Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/28/2003US6638776 Thermal characterization compensation
10/28/2003US6638775 Method for fabricating semiconductor memory device
10/28/2003US6638774 Method of making resistive memory elements with reduced roughness
10/28/2003US6638694 Resist stripping agent and process of producing semiconductor devices using the same
10/28/2003US6638688 Selective electroplating method employing annular edge ring cathode electrode contact
10/28/2003US6638685 Resolution, sensitivity and smoothness on side surfaces of a transferred pattern; photolithography
10/28/2003US6638672 Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus
10/28/2003US6638666 Substrate for a transfer mask, transfer mask, and method of manufacturing the transfer mask
10/28/2003US6638665 Method and apparatus for designing EB mask
10/28/2003US6638663 Glass, quartz, silicon oxyfluoride or metal fluorides having patterns comprising radiation transparent and transluscence regions used for photolithography
10/28/2003US6638638 Hollow solder structure having improved reliability and method of manufacturing same
10/28/2003US6638627 Method for electrostatic force bonding and a system thereof
10/28/2003US6638607 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
10/28/2003US6638595 Method and apparatus for reduced flash encapsulation of microelectronic devices
10/28/2003US6638592 Ceramic/metal substrate, especially composite substrate
10/28/2003US6638580 Apparatus and a method for forming an alloy layer over a substrate using an ion beam
10/28/2003US6638564 Method of electroless plating and electroless plating apparatus
10/28/2003US6638482 Stacked, reconfigurable system is provided. The stacked, reconfigurable system includes an inlet for receipt of a sample, a first chamber defined by a bottom support, an intermediate member, and a first spacer, the first chamber
10/28/2003US6638445 Silicon dioxide etch process which protects metals
10/28/2003US6638441 Method for pitch reduction
10/28/2003US6638410 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
10/28/2003US6638403 Plasma processing apparatus with real-time particle filter
10/28/2003US6638402 Ring-type sputtering target
10/28/2003US6638392 Plasma process apparatus
10/28/2003US6638389 Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers
10/28/2003US6638374 Device produced by a process of controlling grain growth in metal films
10/28/2003US6638366 For cleaning semiconductor wafers, comprising: a chuck for holding a wafer to be cleaned; and a hydraulic broom for automatically sweeping said wafer with solvent fluid.
10/28/2003US6638365 Method for obtaining clean silicon surfaces for semiconductor manufacturing
10/28/2003US6638358 Method and system for processing a semiconductor device
10/28/2003US6638357 Method for revealing agglomerated intrinsic point defects in semiconductor crystals
10/28/2003US6638326 Compositions for chemical mechanical planarization of tantalum and tantalum nitride
10/28/2003US6638148 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
10/28/2003US6638147 Polishing method for removing corner material from a semi-conductor wafer
10/28/2003US6638146 Retention plate for polishing semiconductor substrate
10/28/2003US6638145 Constant pH polish and scrub
10/28/2003US6638144 Method of cleaning glass
10/28/2003US6638143 Ion exchange materials for chemical mechanical polishing
10/28/2003US6638141 Method and apparatus for chemical-mechanical polishing
10/28/2003US6638140 Method and apparatus for polishing
10/28/2003US6638004 Article holders and article positioning methods
10/28/2003US6637998 Self evacuating micro environment system
10/28/2003US6637638 System for fabricating solder bumps on semiconductor components
10/28/2003US6637636 Apparatus of clamping semiconductor devices using sliding finger supports
10/28/2003US6637446 Integrated substrate processing system
10/28/2003US6637445 Substrate processing unit
10/28/2003US6637444 Volume efficient cleaning methods
10/28/2003US6637443 Semiconductor wafer cleaning apparatus and method
10/28/2003US6637273 Methods and apparatus for measuring stress of membrane regions of segmented microlithographic mask blanks
10/28/2003US6637109 Method for manufacturing a heat sink
10/28/2003US6637087 Method of producing edge reflection type surface acoustic wave device
10/28/2003CA2183709C Electrostatic chuck member and a method of producing the same
10/28/2003CA2177150C Electrostatic discharge protection circuit
10/23/2003WO2003088724A1 Circuit board and method for manufacturing the same
10/23/2003WO2003088370A2 Hermetic encapsulation of organic electro-optical elements
10/23/2003WO2003088366A1 Non-volatile, programmable, electrically erasable memory semiconductor device having a single grid material layer and corresponding magnetic core plane
10/23/2003WO2003088365A1 Semiconductor device and its manufacturing method
10/23/2003WO2003088363A1 Bipolar transistor with graded base layer
10/23/2003WO2003088362A1 Semiconductor device and manufacturing method thereof
10/23/2003WO2003088361A1 Nanowire devices and methods of fabrication
10/23/2003WO2003088360A1 N-fet and p-fet fabrication on the same wafer using different crystal planes for the optimization of carrier transport
10/23/2003WO2003088357A1 Semiconductor device and its manufacturing method
10/23/2003WO2003088355A1 Semiconductor device and method for assembling the same
10/23/2003WO2003088354A2 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003WO2003088353A1 Memory manufacturing process with bitline isolation
10/23/2003WO2003088352A1 Electrochemical planarization of metal feature surfaces
10/23/2003WO2003088351A1 Port structure in semiconductor processing device
10/23/2003WO2003088350A1 Closed container conveying system
10/23/2003WO2003088349A1 Signal detection contactor and signal correcting system
10/23/2003WO2003088348A1 Method and apparatus for underfilling semiconductor devices
10/23/2003WO2003088347A2 Method for connecting substrates and composite element
10/23/2003WO2003088346A1 Process for controlling denuded zone depth in an ideal oxygen precipitating silicon wafer
10/23/2003WO2003088345A1 Material for electronic device and process for producing the same
10/23/2003WO2003088344A1 Low metal porous silica dielectric for integral circuit applications
10/23/2003WO2003088343A1 New porogens for porous silica dielectric for integral circuit applications
10/23/2003WO2003088342A1 Method for producing material of electronic device
10/23/2003WO2003088341A1 Method for forming underlying insulation film
10/23/2003WO2003088340A2 Method for the production of structured layers on substrates
10/23/2003WO2003088339A1 Vertical thermal treatment equipment
10/23/2003WO2003088338A1 Plasma processing device and plasma processing method
10/23/2003WO2003088337A1 Resist removing apparatus and method of removing resist
10/23/2003WO2003088336A1 Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter
10/23/2003WO2003088335A1 Polishing device and substrate processing device
10/23/2003WO2003088334A2 Deposition of gate metallization and passivation layers for active matrix liquid crystal display (amlcd) applications
10/23/2003WO2003088333A1 Method for producing a volume conductive and/or semiconductive structure
10/23/2003WO2003088332A1 Method for forming silicon epitaxial layer
10/23/2003WO2003088331A1 Semiconductor device having semiconductor thin-films of different crystallinities, substrate thereof, process for producing these, liquid crystal display unit and process for producing the same
10/23/2003WO2003088330A1 Projection optical system, exposure system and exposure method
10/23/2003WO2003088329A1 Reticle and optical characteristic measuring method
10/23/2003WO2003088328A2 Method for production of a capacitive structure above a metallisation level of an electronic component
10/23/2003WO2003088327A2 Deposition of silicon layers for active matrix liquid crystal displays
10/23/2003WO2003088326A2 Method of loading a wafer onto a wafer holder to reduce thermal shock
10/23/2003WO2003088325A1 Gas driven planetary rotation apparatus and methods for forming silicon carbide layers
10/23/2003WO2003088324A2 Method and apparatus for wafer cleaning
10/23/2003WO2003088323A1 Method and device for conditioning semiconductor wafers and/or hybrids
10/23/2003WO2003088322A2 Semiconductor device
10/23/2003WO2003088321A2 Device and method for positioning a plate-type substrate
10/23/2003WO2003088319A2 Method of etching substrates
10/23/2003WO2003088318A2 Method of fabricating vertical structure leds
10/23/2003WO2003088316A2 Electropolishing and electroplating methods
10/23/2003WO2003088314A2 Remote monitoring system for chemical liquid delivery
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