Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/18/2003US20030173684 Wafer-level coated copper stud bumps
09/18/2003US20030173683 Semiconductor device and method of manufacturing thereof
09/18/2003US20030173682 Supporting control gate connection on a package using additional bumps
09/18/2003US20030173681 Supporting control gate connection on a package using additional bumps
09/18/2003US20030173679 Stacked dice standoffs
09/18/2003US20030173678 Semiconductor device and method for fabricating the same
09/18/2003US20030173677 Semiconductor device having a capacitor and method for the manufacture thereof
09/18/2003US20030173675 Semiconductor device, method of manufacturing the same, and phase shift mask
09/18/2003US20030173674 Semiconductor device and method for fabricating the same
09/18/2003US20030173672 Semiconductor devices and methods for manufacturing the same
09/18/2003US20030173671 Semiconductor device and manufacturing method for the same
09/18/2003US20030173669 Three dimensional integrated circuits using sub-micron thin-film diodes
09/18/2003US20030173668 Semiconductor device having a bond pad and method therefor
09/18/2003US20030173667 Semiconductor device having a bond pad and method therefor
09/18/2003US20030173666 Semiconductor device
09/18/2003US20030173665 Support ring for use with a contact pad and semiconductor device compoents including the same
09/18/2003US20030173664 Semiconductor package and production method thereof
09/18/2003US20030173662 Electronic equipment having electronic part mounted on printed circuit board with under-fill material
09/18/2003US20030173661 Contact structure and production method thereof and probe contact assembly using same
09/18/2003US20030173659 Semiconductor package having oxidation-free copper wire
09/18/2003US20030173658 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
09/18/2003US20030173656 Semiconductor device and method of manufacturing the same
09/18/2003US20030173653 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030173652 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030173651 Method of making a semiconductor device using a damascene interconnect with a laminated dielectric
09/18/2003US20030173646 Non-volatile semiconductor memory structure and method of manufacture
09/18/2003US20030173644 Semiconductor integrated circuit device
09/18/2003US20030173642 General-purpose logic array and ASIC using the same
09/18/2003US20030173641 Semiconductor device with STI and its manufacture
09/18/2003US20030173639 Semiconductor with high-voltage components and low-voltage components on a shared die
09/18/2003US20030173638 Semiconductor device
09/18/2003US20030173637 Semiconductor device having a wire bond pad and method therefor
09/18/2003US20030173636 Compound semiconductor protection device for low voltage and high speed data lines
09/18/2003US20030173635 Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
09/18/2003US20030173631 Semiconductor device for providing a noise shield
09/18/2003US20030173629 Semiconductor apparatus
09/18/2003US20030173628 Semiconductor device
09/18/2003US20030173625 SRAM System having very lightly doped SRAM load transistors for improving SRAM cell stability and method for same
09/18/2003US20030173624 High breakdown voltage low on-resistance lateral DMOS transistor
09/18/2003US20030173623 Semiconductor integrated circuit device
09/18/2003US20030173621 Etch-stopped SOI back-gate contact
09/18/2003US20030173620 Offset-gate-type semiconductor device
09/18/2003US20030173617 Semiconductor device and method of manufacturing the same
09/18/2003US20030173616 Nonvolatile semiconductor memory device and method for fabricating the same
09/18/2003US20030173615 Flash memory array integrally formed with another device and method of manufacture therefor
09/18/2003US20030173614 Semiconductor integrated circuit device and manufacturing method thereof
09/18/2003US20030173613 Memory-storage node and the method of fabricating the same
09/18/2003US20030173611 Vertical transistor comprising a mobile gate and a method for the production thereof
09/18/2003US20030173610 Semiconductor device and manufacturing method of the same
09/18/2003US20030173609 Charge pump device
09/18/2003US20030173608 Three dimensional structure integrated circuit
09/18/2003US20030173606 Semiconductor storage device including nonvolatile ferroelectric memory
09/18/2003US20030173605 Semiconductor device and method of manufacturing the same
09/18/2003US20030173604 Semiconductor device and method of manufacturing the same
09/18/2003US20030173601 Functional device and method of manufacturing the same
09/18/2003US20030173600 Method of fabricating non-volatile ferroelectric transistors
09/18/2003US20030173599 Semiconductor device and fabrication method therefor
09/18/2003US20030173597 Semiconductor device
09/18/2003US20030173594 Voltage converter having switching element with variable substrate potential
09/18/2003US20030173593 Semiconductor memory device
09/18/2003US20030173592 Antifuse structure and method of making
09/18/2003US20030173591 Radiation-hardened silicon-on-insulator CMOS device, and method of making the same
09/18/2003US20030173590 Thin semiconductor chip and method of manufacturing the same
09/18/2003US20030173589 Contact for integrated circuit, and corresponding fabrication method
09/18/2003US20030173588 Method of modeling and producing an integrated circuit including at least one transistor and corresponding integrated circuit
09/18/2003US20030173587 Assembly of semiconductor device and wiring substrate
09/18/2003US20030173586 Semiconductor device and method for manufacture thereof
09/18/2003US20030173585 Semiconductor device having solid-state image sensor with suppressed variation in impurity concentration distribution within semiconductor substrate, and method of manufacturing the same
09/18/2003US20030173584 Semiconductor integrated circuit device and method of fabricating the same
09/18/2003US20030173582 Solid-state imaging device and method for manufacturing same
09/18/2003US20030173578 Light emitting diode containing a layer of highly doped n-type aluminum-gallium nitride; a layer of multiple quantum wells having a first side coupled to the n-type nitride layer, and other side with p-type nitride layer
09/18/2003US20030173577 Chip scale package and method of fabricating the same
09/18/2003US20030173572 Retrograde well structure for a CMOS imager
09/18/2003US20030173570 Semiconductor device and method for forming the same
09/18/2003US20030173567 Semiconductor device and method of fabricating the same
09/18/2003US20030173566 Semiconductor device and manufacturing method thereof
09/18/2003US20030173565 Method of alloying a semiconductor device
09/18/2003US20030173560 Nitride-based semiconductor device and manufacturing method thereof
09/18/2003US20030173559 Growing smooth semiconductor layers
09/18/2003US20030173556 Compensating for cable drag forces in high precision stages
09/18/2003US20030173529 Mask pattern inspection system and mask pattern-inspecting method
09/18/2003US20030173527 Focused ion beam system and machining method using it
09/18/2003US20030173516 Semiconductor inspection system
09/18/2003US20030173512 Detection of motive force applied to transport box mounted on a FIMS system
09/18/2003US20030173511 Specimen scanning mechanism adapted for implementation in a FIMS system
09/18/2003US20030173510 Semiconductor processing tool alignment technique implemented in a FIMS system
09/18/2003US20030173490 Facilities connection box for pre-facilitation of wafer fabrication equipment
09/18/2003US20030173351 Semiconductor processing temperature control
09/18/2003US20030173349 Ceramic heaters
09/18/2003US20030173347 Vacuum thermal annealer
09/18/2003US20030173346 System and method for heating and cooling wafer at accelerated rates
09/18/2003US20030173333 Two-stage etching process
09/18/2003US20030173332 Method of forming electrode for saw device
09/18/2003US20030173329 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
09/18/2003US20030173316 Cassette for receiving substrates
09/18/2003US20030173209 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
09/18/2003US20030173189 Stocker conveyor particle removing system
09/18/2003US20030173109 Printed circuit board unit with detachment mechanism for electronic component
09/18/2003US20030173108 Semiconductor device and method of manufacturing the same, circuit board and electronic equipment
09/18/2003US20030173107 Microelectronic packages having an array of resilient leads
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