Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/18/2003US20030173065 Method for producing a structural member from plates stacked on top of each other and soldered together
09/18/2003US20030173035 Bonding apparatus, and bonding method
09/18/2003US20030173031 Wafer holder with peripheral lift ring
09/18/2003US20030173030 Plasma processing apparatus
09/18/2003US20030173029 Plasma processing apparatus
09/18/2003US20030173027 Deposit removing apparatus and deposit removing method
09/18/2003US20030173017 Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
09/18/2003US20030172955 Processing apparatus and substrate processing method
09/18/2003US20030172954 Methods and apparatuses for drying wafer
09/18/2003US20030172952 Method of cleaning a plasma processing apparatus
09/18/2003US20030172874 Mechanism and method for supporting substrate to be coated with film
09/18/2003US20030172869 Method for preparing low-resistant p-type srtio3
09/18/2003US20030172866 Method for recrystallizing an amorphized silicon germanium film overlying silicon
09/18/2003US20030172865 Silicon single crystal wafer having void denuded zone on the surface and diameter of above 300mm and its production method
09/18/2003US20030172713 Trap apparatus
09/18/2003US20030172657 Fluid temperature control apparatus
09/18/2003US20030172544 Apparatus for hardening sealant
09/18/2003US20030172542 Low-pressure dryer and low-pressure drying method
09/18/2003US20030172527 Automated trim processing system
09/18/2003US20030172508 Rapid cycle chamber having a top vent with nitrogen purge
09/18/2003DE4345413C2 Mfg. semiconductor component with first film on substrate
09/18/2003CA2478657A1 Method of producing silicon carbide sintered body jig, and silicon carbide sintered body jig obtained by the production method
09/17/2003EP1345328A2 General-purpose logic array and ASIC using the same
09/17/2003EP1345275A1 Method for roughening semiconductor surface
09/17/2003EP1345273A1 Dual bit multi-level ballistic monos memory, and manufacturing method, programming, and operation process for the memory
09/17/2003EP1345272A1 Production method for soi wafer and soi wafer
09/17/2003EP1345271A1 Process for manufacturing electric circuits
09/17/2003EP1345270A2 Semiconductor device and manufacturing method for the same
09/17/2003EP1345263A1 Electronic device and method of manufacturing the electronic device
09/17/2003EP1345262A1 Method for producing silicon wafer and silicon wafer
09/17/2003EP1345261A1 Pattern forming method and device and semiconductor device, electric circuit, display element module and luminous element
09/17/2003EP1345260A1 Vapor growth method, semiconductor producing method, and production method for semiconductor device
09/17/2003EP1345259A2 Polycrystalline memory structure, method for forming same structure, and semiconductor memory device using same structure
09/17/2003EP1345258A2 Semiconductor device and method of manufacturing the same
09/17/2003EP1345257A2 Method for fabricating capacitor device
09/17/2003EP1345256A2 Method and apparatus for batch processing of wafers in a furnace
09/17/2003EP1345255A2 Multilevel pedestal for furnace
09/17/2003EP1345254A2 Process tube support sleeve with circumferential channels
09/17/2003EP1345253A2 Semiconductor manufacturing equipment and maintenance method
09/17/2003EP1345252A2 Mounting part of a wheel of a substrate holder with built in/anchored substrate holder
09/17/2003EP1345235A1 Programmable non-volatile bidirectional switch for programmable logic
09/17/2003EP1345232A2 Magnetoresistive data storage device
09/17/2003EP1345231A1 Double magnetic tunnelling junction cell with reference layers dynamically set
09/17/2003EP1345230A2 Diode for data storage device
09/17/2003EP1345083A2 Management of reaction forces in a lithography system
09/17/2003EP1345082A1 Lithographic apparatus and device manufacturing method
09/17/2003EP1345032A2 High speed method of measuring the threshold voltage and surface doping
09/17/2003EP1344849A1 ELECTROLYTIC COPPER PLATING METHOD, ELECTROLYTIC COPPER PLATING−USE PHOSPHORUS−CONTAINING COPPER ANODE AND SEMICONDUCTOR WAFER WITH LITTLE PARTICLES DEPOSITION PLATED BY USING THEM
09/17/2003EP1344842A2 Method and apparatus for production of metal film
09/17/2003EP1344789A2 Thermosetting resin composition containing malemide and/or vinyl compounds
09/17/2003EP1344441A1 Magazine, tray component feeding device, and component mounting device
09/17/2003EP1344258A2 Device for detecting three-dimensional electromagnetic radiation and method for making same
09/17/2003EP1344257A2 Trench gate fermi-threshold field effect transistors and methods of fabricating the same
09/17/2003EP1344256A2 Semiconductor device and equipment for communication system
09/17/2003EP1344252A2 Gate length control for semiconductor chip design
09/17/2003EP1344250A2 Memory cell with vertical floating gate transistor
09/17/2003EP1344249A1 Method for making a stacked structure comprising a thin film adhering to a target substrate
09/17/2003EP1344248A2 Mechanically reinforced highly porous low dielectric constant films
09/17/2003EP1344247A2 Surface preparation prior to deposition
09/17/2003EP1344246A2 Method for making a substrate in particular for optics, electronics or optoelectronics and resulting substrate
09/17/2003EP1344245A1 Method for producing a solid body comprising a microstructure
09/17/2003EP1344244A2 Reduction of damage in semiconductor container capacitors
09/17/2003EP1344243A1 Method and device for treating semiconductor substrates
09/17/2003EP1344242A2 In-process wafer charge monitor and control system for ion implanter
09/17/2003EP1344222A2 Method for reading out or in a status from or to a ferroelectrical transistor of a memory cell and memory matrix
09/17/2003EP1344113A2 Process for removal of photoresist after post ion implantation
09/17/2003EP1344112A2 Projection lens
09/17/2003EP1344111A1 Objective with at least one aspherical lens
09/17/2003EP1344110A1 Mitigation of radiation induced surface contamination
09/17/2003EP1344109A2 Onium salts and the use therof as latent acids
09/17/2003EP1344108A1 Optical recording materials
09/17/2003EP1344107A2 Structure and method of correcting proximity effects in a tri-tone attenuated phase-shifting mask
09/17/2003EP1344071A1 Asynchronous reset circuit testing
09/17/2003EP1344035A2 Integrated cmos capacitive pressure sensor
09/17/2003EP1344018A1 Particle-optical inspection device especially for semiconductor wafers
09/17/2003EP1343927A2 Gallium nitride materials and methods for forming layers thereof
09/17/2003EP1091829B1 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
09/17/2003EP1026749B1 Method of manufacturing a semiconductor device and semiconductor device obtainable thereby
09/17/2003EP1019946B1 Device for coating panel-shaped substrates
09/17/2003EP0996767B1 Reflective surface for cvd reactor walls
09/17/2003EP0960439B1 Antifuse based on silicided polysilicon bipolar transistor
09/17/2003EP0932912B1 Conductive layer with anti-reflective surface portion
09/17/2003EP0909461B1 Method for simplifying the manufacture of an interlayer dielectric stack
09/17/2003EP0883899B1 Process for determining the crystal orientation in a wafer
09/17/2003EP0875077B1 A SEMICONDUCTOR DEVICE WITH A LOW RESISTANCE OHMIC CONTACT BETWEEN A METAL LAYER AND A SiC-LAYER
09/17/2003CN2574215Y Nanotube probe structure for testing IC
09/17/2003CN2574214Y Device for forming packaged integrated circuit
09/17/2003CN2573509Y 热处理装置 Heat treatment device
09/17/2003CN1443373A Fabrication of semiconductor materials and devices with controlled electrical conductivity
09/17/2003CN1443372A Power MOSFET and method of making same
09/17/2003CN1443371A Configuration in power MOSFET
09/17/2003CN1443370A 半导体装置 Semiconductor device
09/17/2003CN1443368A Method for contacting semiconductor component
09/17/2003CN1443367A Bimetallic grid transistor for CMOS procedure
09/17/2003CN1443366A Formation of boride barrier layers using chemisorption techniques
09/17/2003CN1443365A Electronic chip component comprising integrated circuit and method for producing same
09/17/2003CN1443364A Method and system for providing single-scan, continuous motion sequential lateral solidification
09/17/2003CN1443363A Semiconductor mfg. apparatus detecting state of connection between controllers
09/17/2003CN1443362A Multilayered capacitor structure with alternately connected concentric lines for deep submicron CMOS
09/17/2003CN1443315A Photoresist composition for deep UV and process thereof
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