Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/01/2003EP0724652B1 Method and apparatus for sputtering magnetic target materials
10/01/2003EP0643883B1 Sub-nanoscale electronic circuit and process for manufacturing the same
10/01/2003CN1446403A Apparatus and circuit having reduced leakage current and method therefor
10/01/2003CN1446378A Memory cell, memory cell device and method for production thereof
10/01/2003CN1446377A Electronic component and method of manufacture
10/01/2003CN1446375A Ball limiting mtallurgy for input/outputs and methods of fabrication
10/01/2003CN1446374A Low-dielectric silicon nitride film and method of making the same, seimiconductor device and fabrication process thereof
10/01/2003CN1446373A Device and method for processing substrate
10/01/2003CN1446142A Method for processing semiconductor wafer using double-side polishing
10/01/2003CN1446127A Inverted pressure vessel with shielded closure mechanism
10/01/2003CN1446033A Electroluminescence display device and manufacturing method thereof
10/01/2003CN1446028A Distribution base plate, electronic device, electrooptics device and electronic instrument
10/01/2003CN1445930A Level drift circuit and active matrix driver
10/01/2003CN1445870A Semiconductor luminous device
10/01/2003CN1445862A Top-gate type thin film transistor
10/01/2003CN1445860A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445859A Mounting structure and method of integrated circuit device
10/01/2003CN1445858A Nonvolatile memory and its manufacturing method
10/01/2003CN1445857A Silicon nitride read only memory structure possessing protection diode and its operation method
10/01/2003CN1445856A 半导体器件 Semiconductor devices
10/01/2003CN1445855A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445854A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445853A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445852A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445851A Light-thin laminated packaged semiconductor device and manufacturing process thereof
10/01/2003CN1445848A Semiconductor device and its manufacturing method and phase-shift mask
10/01/2003CN1445847A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445846A Chip ratio package and manufacturing method thereof
10/01/2003CN1445845A Chip ratio package and manufacturing method thereof
10/01/2003CN1445844A Chip ratio package and manufacturing method thereof
10/01/2003CN1445843A Semiconductor package with non-oxide copper-wire
10/01/2003CN1445842A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445839A Method for manufacturing fast flash memory with coupling rate increased
10/01/2003CN1445838A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445837A 半导体集成电路 The semiconductor integrated circuit
10/01/2003CN1445836A Method for manufacturing semiconductor device containing low dielectric constant isolation film
10/01/2003CN1445835A Shallow ridges isolation semiconductor and its manufacture
10/01/2003CN1445834A Semiconductor device and method for providing low substrate capacitor area
10/01/2003CN1445833A Detection device, testing device of semiconductor device and testing method
10/01/2003CN1445832A Connecting lines structure in multiple metal layers and method for testing intensity of dielectric layer between metal layers
10/01/2003CN1445831A Cavity type method for packaging micro-electronics circuit
10/01/2003CN1445830A Method for manufacturing discrete type circuit components
10/01/2003CN1445829A Wafer type encapsulation and its preparing method
10/01/2003CN1445828A Schottky shielding dioe with low straightforward voltage drop and its producing method
10/01/2003CN1445827A Electric liquid processing device
10/01/2003CN1445826A Method for cleaning plasma processing device
10/01/2003CN1445825A Device for cleaning single type chips
10/01/2003CN1445824A Method for preparing lugs and glue stuff layer
10/01/2003CN1445823A Protection structure of gate electrode pad in power semiconductor equipment and its manufacturing method
10/01/2003CN1445822A Semiconductor manufacturing device, semiconductor manufacturing system and substrate processing method
10/01/2003CN1445821A Forming method of ZnO film and ZnO semiconductor layer, semiconductor element and manufacturing method thereof
10/01/2003CN1445820A Film forming method and device manufactured by the method and manufacturing method of device
10/01/2003CN1445818A Multiple-layer type dielectric antireflection layer and its forming method
10/01/2003CN1445817A Method and device for epitaxial coating semiconductor chip, and semiconductor chip opitaxial coated
10/01/2003CN1445811A Sputtering device and its electrode and manufacturing method of the electrode
10/01/2003CN1445785A 半导体存储器 Semiconductor memory
10/01/2003CN1445783A Wirte circuit structure of magnetic memory array of separated multiple memory blocks
10/01/2003CN1445782A Storage device array magnetic bit with of with sharing one common line
10/01/2003CN1445781A Magnetoresistive storage device with double-tunnel junction
10/01/2003CN1445716A Method for manufacturing surface shape recognising sensor
10/01/2003CN1445709A Production managment method and method for manufacturing electronic equipment
10/01/2003CN1445613A Method for manufacturing photoetching apparatus and device
10/01/2003CN1445612A Method for manufacturing photoetching equipment and device
10/01/2003CN1445611A 曝光方法及装置 Exposure method and apparatus
10/01/2003CN1445610A Improved lighting system for micro-offset printing
10/01/2003CN1445609A Method for manufacturing offset printing apparatus and device
10/01/2003CN1445605A Method for manufacturing device, manufactured device and affset printing device
10/01/2003CN1445593A Cabinet for storing substrate
10/01/2003CN1445590A Equipment for curing sealant
10/01/2003CN1445585A Device and method for manufacturing joint substrate
10/01/2003CN1445537A Capacitance investigating type sensor and production method thereof
10/01/2003CN1445060A Burnishing device
10/01/2003CN1123073C Method for recovering surface ready silicon carbide substrate
10/01/2003CN1123072C Dynamic random access storage unit apparatus and producing method therefor
10/01/2003CN1123071C Hybrid semiconductor substrate
10/01/2003CN1123070C Grid unit of turn off SCR hard exciting grating
10/01/2003CN1123069C Encapsulation of phtoelectric element and manufacturing method thereof
10/01/2003CN1123068C Lead frame manufacturing method
10/01/2003CN1123067C Semiconductor device having semiconductor chip electrically connected to wiring substrate
10/01/2003CN1123066C Apparatus and method for manufacturing electronic components with project electrodes
10/01/2003CN1123065C Process for preparation of silicon wafers having controlled distribution of oxygen precipitate nucleation centers
10/01/2003CN1123064C Thin film forming method and semiconductor light emitting device manufacturing method
10/01/2003CN1123063C Towered organisator and towered forming method
10/01/2003CN1123062C Multilayered electrostatic chuck and method of manufacture thereof
10/01/2003CN1123052C Method and apparatus for ionized physical vapor deposition
10/01/2003CN1123051C Method for ion beam transport and ion implantation apparatus
10/01/2003CN1122933C Sputtering apparatus simulation method
10/01/2003CN1122876C Photomask blanks
10/01/2003CN1122480C Cleaning rotary brush
09/2003
09/30/2003US6629303 Semiconductor device layout
09/30/2003US6629300 CAD system for an ASIC
09/30/2003US6629295 Design automation method and device
09/30/2003US6629293 Block based design methodology
09/30/2003US6629277 LSSD interface
09/30/2003US6629258 Variable speed data access control circuit with exponential length wait cycle
09/30/2003US6629250 Adjustable data delay using programmable clock shift
09/30/2003US6629053 Method and apparatus for determining substrate offset using optimization techniques
09/30/2003US6629013 System and method to reduce bond program errors of integrated circuit bonders
09/30/2003US6629012 Wafer-less qualification of a processing tool
09/30/2003US6629009 Management system for semiconductor fabrication device
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