Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/15/2004US20040007716 Versatile system for optimizing current gain in bipolar transistor structures
01/15/2004US20040007715 Reducing threading defect density by reducing germanium content in Silicon germanium relaxed buffer layer on which strained silicon channel layer is formed by forming channel layer of silicon-carbon alloy containing 1.5% carbon
01/15/2004US20040007714 Current mirror circuit and optical signal circuit using same
01/15/2004US20040007713 Bipolar transistor and semiconductor device using same
01/15/2004US20040007711 Apparatus carrying electronic device
01/15/2004US20040007709 Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus
01/15/2004US20040007708 Light emitting element and method of making same
01/15/2004US20040007705 Thin film transistor array panel including storage electrode
01/15/2004US20040007704 Transflective liquid crystal display device and fabricating method thereof
01/15/2004US20040007703 Semiconductor device having a dummy active region for controlling high density plasma chemical vapor deposition
01/15/2004US20040007680 Electron beam lithography apparatus using a patterned emitter
01/15/2004US20040007678 Adjustable implantation angle workpiece support structure for an ion beam implanter
01/15/2004US20040007677 Non-magnetic robotic manipulators for moving objects relative to a charged-particle-beam optical system
01/15/2004US20040007611 Asymmetric plating
01/15/2004US20040007609 Wire bonding apparatus
01/15/2004US20040007592 Precision liquid mixing apparatus and method
01/15/2004US20040007581 Removable lid and floating pivot
01/15/2004US20040007561 Method for plasma etching of high-K dielectric materials
01/15/2004US20040007560 Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor
01/15/2004US20040007559 Wafer cleaning apparatus
01/15/2004US20040007478 Electroetching system and process
01/15/2004US20040007474 Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode
01/15/2004US20040007470 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
01/15/2004US20040007469 Forming three-dimensional multilayer structures by electroplating, ammonium citrate is included to improve anode dissolving, prevent deposits defect and short circuits, use low voltage; copper deposits has ductility, noncracking
01/15/2004US20040007327 Dicing tape applying apparatus and back-grinding/dicing tape applying system
01/15/2004US20040007326 Wafer probe for measuring plasma and surface characteristics in plasma processing enviroments
01/15/2004US20040007325 Integrated equipment set for forming a low K dielectric interconnect on a substrate
01/15/2004US20040007312 Mounting method
01/15/2004US20040007257 Apparatus for treating wafer
01/15/2004US20040007252 Label sheet for cleaning and conveying member having cleaning function
01/15/2004US20040007248 Preparing an etching and a deposition apparatus each using chlorine series gas, generating a plasma containing hydrogen and nitrogen to remove by-products
01/15/2004US20040007247 Plasma film-forming apparatus and cleaning method for the same
01/15/2004US20040007188 Gas-purged vacuum valve
01/15/2004US20040007187 CVD reactor with substrate holder which is rotatably driven and mounted by a gas stream
01/15/2004US20040007186 Heat-treating device
01/15/2004US20040007185 Method of manufacturing a semiconductor device and a semiconductor manufacture system
01/15/2004US20040007183 Apparatus and method for the formation of thin films
01/15/2004US20040007182 Plasma processing apparatus
01/15/2004US20040007180 Film-formation apparatus and source supplying apparatus therefor, gas concentration measuring method
01/15/2004US20040007179 Reaction apparatus for atomic layer deposition
01/15/2004US20040007177 Substrate treating device and substrate treating method, substrate flattening method
01/15/2004US20040007176 Gas flow control in a wafer processing system having multiple chambers for performing same process
01/15/2004US20040007173 Apparatus and method for drying under reduced pressure, and coating film forming apparatus
01/15/2004US20040007171 Method for growing thin oxide films
01/15/2004US20040007068 Semiconductor dynamic quantity sensor
01/15/2004US20040006996 Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules
01/15/2004US20040006924 For chemical mechanical polishing (CMP) of semiconductors
01/15/2004US20040006883 Precise mechanism for load port adjustment
01/15/2004US20040006869 Method of manufacturing sheet material and method of manufacturing circuit device using the same
01/15/2004DE4415375B4 Filmträger und Verfahren zu dessen Herstellung Film support and process for its preparation
01/15/2004DE20316392U1 Process for polishing thin substrates such as semi conductor wafers has rotary turntable with guide strip to protect against substrate damage
01/15/2004DE19609202B4 Photomaske zur Strukturierung einer Supraleiterschicht, Supraleiterschicht und Verfahren zur Bestimmung des Ausmaßes einer Unterätzung bei der Strukturierung einer Supraleiterschicht Photomask for patterning a superconducting layer, superconductor layer, and method for determining the extent of under-etching during the patterning of the superconductor layer
01/15/2004DE10327945A1 Halbleiterspeichervorrichtungen und Verfahren zur Herstellung derselben unter Verwendung von Seitenwandabstandshaltern Semiconductor memory devices and methods of making the same using sidewall spacers
01/15/2004DE10327257A1 Verfahren zur Bildung von Metallkolloidmustern A method of forming metal colloid patterns
01/15/2004DE10326351A1 Vorrichtung mit Elektroden für die Bildung einer Kugel am Ende eines Drahts Apparatus with electrodes for the formation of a ball at the end of a wire
01/15/2004DE10317151A1 Ätzprozess zum Einsenken von Polysilizium in Grabenstrukturen Etching process for sinking of polysilicon in grave structures
01/15/2004DE10258761A1 Verfahren zur Herstellung eines Kontaktlochs A process for producing a contact hole
01/15/2004DE10229818A1 Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem Method of focus detection and imaging system with focus detection system
01/15/2004DE10229614A1 Katadioptrisches Reduktionsobjektiv A catadioptric reduction objective
01/15/2004DE10229463A1 Halbleiteranordnung Semiconductor device
01/15/2004DE10228998A1 Vorrichtung und Verfahren zum elektrochemischen behandeln eines Substrats bei reduzierter Metallkorrosion An apparatus and method for electrochemically treating a substrate with reduced metal corrosion
01/15/2004DE10228807A1 Verfahren zum Definieren der Abmessung von Schaltungselementen unter Verwendung von Abscheidetechniken für Abstandselemente A method for defining the dimensions of circuit elements using deposition techniques for distance elements
01/15/2004DE10228771A1 Verfahren zur Planarisierung mit definierbarer Planarisierungslänge in integrierten Halbleiterschaltungen und derartige integrierte Halbleiterschaltung Method for planarization with definable planarization length in semiconductor integrated circuits and such semiconductor integrated circuit
01/15/2004DE10228593A1 Elektronisches Bauteil mit einer Gehäusepackung Electronic device having a housing package
01/15/2004DE10228344A1 Verfahren zur Herstellung von Mikrostrukturen sowie Anordnung von Mikrostrukturen A process for the fabrication of microstructures, and arrangement of microstructures
01/15/2004DE10227829A1 Verfahren zum Überwachen der Herstellung und zum Bewerten der Qualität einer Metallisierungsanordnung sowie zugehörige Erfassungsvorrichtung A method for monitoring the manufacture and for evaluating the quality of a sensing device and associated Metallisierungsanordnung
01/15/2004DE10227663A1 Verfahren zum Versiegeln poröser Materialien bei der Chipherstellung und Verbindungen hierfür A method for sealing porous materials in chip manufacture and for this compounds
01/15/2004DE10227615A1 Schicht-Anordnung und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement and method for producing a layer arrangement
01/15/2004DE10227605A1 Schicht-Anordnung und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement and method for producing a layer arrangement
01/15/2004DE10227492A1 Verfahren zur Herstellung eines Deep-Trench-Kondensators für dynamische Speicherzellen A process for producing a deep trench capacitor memory cells for dynamic
01/15/2004DE10227342A1 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
01/15/2004DE10227213A1 Umsetzvorrichtung für Mikrosysteme Relocating for microsystems
01/15/2004DE10227059A1 Verpackung für Halbleiter-Bauelemente und Verfahren zum Herstellen derselben Packaging for semiconductor devices and methods for manufacturing the same
01/15/2004DE10224201A1 Halbleiterbauelement mit Durchbruchstrompfad A semiconductor device with breakdown current path
01/15/2004DE10223937A1 Zweischichtverklebung von Sägehilfen auf Siliciumeinkristallstäben Zweischichtverklebung of sawing aids on Siliciumeinkristallstäben
01/15/2004DE10125912B4 Molekularstrahl-epitaktische Abscheidung von Halbleiterschichten auf vizinalen GaAs-Substraten Molecular beam epitaxial deposition of semiconductor layers on GaAs substrates vicinal
01/15/2004DE10103528B4 Verfahren zur Herstellung und Verwendung eines ferroelektrischen Kondensators A process for the preparation and use of a ferroelectric capacitor
01/15/2004DE10032005B4 Waferhalterad mit einer Andrückvorrichtung in einer Waferbeschichtungsanlage Waferhalterad with a pressing device in a wafer coating plant
01/15/2004CA2741397A1 Nanostructures and methods for manufacturing the same
01/15/2004CA2491915A1 Anomalous expansion materials
01/15/2004CA2491514A1 Metal nano-objects, formed on semiconductor surfaces, and method for making said nano-objects
01/14/2004EP1381257A2 Apparatus for producing and sustaining a glow discharge plasma under atmospheric conditions
01/14/2004EP1381159A2 Time limit function utilization apparatus
01/14/2004EP1381089A2 Polycrystalline silicon thin film used in a thin film transistor and a device using the same
01/14/2004EP1381086A1 Production method for bonded substrates
01/14/2004EP1381085A2 Semiconductor integrated circuit device and layout method of patterns for semiconductor integrated circuit device
01/14/2004EP1381080A2 Component-embedded board fabrication method and apparatus
01/14/2004EP1381079A1 Heat treating method and heat treating device
01/14/2004EP1381078A1 Ultraviolet ray assisted processing device for semiconductor processing
01/14/2004EP1381077A2 Capacitor and method for fabricating the same
01/14/2004EP1381076A2 Dicing tape applying apparatus and back-grinding/dicing tape applying system
01/14/2004EP1381074A2 Method and apparatus for observing a semiconductor device using an electron microscope
01/14/2004EP1381058A1 Conductive organic thin film and production method therefor, electrode and electric cable using it
01/14/2004EP1381055A2 A multiple use memory chip
01/14/2004EP1380985A2 Semiconductor device having a built-in contact-type sensor and manufacturing method of such a semiconductor device
01/14/2004EP1380895A1 Chemically amplified resist material and patterning method using the same
01/14/2004EP1380880A1 Method for manufacturing liquid crystal display
01/14/2004EP1380871A2 Relay lens used in an illumination system of a lithography system
01/14/2004EP1380848A2 Device for measuring and analyzing electrical signals of an integrated circuit component
01/14/2004EP1380665A1 Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom