Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/20/2004US6680228 Capacitor in semiconductor device
01/20/2004US6680227 Non-volatile memory device and fabrication method thereof
01/20/2004US6680226 Methods and devices for optimized digital and analog CMOS transistor performance in deep submicron technology
01/20/2004US6680225 Method for manufacturing a semiconductor memory
01/20/2004US6680224 Methods of forming and operating field effect transistors having gate and sub-gate electrodes
01/20/2004US6680223 Semiconductor device and method of manufacturing the same
01/20/2004US6680221 Bare chip mounting method and bare chip mounting system
01/20/2004US6680220 Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package
01/20/2004US6680215 Liquid crystal-templated conducting organic polymers
01/20/2004US6680214 Artificial band gap
01/20/2004US6680213 Method and system for fabricating contacts on semiconductor components
01/20/2004US6680212 Method of testing and constructing monolithic multi-chip modules
01/20/2004US6680164 Using hydrogen and water plasma mixture.
01/20/2004US6680159 Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same
01/20/2004US6680155 Positive photoresist composition
01/20/2004US6680130 Group 3 metal oxide and group 5 element
01/20/2004US6680123 Embedding resin
01/20/2004US6680107 Dielectrics
01/20/2004US6680078 For example, controlling a flow of a liquid photoresist onto a semiconductor wafer.
01/20/2004US6680015 Method of manufacturing a heat sink assembly with overmolded carbon matrix
01/20/2004US6679997 Organic insulation film formation method
01/20/2004US6679996 Metal oxide pattern forming method
01/20/2004US6679981 Inductive plasma loop enhancing magnetron sputtering
01/20/2004US6679964 Method for integrating image sensors with optical components
01/20/2004US6679951 Annealing the metal on the substrate, contacting substrate with organic reducing agent(s) during atleast part of the time the substrate is heated to cause oxidation of metal layer which are alcohols, aldehyde, and carboxylic acids
01/20/2004US6679950 Cleaning method and cleaner
01/20/2004US6679947 Semiconductor substrate
01/20/2004US6679937 Copper powders methods for producing powders and devices fabricated from same
01/20/2004US6679929 Abrasive, aliphatic carboxylic acid, a base, polishing acclerating compound such as citric acid, anticorrosive such as benzotriazole, hydrogen peroxide, and water; for semiconductors containing copper and a tantalum compound
01/20/2004US6679928 Polishing composition having a surfactant
01/20/2004US6679759 Method of manufacturing silicon wafer
01/20/2004US6679756 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
01/20/2004US6679755 Chemical mechanical planarization system
01/20/2004US6679675 Method and apparatus for processing wafers
01/20/2004US6679672 Transfer port for movement of materials between clean rooms
01/20/2004US6679671 Substrate transfer shuttle having a magnetic drive
01/20/2004US6679194 Cassette table of a semiconductor fabricating apparatus
01/20/2004US6678968 Supercritical point drying apparatus for semiconductor device manufacturing and bio-medical sample processing
01/20/2004US6678952 Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
01/20/2004US6678951 Method of forming electrical interconnects having electromigration-inhibiting plugs
01/20/2004US6678950 For an integrated circuit.
01/20/2004US6678949 Process for forming a multi-level thin-film electronic packaging structure
01/20/2004US6678948 Method for connecting electronic components to a substrate, and a method for checking such a connection
01/20/2004US6678911 Multiple vertical wafer cleaner
01/20/2004CA2107602C Method of manufacturing an integrated circuit and integrated circuit obtained by this method
01/15/2004WO2004006637A1 Wiring pattern structure and method for forming bump
01/15/2004WO2004006633A2 Integrated circuit including field effect transistor and method of manufacture
01/15/2004WO2004006429A1 Semiconductor integrated circuit and semiconductor integrated circuit manufacturing method
01/15/2004WO2004006419A2 Monitoring apparatus and method for improving the accuracy and repeatability of electrochemical capacitance voltage (ecv) measurements
01/15/2004WO2004006418A2 Medium for storing and reading information, and device for storing and reading of information on and from the medium
01/15/2004WO2004006341A1 Heterojunction field effect transistors using silicon-germanium and silicon-carbon alloys
01/15/2004WO2004006340A1 Floating-gate semiconductor structures
01/15/2004WO2004006339A1 Tft electronic devices and their manufacture
01/15/2004WO2004006338A1 Technique for fabricating logic elements using multiple gate layers
01/15/2004WO2004006337A1 Semiconductor device and method for manufacturing same
01/15/2004WO2004006334A2 Set of integrated capacitor arrangements, especially integrated grid capacitors
01/15/2004WO2004006332A1 Modular board device and high frequency module and method for producing them
01/15/2004WO2004006331A1 Multilayer wiring circuit module and method for fabricating the same
01/15/2004WO2004006329A1 Thin-film substrate having post via
01/15/2004WO2004006328A1 Semiconductor device and method for manufacturing same
01/15/2004WO2004006327A2 Transfer of a thin layer from a wafer comprising a buffer layer
01/15/2004WO2004006326A1 Method of transferring of a layer of strained semiconductor material
01/15/2004WO2004006324A2 Method for making an anisotropic conductive film with pointed conductive inserts
01/15/2004WO2004006323A1 Thin-film electronic device, in particular power device, and method for making same
01/15/2004WO2004006322A1 Method of oxidizing member to be treated
01/15/2004WO2004006321A1 Method and apparatus for forming nitrided silicon film
01/15/2004WO2004006320A1 Plasma processing apparatus
01/15/2004WO2004006319A1 Plasma processing equipment
01/15/2004WO2004006318A1 Processing device and processing method
01/15/2004WO2004006317A1 Method of cleaning substrate treatment apparatus
01/15/2004WO2004006315A2 Semiconductor capacitor and mosfet fitted therewith
01/15/2004WO2004006314A1 Method for the production of a short channel field effect transistor
01/15/2004WO2004006313A1 Apparatus for forming film
01/15/2004WO2004006312A1 Group iii nitride semiconductor substrate and its manufacturing method
01/15/2004WO2004006311A2 Transfer of a thin layer from a wafer comprising a buffer layer
01/15/2004WO2004006308A1 Illuminating method, exposing method, and device for therefor
01/15/2004WO2004006306A2 Method for controlling the extent of notch or undercut in an etched profile using optical reflectometry
01/15/2004WO2004006305A1 Electroless plating apparatus and post-electroless plating cleaning method
01/15/2004WO2004006303A2 Method for fabricating an ultra shallow junction of a field effect transistor
01/15/2004WO2004006300A2 Organic contact-enhancing layer for organic field effect transistors
01/15/2004WO2004006299A2 Method for dynamic sensor configuration and runtime execution
01/15/2004WO2004006298A2 Method and apparatus for non-invasive measurement and analysis of semiconductor process parameters
01/15/2004WO2004006297A2 Low dielectric materials and methods of producing same
01/15/2004WO2004006296A2 Laminate body and corresponding methods and apparatus
01/15/2004WO2004006291A2 Patterning method
01/15/2004WO2004006290A2 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors
01/15/2004WO2004006285A1 Method and apparatus for non-invasive measurement and analysis of plasma parameters
01/15/2004WO2004006284A1 Method and apparatus for non-invasive measurement and analys of semiconductor plasma parameters
01/15/2004WO2004006283A1 Adjustable implantation angle workpiece support structure for an ion beam implanter
01/15/2004WO2004006264A2 Erasable and programmable non-volatile cell
01/15/2004WO2004006262A2 Differential floating gate nonvolatile memories
01/15/2004WO2004006140A2 Method and apparatus for automatic sensor installation
01/15/2004WO2004006023A1 Composition for antireflection coating and method for forming pattern
01/15/2004WO2004006021A2 Optical device comprising an light source
01/15/2004WO2004006020A1 Photosensitive compositions based on polycyclic polymers
01/15/2004WO2004006018A1 Reflective maskblanks
01/15/2004WO2004006016A2 Mask and manufacturing method using mask
01/15/2004WO2004006014A2 Method of using an amorphous carbon layer for improved reticle fabrication
01/15/2004WO2004006013A1 Arrangement for the production of photomasks
01/15/2004WO2004005946A2 Electronic circuit with test unit for testing interconnects