Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/23/2003WO2003088313A2 Improved method for etching vias
10/23/2003WO2003088311A1 Data communication bus
10/23/2003WO2003088310A2 Substrate and method for producing a substrate
10/23/2003WO2003088303A2 Multi-directional scanning of movable member and ion beam monitoring arrangement therefor
10/23/2003WO2003088260A1 Algorithm dynamic reference programming
10/23/2003WO2003088259A1 Refresh scheme for dynamic page programming
10/23/2003WO2003088257A1 Embedded electrically programmable read only memory devices
10/23/2003WO2003088254A1 Storage device using resistance varying storage element and reference resistance value decision method for the device
10/23/2003WO2003088253A1 Material combinations for tunnel junction cap layer, tunnel junction hard mask and tunnel junction stack seed layer in mram processing
10/23/2003WO2003088250A2 Method of manufacture of programmable conductor memory
10/23/2003WO2003088193A1 Substrate, liquid crystal display having the substrate, and method for producing substrate
10/23/2003WO2003087948A1 Attenuated embedded phase shift photomask blanks
10/23/2003WO2003087946A2 Imaging method
10/23/2003WO2003087945A2 Interferometric measuring device and projection illumination installation comprising one such measuring device
10/23/2003WO2003087938A2 Plasma polymerized electron beam resist
10/23/2003WO2003087936A1 Method of treatment of porous dielectric films to reduce damage during cleaning
10/23/2003WO2003087935A2 Nanoimprint resist
10/23/2003WO2003087934A2 Interferometry system error compensation in twin stage lithography tools
10/23/2003WO2003087867A2 Extreme ultraviolet light source
10/23/2003WO2003087850A1 Frequency characteristics measuring method and device for acceleration sensor
10/23/2003WO2003087797A1 Sample surface inspection apparatus and method
10/23/2003WO2003087771A2 Method for making a molecularly smooth surface
10/23/2003WO2003087744A1 Method and device for measuring temperature of base material
10/23/2003WO2003087731A1 Semiconductor load port alignment device
10/23/2003WO2003087710A2 Method and apparatus for stage mirror mapping
10/23/2003WO2003087590A2 Method of self-assembly and self-assembled structures
10/23/2003WO2003087436A1 Electropolishing and/or electroplating apparatus and methods
10/23/2003WO2003087431A2 Deposition methods utilizing phased array microwave excitation, and deposition apparatuses
10/23/2003WO2003087430A1 Processing system, processing method and mounting member
10/23/2003WO2003087428A1 Source gas delivery
10/23/2003WO2003087424A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003WO2003087423A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003WO2003087233A2 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
10/23/2003WO2003087206A2 Patterned polymeric structures, particularly microstructures, and methods for making same
10/23/2003WO2003086958A2 Method for producing a product having a structured surface
10/23/2003WO2003086917A1 Substrate conveying device
10/23/2003WO2003086706A1 Polishing method
10/23/2003WO2003086701A1 Protection of work piece during surface processing
10/23/2003WO2003086677A1 Method of inserting metal heat dissipators
10/23/2003WO2003086668A1 Fluid assisted cryogenic cleaning
10/23/2003WO2003067640A3 Method for the production of a memory cell and structure thereof
10/23/2003WO2003054256A3 Method and device for depositing crystalline layers on crystalline substrates
10/23/2003WO2003046980A3 Forming defect prevention trenches in dicing streets
10/23/2003WO2003043066A3 Layered structures
10/23/2003WO2003041158A3 Semiconductor package device and method of formation and testing
10/23/2003WO2003036724A3 Semiconductor structure with reduced capacitive coupling between components
10/23/2003WO2003036723A3 Semiconductor structure provided with a component capacitively uncoupled from the substrate
10/23/2003WO2003027178A3 Polyimide copolymer and methods for preparing the same
10/23/2003WO2003019657A3 Integrated circuit device with bump bridges and method for making the same
10/23/2003WO2003009370A3 Substrate support pedestal
10/23/2003WO2003005413A3 Fast swap dual substrate transport for load lock
10/23/2003WO2002095795A3 Device for receiving plate-shaped objects
10/23/2003WO2002094957A3 Chemical mechanical polishing compositions and methods relating thereto
10/23/2003WO2002093637A3 Product comprising a substrate and a chip attached to the substrate
10/23/2003WO2002093209A3 Lens system consisting of fluoride crystal lenses
10/23/2003WO2002091433A3 Method for grinding the back sides of wafers
10/23/2003WO2002071447A8 Ruthenium silicide wet etch
10/23/2003WO2002065513A3 Photoresist strip with 02 and nh3 for organosilicate glass applications
10/23/2003WO2002021693A3 Field programmable gate array and microcontroller system-on-a-chip
10/23/2003WO2002001613A8 Method and apparatus for wafer cleaning
10/23/2003WO2001074535A9 Fixed abrasive linear polishing belt and system using the same
10/23/2003WO2001011666A8 Method of etching a wafer layer using multiple layers of the same photoresistant material and structure formed thereby
10/23/2003US20030200523 Apparatus, method, and program for designing a mask and method for fabricating semiconductor devices
10/23/2003US20030200511 Method for designing a system LSI
10/23/2003US20030200510 Digital circuits using universal logic gates
10/23/2003US20030200495 Semiconductor integrated circuit and its design methodology
10/23/2003US20030200056 Semiconductor device analysis system
10/23/2003US20030199659 Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
10/23/2003US20030199638 Film adhesives containing maleimide compounds and methods for use thereof
10/23/2003US20030199407 Composition of a resist stripper using electrolytic material with high equivalent conductivity in an aqueous solution
10/23/2003US20030199406 A cleaning composition composed of a non-chelating organic acid, salt or ester thereof, and a chelating organic acid, salt or ester thereof that may be used to clean residue and scum from a substrate. The cleaning composition is suitable
10/23/2003US20030199235 Polishing pad and method of use thereof
10/23/2003US20030199234 Grooved polishing pads and methods of use
10/23/2003US20030199230 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
10/23/2003US20030199225 Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
10/23/2003US20030199177 Semiconductor crystal-structure-processed mechanical devices, and methods and systems for making
10/23/2003US20030199176 Multi-pattern shadow mask system and method for laser annealing
10/23/2003US20030199175 Mixed frequency high temperature nitride cvd process
10/23/2003US20030199174 Substrate processing apparatus and substrate processing method
10/23/2003US20030199173 Load port, semiconductor manufacturing apparatus, semiconductor manufacturing method, and method of detecting wafer adapter
10/23/2003US20030199172 Methods of nanotube films and articles
10/23/2003US20030199171 Method for reducing the resistivity of p-type II-VI and III-V semiconductors
10/23/2003US20030199170 Plasma etching of silicon carbide
10/23/2003US20030199169 Method of forming dual damascene interconnection using low-k dielectric
10/23/2003US20030199168 Local dry etching method
10/23/2003US20030199166 Structure and method to preserve STI during etching
10/23/2003US20030199164 Method of etching back of semiconductor wafer
10/23/2003US20030199163 Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same
10/23/2003US20030199162 System and methods for fabrication of a thin pattern
10/23/2003US20030199161 Semiconductor integrated circuit device and method for making the same
10/23/2003US20030199160 Use of palladium in IC manufacturing with conductive polymer bump
10/23/2003US20030199159 Novel method for dual-layer polyimide processing on bumping technology
10/23/2003US20030199156 Manufacturing method of semiconductor device
10/23/2003US20030199155 Methods providing oxide layers having reduced thicknesses at central portions thereof
10/23/2003US20030199154 Etch stop layer in poly-metal structures
10/23/2003US20030199153 Method of producing SI-GE base semiconductor devices
10/23/2003US20030199152 Method of forming a conductive contact
10/23/2003US20030199151 Method of fabricating a shallow trench isolation structure
10/23/2003US20030199150 Method of preventing seam defects in isolated lines
10/23/2003US20030199149 Shallow trench isolation method and method for manufacturing non-volatile memory device using the same
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