551 Image sensor apparatus having additional display device function
09/25/2003US20030178475 Method and apparatus for attaching a workpiece to a workpiece support
09/25/2003US20030178474 Integrated circuit assemblies and assembly methods
09/25/2003US20030178473 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
09/25/2003US20030178471 Solid conductive element insertion apparatus
09/25/2003US20030178469 Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder
09/25/2003US20030178468 Stage structure in bonding machine and method for controlling the same
09/25/2003US20030178447 Liquid crystal dispensing apparatus
09/25/2003US20030178403 Method and system for locally connecting microstructures and devices formed thereby
09/25/2003US20030178390 System and method for enhanced monitoring of an etch process
09/25/2003US20030178389 Method of forming via metal layers and via metal layer-formed substrate
09/25/2003US20030178379 Substrate holding apparatus
09/25/2003US20030178320 Comprises acid (phosphoric, sulfuric, perchloric, and/or acetic) based electrolytes, chelate agent (ethylenediamine), and corrosion inhibitor (benzotriazole)
09/25/2003US20030178319 For removing conductors of the top conductive surfaces of workpieces (copper) by applying etching solution in presence of current, forming easily removable intermediate (copper chloride)
09/25/2003US20030178315 Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
09/25/2003US20030178313 Permits placed layer of uniform thickness to be formed over particles without aggregating in plating solution; semiconductors
09/25/2003US20030178299 Rotation-magnetron-in-magnetron (RMIM) electrode, method of manufacturing the RMIM electrode, and sputtering apparatus including the RMIM electrode
09/25/2003US20030178229 Multilayered printed wiring board
09/25/2003US20030178216 Structure of retaining cut-processed components, method of fabricating cut-processed components, tray for housing cut-processed components, and method of cleaning cut-processed components
09/25/2003US20030178177 Heatsink buffer configuration
09/25/2003US20030178147 Film-shaped adhesive application apparatus
09/25/2003US20030178146 Article holders that use gas vortices to hold an article in a desired position
09/25/2003US20030178145 Closed hole edge lift pin and susceptor for wafer process chambers
09/25/2003US20030178142 Apparatus for treating wafers, provided with a sensor box
09/25/2003US20030178141 Semiconductor chamber process apparatus and method
09/25/2003US20030178140 Plasma processing apparatus capable of evaluating process performance
09/25/2003US20030178134 Apparatus and method for fabricating bonded substrate
09/25/2003US20030178132 Method for manufacturing connection structure
09/25/2003US20030178095 Liquid crystal dispensing apparatus
09/25/2003US20030178049 Megasonic cleaning apparatus for fabricating semiconductor device
09/25/2003US20030178047 Comprises isopropyl alcohol/nitrogen gas spouting nozzle; semiconductors
09/25/2003US20030178046 Apparatus and method for removing particles from wafer pods
09/25/2003US20030177981 Reducing maintainence; forming cut out on interior circum-ferential edge to increase spacing from chuck
09/25/2003US20030177980 Method for reducing semiconductor resistance, device for reducing semiconductor resistance and semiconductor element
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