Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2003
12/16/2003US6664171 Method of alloying a semiconductor device
12/16/2003US6664170 Method for forming device isolation layer of a semiconductor device
12/16/2003US6664169 Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus
12/16/2003US6664168 Method of making an on-die decoupling capacitor for a semiconductor device
12/16/2003US6664167 Memory with trench capacitor and selection transistor and method for fabricating it
12/16/2003US6664166 Control of nichorme resistor temperature coefficient using RF plasma sputter etch
12/16/2003US6664165 Semiconductor device and fabrication method therefor
12/16/2003US6664164 UV-programmed P-type Mask ROM and fabrication thereof
12/16/2003US6664162 Method of manufacturing capacitor
12/16/2003US6664161 Method and structure for salicide trench capacitor plate electrode
12/16/2003US6664160 Gate structure with high K dielectric
12/16/2003US6664159 Mixed metal nitride and boride barrier layers
12/16/2003US6664158 Ferroelectric memory configuration and a method for producing the configuration
12/16/2003US6664157 Semiconductor integrated circuit device and the method of producing the same
12/16/2003US6664156 Method for forming L-shaped spacers with precise width control
12/16/2003US6664155 Method of manufacturing semiconductor device with memory area and logic circuit area
12/16/2003US6664154 Method of using amorphous carbon film as a sacrificial layer in replacement gate integration processes
12/16/2003US6664153 Method to fabricate a single gate with dual work-functions
12/16/2003US6664152 Method for crystallizing silicon film and thin film transistor and fabricating method using the same
12/16/2003US6664151 Method for manufacturing a thin film transistor using steam anneal process to reinforce the surface of the ONO layer
12/16/2003US6664150 Active well schemes for SOI technology
12/16/2003US6664149 TFT-LCD formed with four masking steps
12/16/2003US6664148 Integrated circuit device with switching between active mode and standby mode controlled by digital circuit
12/16/2003US6664147 Method of forming thin film transistors on predominantly <100> polycrystalline silicon films
12/16/2003US6664146 Integration of fully depleted and partially depleted field effect transistors formed in SOI technology
12/16/2003US6664145 Semiconductor device and manufacturing method thereof
12/16/2003US6664144 Method of forming a semiconductor device using a group XV element for gettering by means of infrared light
12/16/2003US6664143 Methods of fabricating vertical field effect transistors by conformal channel layer deposition on sidewalls
12/16/2003US6664141 Method of forming metal fuses in CMOS processes with copper interconnect
12/16/2003US6664140 Methods for fabricating integrated circuit devices using antiparallel diodes to reduce damage during plasma processing
12/16/2003US6664139 Method and apparatus for packaging a microelectronic die
12/16/2003US6664138 Method for fabricating a circuit device
12/16/2003US6664136 Semiconductor device and manufacturing method thereof
12/16/2003US6664135 Method of manufacturing a ball grid array type semiconductor package
12/16/2003US6664134 Method of mounting a semiconductor device with a eutectic layer
12/16/2003US6664133 Lead frame and method of manufacturing the same
12/16/2003US6664132 Method for producing three-dimensional circuits
12/16/2003US6664130 Methods of fabricating carrier substrates and semiconductor devices
12/16/2003US6664129 Integrated circuits and methods for their fabrication
12/16/2003US6664128 Bump fabrication process
12/16/2003US6664127 Manufacturing highly dense multi-layer printed wiring board by using laser drilling.
12/16/2003US6664125 Solid-state image pickup device and a method of manufacturing the same
12/16/2003US6664123 Method for etching metal layer on a scale of nanometers
12/16/2003US6664122 Electroless copper deposition method for preparing copper seed layers
12/16/2003US6664120 Method and structure for determining a concentration profile of an impurity within a semiconductor layer
12/16/2003US6664119 Chemical vapor deposition method for manufacturing semiconductor devices
12/16/2003US6664118 Ferroelectric-type nonvolatile semiconductor memory and operation method thereof
12/16/2003US6664116 Seed layer processes for MOCVD of ferroelectric thin films on high-k gate oxides
12/16/2003US6664115 Metal insulator structure with polarization-compatible buffer layer
12/16/2003US6664032 Using two masks; stripe shapes
12/16/2003US6664027 Methods and apparatus for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging
12/16/2003US6664026 Method of manufacturing high aspect ratio photolithographic features
12/16/2003US6664022 Photoacid generators and photoresists comprising same
12/16/2003US6664021 Photosensitive polymide precursor resin composition
12/16/2003US6664011 Improving DOF and MEF performance for creation of holes by adding extra holes to a given pattern, thus densifying the pattern of holes on the first mask and reducing the range of the hole-diameter to hole separation ratio.
12/16/2003US6663989 Anisotropic; epitaxial; computers; data storage
12/16/2003US6663980 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame
12/16/2003US6663973 Polysiloxane with a fluoroaromatic silanediol monomer
12/16/2003US6663969 Magnetic field is applied to boron nitride powder increasing thermoconductivity; dielectrics
12/16/2003US6663944 Textured semiconductor wafer for solar cell
12/16/2003US6663943 Surface acoustic wave device and method for making the same
12/16/2003US6663920 Ion implantation method for fabricating magnetoresistive (MR) sensor element
12/16/2003US6663916 Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
12/16/2003US6663915 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate
12/16/2003US6663799 For use in electrical connection between circuit devices and electrical connection between wirings in a circuit device
12/16/2003US6663793 Using a 0 to 3 composite process in which the entrapped particulate phase shows no interparticle connectivity while the sol phase shows three-dimensional connectivity upon gelation; hydrolysing ruthenium alkoxide to form RhO2
12/16/2003US6663792 Equipment for UV wafer heating and photochemistry
12/16/2003US6663791 Detection method of coating film thickness and ion implantation equipment using this method
12/16/2003US6663789 Bonded substrate structures and method for fabricating bonded substrate structures
12/16/2003US6663787 Use of ta/tan for preventing copper contamination of low-k dielectric layers
12/16/2003US6663762 Workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft, bears against the workpiece and conducts current therebetween is made of corrosion resistance platinum
12/16/2003US6663761 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same
12/16/2003US6663748 Method of forming a thin film
12/16/2003US6663741 Stabilization of electrical and electronic apparatus using pressure sensitive adhesives comprising acrylic polymers on substrates, then cutting the lamination, peeling the chips and cooling; stress relieving
12/16/2003US6663740 Manufacturing method and manufacturing apparatus of thin-film laminate
12/16/2003US6663736 Method for making a bonded sapphire structure
12/16/2003US6663721 Cleaners comprising substrate casings, fluid flow pipes, heat exchangers and thermostatsm, used for cleaning semiconductor wafers or liquid crystal displays
12/16/2003US6663716 Film processing system
12/16/2003US6663715 Plasma CVD apparatus for large area CVD film
12/16/2003US6663714 CVD apparatus
12/16/2003US6663713 Method and apparatus for forming a thin polymer layer on an integrated circuit structure
12/16/2003US6663708 Silicon wafer, and manufacturing method and heat treatment method of the same
12/16/2003US6663706 Raw material compounds for use in CVD, and chemical vapor deposition for producing iridium or iridium compound thin films
12/16/2003US6663683 Aqueous dispersions, process for their production, and their use
12/16/2003US6663674 Method of handling a silicon wafer
12/16/2003US6663469 Polishing method and apparatus
12/16/2003US6663468 Method for polishing surface of semiconductor device substrate
12/16/2003US6663466 Carrier head with a substrate detector
12/16/2003US6663340 Wafer carrier transport system for tool bays
12/16/2003US6663333 Wafer transport apparatus
12/16/2003US6663332 System for the treatment of wafers
12/16/2003US6663325 Transport system for spherical objects and method of using the transport system
12/16/2003US6663245 Spin dry cup having rotation device for substrate; air absorber for purification of exhaust gas; trap and drain
12/16/2003US6663148 System for preventing improper insertion of FOUP door into FOUP
12/16/2003US6663092 Holding apparatus
12/16/2003US6663025 Reflector is over nozzle arranged to reflect gas while expanding flow; vanes divide and slow velocity; pumping, venting
12/16/2003US6662993 Bondhead lead clamp apparatus
12/16/2003US6662817 Gas-line system for semiconductor-manufacturing apparatus
12/16/2003US6662799 Vertical wafer sawing apparatus
12/16/2003US6662673 Linear motion apparatus and associated method