Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/23/2003US6624043 Metal gate CMOS and method of manufacturing the same
09/23/2003US6624042 Fabrication process for a semiconductor component
09/23/2003US6624041 Method for forming trench type isolation film using annealing
09/23/2003US6624040 Self-integrated vertical MIM capacitor in the dual damascene process
09/23/2003US6624039 Alignment mark having a protective oxide layer for use with shallow trench isolation
09/23/2003US6624038 Capacitor electrode having uneven surface formed by using hemispherical grained silicon
09/23/2003US6624037 XE preamorphizing implantation
09/23/2003US6624036 Transistor in semiconductor device and method of manufacturing the same
09/23/2003US6624035 Method of forming a hard mask for halo implants
09/23/2003US6624034 Method of making field effect transistor in which the increase of parasitic capacitance is restrained by scale reduction
09/23/2003US6624033 Trench DRAM cell with vertical device and buried word lines
09/23/2003US6624032 Structure and process flow for fabrication of dual gate floating body integrated MOS transistors
09/23/2003US6624030 Method of fabricating power rectifier device having a laterally graded P-N junction for a channel region
09/23/2003US6624029 Method of fabricating a self-aligned non-volatile memory cell
09/23/2003US6624028 Method of fabricating poly spacer gate structure
09/23/2003US6624027 Ultra small thin windows in floating gate transistors defined by lost nitride spacers
09/23/2003US6624026 Nonvolatile memory
09/23/2003US6624025 Method with trench source to increase the coupling of source to floating gate in split gate flash
09/23/2003US6624024 Method and apparatus for a flash memory device comprising a source local interconnect
09/23/2003US6624023 Method for improving the performance of flash memory
09/23/2003US6624022 Method of forming FLASH memory
09/23/2003US6624021 Method for forming gate segments for an integrated circuit
09/23/2003US6624020 Fabrication method of semiconductor device with capacitor
09/23/2003US6624019 Merged memory and logic semiconductor device of salicided dual gate structure including embedded memory of self-aligned contact structure and manufacturing method thereof
09/23/2003US6624018 Method of fabricating a DRAM device featuring alternate fin type capacitor structures
09/23/2003US6624017 Manufacturing process of a germanium implanted HBT bipolar transistor
09/23/2003US6624016 Method of fabricating trench isolation structures with extended buffer spacers
09/23/2003US6624015 Method for manufacturing electronic devices having non-volatile memory cells and LV transistors with salicided junctions
09/23/2003US6624014 Process for fabricating a deep submicron complementary metal oxide semiconductor device having ultra shallow junctions
09/23/2003US6624013 Method for manufacturing a semiconductor device
09/23/2003US6624012 Semiconductor device and method of manufacturing thereof
09/23/2003US6624010 Method of manufacturing semiconductor device having thin film SOI structure
09/23/2003US6624009 Forming a crystalline semiconductor film on a glass substrate
09/23/2003US6624008 Semiconductor chip installing tape, semiconductor device and a method for fabricating thereof
09/23/2003US6624007 Method of making leadframe by mechanical processing
09/23/2003US6624005 Semiconductor memory cards and method of making same
09/23/2003US6624004 Flip chip interconnected structure and a fabrication method thereof
09/23/2003US6623996 Method of measuring contact alignment in a semiconductor device including an integrated circuit
09/23/2003US6623993 Method of determining the time for polishing the surface of an integrated circuit wafer
09/23/2003US6623991 Method of measuring meso-scale structures on wafers
09/23/2003US6623989 Nonvolatile ferroelectric memory and method for fabricating the same
09/23/2003US6623988 Method for fabricating ferroelectric capacitor of semiconductor device
09/23/2003US6623987 Passivated magneto-resistive bit structure and passivation method therefor
09/23/2003US6623986 Method of manufacturing a ferroelectric memory device
09/23/2003US6623985 Structure of and manufacturing method for semiconductor device employing ferroelectric substance
09/23/2003US6623912 Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist
09/23/2003US6623895 Optically transferring lithography patterns
09/23/2003US6623877 Usable for substrate of semiconductor device such as light-emitting diode or high speed IC chip
09/23/2003US6623865 Candidate materials for electronic and optoelectronic applications, such as ferroelectric memory devices, pyroelectric sensor devices, waveguide modulators and acoustic sensors
09/23/2003US6623856 Dental glass powders comprising spherical glass particles of specific particle size distribution
09/23/2003US6623803 Copper interconnect stamping
09/23/2003US6623800 Method for forming composite vapor-deposited film having varied film composition at initial and final stages of vapor deposition, composite vapor-deposition material for producing the same, and method for producing the composite vapor-deposition material
09/23/2003US6623799 Iodine or bromine containing catalyst
09/23/2003US6623798 Chemical vapor deposition method for depositing silicide and apparatus for performing the same
09/23/2003US6623711 Formed via catalytic hydrolysis and condensing of cyclic and/or cage-shape siloxanes (such as 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane); heat/crack resistance
09/23/2003US6623654 Thin interface layer to improve copper etch stop
09/23/2003US6623653 System and method for etching adjoining layers of silicon and indium tin oxide
09/23/2003US6623609 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
09/23/2003US6623606 Method and apparatus for sputter coating with variable target to substrate spacing
09/23/2003US6623605 Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
09/23/2003US6623597 Focus ring and apparatus for processing a semiconductor wafer comprising the same
09/23/2003US6623596 Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
09/23/2003US6623594 Hot-melt sheet for holding and protecting semiconductor wafers and method for applying the same
09/23/2003US6623592 Methods for application of adhesive tape to semiconductor devices
09/23/2003US6623579 Methods and apparatus for fluidic self assembly
09/23/2003US6623577 Electric component compression bonding machine and method
09/23/2003US6623560 Crystal growth method
09/23/2003US6623355 Methods, apparatus and slurries for chemical mechanical planarization
09/23/2003US6623344 Wafer polishing apparatus
09/23/2003US6623343 System and method for CMP head having multi-pressure annular zone subcarrier material removal control
09/23/2003US6623337 Base-pad for a polishing pad
09/23/2003US6623334 Chemical mechanical polishing with friction-based control
09/23/2003US6623333 System and method for controlling a wafer polishing process
09/23/2003US6623331 Polishing disk with end-point detection port
09/23/2003US6623269 Temperature in each heating zone is maintained after transporting the object from chamber to chamber; independence of each thermal treatment zone by means of a movable shutter and insulation
09/23/2003US6623248 System for conveying liquids without pulsing
09/23/2003US6623235 Robot arm edge gripping device for handling substrates using two four-bar linkages
09/23/2003US6623231 Plant for producing semiconductor products
09/23/2003US6623051 Laterally floating latch hub assembly
09/23/2003US6622907 Sacrificial seed layer process for forming C4 solder bumps
09/23/2003US6622883 Door for wafer container having rotatable cammed member and movable links
09/23/2003US6622845 Transport system and method for controlling the transport system
09/23/2003US6622738 Apparatus and system for removing photoresist through the use of hot deionized water bath, water vapor and ozone gas
09/23/2003US6622737 Rinser/dryer housing is rotated by a rotor motor, fluids are distributed across by centrifugal force
09/23/2003US6622603 Linear via punch
09/23/2003US6622399 Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components
09/23/2003US6622398 Destroying ozone with UV light
09/23/2003US6622335 Drip manifold for uniform chemical delivery
09/23/2003US6622334 Wafer edge cleaning utilizing polish pad material
09/23/2003CA2267492C Formation of thin film resistors
09/23/2003CA2057744C Multichip module
09/20/2003CA2421110A1 Electronic micro-component integrating a capacitive structure and manufacturing process
09/18/2003WO2003077621A1 Method and apparatus for encapsulating semiconductor device
09/18/2003WO2003077618A2 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
09/18/2003WO2003077598A1 System and method for lamp split zone control
09/18/2003WO2003077322A2 H-bridge with single lead frame
09/18/2003WO2003077321A2 Schottky power diode comprising a sicoi substrate and the method of producing one such diode
09/18/2003WO2003077313A2 Multilayered ceramic substrate for integrated power components and method for the production of said substrate
09/18/2003WO2003077311A1 Method and resulting structure for manufacturing semiconductor substrate
09/18/2003WO2003077310A1 Semiconductor device and its manufacturing method
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