Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/15/2004WO2004005847A1 Cyclic error compensation in interferometry systems
01/15/2004WO2004005846A1 Shearing interferometer calibrating method, production method for projection optical system, projection opticalsystem, and projection exposure system
01/15/2004WO2004005593A2 Metal nano-objects, formed on semiconductor surfaces, and method for making said nano-objects
01/15/2004WO2004005211A1 Compositions for removing etching residue and use thereof
01/15/2004WO2004005190A1 Anomalous expansion materials
01/15/2004WO2004005163A1 Fire retardant wafer carrier
01/15/2004WO2004004927A2 Nanostructures and methods for manufacturing the same
01/15/2004WO2003094224A8 Process for manufacturing substrates with detachment of a temporary support, and associated substrate
01/15/2004WO2003092045A3 Method for producing an electrical circuit
01/15/2004WO2003090283A3 Semiconductor component comprising an integrated capacitor structure that has a plurality of metallization planes
01/15/2004WO2003090257A3 Method for the production of thin metal-containing layers having low electrical resistance
01/15/2004WO2003079415A3 Methods for fabricating strained layers on semiconductor substrates
01/15/2004WO2003067637A3 Methods of treating a silicon carbide substrate for improved epitaxial deposition
01/15/2004WO2003067271A3 Apparatus and method for dynamic diagnostic testing of integrated circuits
01/15/2004WO2003065766A3 Heating in a vacuum atmosphere in the presence of a plasma
01/15/2004WO2003063213A3 Optimized method of transfer of a thin layer of silicon carbide to a receiving substrate
01/15/2004WO2003063210A3 Method for the production of a capacitor in a dielectric layer
01/15/2004WO2003062507A3 Method for manufacturing a free-standing substrate made of monocrystalline semi-conductor material
01/15/2004WO2003058678A3 Automotive code reader
01/15/2004WO2003050196A3 Clear adhesive sheet
01/15/2004WO2003049159A3 Methods of forming capacitors and methods of forming capacitor dielectric layers
01/15/2004WO2003046972A3 Method for producing a layer on a substrate
01/15/2004WO2003036692A3 Electronic assembly with filled no-flow underfill and methods of manufacture
01/15/2004WO2003023794A3 Method for trimming resistors
01/15/2004WO2003005523A3 Electrostatic discharge (esd) protection device with simultaneous and distributed self-biasing for multi-finger turn-on
01/15/2004WO2002095801A8 Improved connection assembly for integrated circuit sensors
01/15/2004WO2002053273A8 Process and apparatus for blending and distributing a slurry solution
01/15/2004WO2002047139A3 Methode of forming a copper film on a substrate
01/15/2004US20040010770 Method and apparatus for decomposing semiconductor device patterns into phase and chrome regions for chromeless phase lithography
01/15/2004US20040010769 Method for reducing a pitch of a procedure
01/15/2004US20040010737 Layout for a semiconductor memory device having redundant elements
01/15/2004US20040010726 Inter-block interface circuit and system LSI
01/15/2004US20040010385 Inspection method and a photomask
01/15/2004US20040010380 Method of detecting a polishing end point in a chemical mechanical polishing process
01/15/2004US20040010062 Heat resistant adhesives; waterproofing; bonding strength
01/15/2004US20040009883 Comprising 0.001 to 0.5% by weight of a fluorine compound, a mixed solvent of an amide solvent and an ether solvent and water
01/15/2004US20040009738 Method and apparatus for chemical and mechanical polishing
01/15/2004US20040009683 Method for connecting electronic device
01/15/2004US20040009682 Socket for semiconductor device
01/15/2004US20040009680 Seedless method of forming a silicon germanium layer on a gate dielectric layer
01/15/2004US20040009679 Method of forming material using atomic layer deposition and method of forming capacitor of semiconductor device using the same
01/15/2004US20040009678 Method for manufacturing semiconductor device
01/15/2004US20040009677 Method for forming a thin film, methods for forming a gate electrode and transistor using the same, and a gate electrode manufactured using the same
01/15/2004US20040009676 Nitrogen-free dielectric anti-reflective coating and hardmask
01/15/2004US20040009675 Gate structure and method
01/15/2004US20040009674 Method for forming a filling film and method for forming shallow trench isolation of a semiconductor device using the same
01/15/2004US20040009673 Method and system for imprint lithography using an electric field
01/15/2004US20040009672 Method for etching a trench through an anti-reflective coating
01/15/2004US20040009671 Chemical mechanical polishing slurry useful for copper substrates
01/15/2004US20040009670 Apparatus and method for reducing oxidation of polished metal surfaces in a chemical mechanical polishing process
01/15/2004US20040009669 Method of removing polymer and apparatus for doing the same
01/15/2004US20040009668 Process for planarizing upper surface of damascene wiring structure for integrated circuit structures
01/15/2004US20040009667 Etching method
01/15/2004US20040009665 Deposition of copper films
01/15/2004US20040009664 Method to encapsulate copper plug for interconnect metallization
01/15/2004US20040009663 Method for forming contact or via plug
01/15/2004US20040009662 Method of making a semiconductor device by forming a masking layer with a tapered etch profile
01/15/2004US20040009661 Semiconductor device and method of manufacturing the same
01/15/2004US20040009660 Method of preventing particle generation in plasma cleaning
01/15/2004US20040009659 Method of forming copper wiring in a semiconductor device
01/15/2004US20040009658 Preparation process for semiconductor device
01/15/2004US20040009656 Methods for fabricating semiconductor devices
01/15/2004US20040009655 Method for manufacturing metal line contact plugs for semiconductor devices
01/15/2004US20040009654 Method of forming metal wiring
01/15/2004US20040009653 Method for forming wiring structure
01/15/2004US20040009652 Dual salicides for integrated circuits
01/15/2004US20040009651 Method for forming a flash memory by using a microcrystalline polysilicon layer as a floating gate
01/15/2004US20040009650 Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit
01/15/2004US20040009649 Wafer bonding of thinned electronic materials and circuits to high performance substrates
01/15/2004US20040009647 Method of manufacturing semiconductor device
01/15/2004US20040009646 Low temperature MIM capacitor for mixed-signal/RF applications
01/15/2004US20040009645 Eeprom and method of fabricating the same
01/15/2004US20040009644 Method for manufacturing channel gate type field effect transistor
01/15/2004US20040009643 Method for fabricating a high voltage power mosfet having a voltage sustaining region that includes doped columns formed by rapid diffusion
01/15/2004US20040009642 Method of fabricating non-volatile memory device having a structure of silicon-oxide-nitride-oxide-silicon
01/15/2004US20040009641 Method of manufacturing semiconductor device having capacitor
01/15/2004US20040009640 High capacitance damascene capacitors
01/15/2004US20040009639 Semiconductor integrated circuit device and production method therefor
01/15/2004US20040009638 Semiconductor device
01/15/2004US20040009637 CMP device and production method for semiconductor device
01/15/2004US20040009636 Semiconductor integrated circuit device
01/15/2004US20040009635 Method of fabricating semiconductor device
01/15/2004US20040009634 Method for fabricating a gate structure
01/15/2004US20040009633 Method of using high-k dielectric materials to reduce soft errors in sram memory cells, and a device comprising same
01/15/2004US20040009632 Thin film processing method and thin film processing apparatus
01/15/2004US20040009631 Semiconductor package with circuit side polymer layer and wafer level fabrication method
01/15/2004US20040009630 Semiconductor device and method for manufacturing the same
01/15/2004US20040009629 Electrode forming method in circuit device and chip package and multilayer board using the same
01/15/2004US20040009626 Implantation at elevated temperatures for amorphization re-crystallization of Si1-xGex films on silicon substrates
01/15/2004US20040009625 Method of fabricating an X-ray detector array element
01/15/2004US20040009621 Method of fabricating an X-ray detector array element
01/15/2004US20040009619 Automatic fluid scanner
01/15/2004US20040009618 Method and system for high-speed, precise micromachining an array of devices
01/15/2004US20040009617 Plasma etching apparatus and plasma etching method
01/15/2004US20040009616 Method to detect systematic defects in VLSI manufacturing
01/15/2004US20040009615 Method of fabricating a contact structure having a composite barrier layer between a platinum layer and a polysilicon plug
01/15/2004US20040009437 Forming a photoresist adjacent a substrate; imagewise exposing the photoresist and developing; implanting ions into the photoresist to thereby increase it's stability
01/15/2004US20040009436 Methods for forming resist pattern and fabricating semiconductor device using Si-containing water-soluble polymer
01/15/2004US20040009435 Method for forming semiconductor device
01/15/2004US20040009434 Sandwich photoresist structure in phtotlithographic process