Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/25/2003US20030177977 Gas-admission element for CVD processes, and device
09/25/2003US20030177659 High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus
09/25/2003US20030177636 Method of manufacturing power light emitting diodes
09/25/2003US20030177633 Electronic component mounting apparatus and electronic component mounting method
09/25/2003DE10206149C1 Bitline contact plug formation method for flash memory manufacture, involves forming contact hole in inter-layered dielectric layer that covers conductive layer and fills gap between respective gate conducting structures
09/25/2003CA2708358A1 Lateral junction field effect transistor and method of manufacturing the same
09/25/2003CA2465340A1 Lateral junction field effect transistor and method of manufacturing the same
09/24/2003EP1347516A2 Semiconductor device
09/24/2003EP1347514A2 Semiconductor device
09/24/2003EP1347512A2 Improved heatsink buffer configuration
09/24/2003EP1347511A1 Method for manufacturing a MOS transistor and MOS transistor.
09/24/2003EP1347510A1 Wiring-inclusive structure and forming method thereof
09/24/2003EP1347509A2 Method to improve sti nano gap fill and moat nitride pull back
09/24/2003EP1347508A1 Method of heat treatment of silicon wafer doped with boron
09/24/2003EP1347507A1 Dielectric film and method of forming it, semiconductor device, nonvolatile semiconductor memory device, and production method for semiconductor device
09/24/2003EP1347506A1 Semiconductor device and its manufacturing method
09/24/2003EP1347505A2 Method of preparing semiconductor member using an etching solution
09/24/2003EP1347504A2 Process for producing semiconducting bodies with a layer sequence deposited by MOVPE
09/24/2003EP1347503A2 Semiconductor device and method for manufacturing the same
09/24/2003EP1347502A2 Lead-based perovskite buffer layer for forming epitaxial indium phosphide on silicon
09/24/2003EP1347501A1 Wavefront aberration measuring instrument, wavefront aberration measuring method, exposure apparatus, and method for manufacturing microdevice
09/24/2003EP1347500A2 Semiconductor device and method of manufacturing the same
09/24/2003EP1347499A2 Semiconductor device and method of manufacturing the same
09/24/2003EP1347498A2 Stage alignment apparatus and control method therefor
09/24/2003EP1347497A2 Waferrack
09/24/2003EP1347496A2 Substrate treating apparatus and substrate treating method
09/24/2003EP1347478A2 Micromachined parallel-plate variable capacitor with plate suspension
09/24/2003EP1347461A1 Device for x-ray lithography
09/24/2003EP1347407A2 Capacitance detection type sensor and manufacturing method thereof
09/24/2003EP1347340A2 Exposure device
09/24/2003EP1347339A1 Photoresist residue remover composition
09/24/2003EP1347337A2 Compensating for cable drag forces acting on a high precision stage
09/24/2003EP1347336A1 Interferometer system and lithographic apparatus comprising such a system
09/24/2003EP1347335A1 Positive resist composition
09/24/2003EP1347334A1 Photoresist compositions
09/24/2003EP1347083A1 Silicon single crystal wafer and method for producing silicon single crystal
09/24/2003EP1347082A1 Method and apparatus for growing single crystal
09/24/2003EP1347025A1 Wafer machining adhesive tape, and its manufacturing method and using method
09/24/2003EP1346793A1 Method and apparatus for determining the vectorial distance between the bonding capillary and the image recognition system in a wire bonder
09/24/2003EP1346607A2 Resistive heaters and uses thereof
09/24/2003EP1346478A1 Architecture for field programmable gate array
09/24/2003EP1346417A2 Trench schottky barrier rectifier and method of making the same
09/24/2003EP1346415A2 Semiconductor device layout
09/24/2003EP1346409A2 Ic package pressure release apparatus and method
09/24/2003EP1346408A2 Interconnect structures and a method of electroless introduction of interconnect structures
09/24/2003EP1346407A2 Method for eliminating reaction between photoresist and organosilicate glass
09/24/2003EP1346406A1 Method for the manufacture of a semiconductor device with a field-effect transistor
09/24/2003EP1346405A1 Method for making an island of material confined between electrodes, and application to transistors
09/24/2003EP1346404A2 Process for removing an oxide during the fabrication of a resistor
09/24/2003EP1346403A2 Method for producing a microelectronic component and component produced according to said method
09/24/2003EP1346402A1 Method for producing a stacked structure
09/24/2003EP1346401A2 Multi-layer pt electrode for dram and fram with high k dielectric materials
09/24/2003EP1346400A2 Chamber for uniform substrate heating
09/24/2003EP1346399A2 Semiconductor compliant substrate having a graded monocrystalline layer
09/24/2003EP1346394A1 Electrode for plasma processes and method for manufacture and use thereof
09/24/2003EP1346369A1 Semiconductor device comprising eeprom and a flash-eprom
09/24/2003EP1346367A1 A ferroelectric memory circuit and method for its fabrication
09/24/2003EP1346266A1 Robot motion compensation system
09/24/2003EP1346262A1 Self-compensating mark arangement for stepper alignment
09/24/2003EP1346261A1 Projection lithography using a phase shifting aperture
09/24/2003EP1346085A1 Methods and apparatus for producing m'n based materials
09/24/2003EP1346083A2 Electrochemical co-deposition of metals for electronic device manufacture
09/24/2003EP1346078A1 Fullerene coated component of semiconductor processing equipment
09/24/2003EP1346076A2 Low contamination plasma chamber components and methods for making the same
09/24/2003EP1346003A2 Cerium-based abrasive, production process thereof
09/24/2003EP1345848A2 Composition comprising an oxidizing and complexing compound
09/24/2003EP1345842A2 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
09/24/2003EP1345828A1 Fims interface without alignment pins
09/24/2003EP1345735A1 Method and apparatus for chemical-mechanical polishing (cmp) using upstream and downstream fluid dispensing means
09/24/2003EP1345733A1 Methods for making reinforced wafer polshing pads and apparatuses implementing the same
09/24/2003EP1345727A1 Controlled attenuation capillary with planar surface
09/24/2003EP1345703A1 Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof
09/24/2003EP1345701A2 Centrifugal type contaminant collector trap for ion implanter
09/24/2003EP1345665A1 Apparatus and method for extracting biomass
09/24/2003EP1171912B1 Method for the vertical integration of electric components by reverse side contacting
09/24/2003EP1161322A4 Improved polishing pads and methods relating thereto
09/24/2003EP1090535A4 Flip chip devices with flexible conductive adhesive
09/24/2003EP1001006B1 Aqueous composition, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid
09/24/2003EP0970156B1 Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films
09/24/2003CN2575853Y Improved connector
09/24/2003CN1444774A Method for producing multi-bit memory cell
09/24/2003CN1444773A Integrated capacitive device with hydrogen degradable dielectric layer protected by getter layer
09/24/2003CN1444740A Method for improved developing process in wafer photolithography
09/24/2003CN1444518A Mold cleaning sheet and method of producing semiconductor devices using the same
09/24/2003CN1444494A Methods utilizing scanning probe microscope tips and products therefor or produced thereby
09/24/2003CN1444436A Printed circuit board and making method thereof
09/24/2003CN1444427A Luminous device and its making method
09/24/2003CN1444424A Device making method and apparatus, device and electronic machine thereof
09/24/2003CN1444355A Transport system
09/24/2003CN1444293A Method for mfg. semiconductor device and semiconductor device
09/24/2003CN1444289A Diode with high load-carrying ability, its preparation method and application
09/24/2003CN1444287A Solid camera element and its mfg. method
09/24/2003CN1444286A Charge transfer device
09/24/2003CN1444285A Semiconductor element and semiconductor device using said element
09/24/2003CN1444284A Semiconductor storage with electric potential control circuit
09/24/2003CN1444282A Multi-crystal storage structure, method for forming said structure and semiconductor storage device using said structure
09/24/2003CN1444281A Film semiconductor device and method for mfg. said device
09/24/2003CN1444280A Semiconductor device and its mfg. method
09/24/2003CN1444279A Semiconductor device and its mfg. method
09/24/2003CN1444276A Semiconductor device and method for making the same