Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/22/2004US20040012086 Method and packaging structure for optimizing warpage of flip chip organic packages
01/22/2004US20040012085 Semiconductor device
01/22/2004US20040012084 Apparatus and method for attaching an integrated circuit sensor to a substrate
01/22/2004US20040012083 Electronic and optoelectronic component packaging technique
01/22/2004US20040012081 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
01/22/2004US20040012080 Connection of integrated circuits
01/22/2004US20040012077 Semiconductor leadframes having dual surface finish for varied molding compound adhesion
01/22/2004US20040012076 For use in fabrication of integrated circuit devices and integrated circuit packaging devices
01/22/2004US20040012075 Forming silicon-germanium alloy layer on a surface of single crystal silicon layer; implanting to form defects that allow mechanical decoupling at or near interface into layers; heating to relax strains within layers, interdiffusion
01/22/2004US20040012073 Semiconductor device and method of manufacturing the same
01/22/2004US20040012071 Comprising a portion used as a fuse
01/22/2004US20040012069 Semiconductor device and manufacturing method for the same
01/22/2004US20040012068 Semiconductor device and its production method
01/22/2004US20040012067 Programmable connector/isolator and double polysilicon layer CMOS process with buried contact using the same
01/22/2004US20040012065 Semiconductor integrated circuit device
01/22/2004US20040012055 Semiconductor device having hetero grain stack gate and method of forming the same
01/22/2004US20040012054 Semiconductor device and its manufacturing method
01/22/2004US20040012052 Semiconductor device
01/22/2004US20040012050 Semiconductor device
01/22/2004US20040012049 Semiconductor device
01/22/2004US20040012048 Gate structure in flash memory cell and method of forming the same, and method of forming dielectric film
01/22/2004US20040012047 Semiconductor device with transistor and capacitor and its manufacture method
01/22/2004US20040012046 Applications of space-charge-limited conduction induced current increase in nitride-oxide dielectric capacitors: voltage regulator for power supply system and others
01/22/2004US20040012045 SDRAM structure and method of fabricating the same
01/22/2004US20040012044 Semiconductor device
01/22/2004US20040012043 Novel dielectric stack and method of making same
01/22/2004US20040012040 Semiconductor integrated circuit device
01/22/2004US20040012039 Non-volatile semiconductor memory device
01/22/2004US20040012038 Semiconductor device
01/22/2004US20040012037 Hetero-integration of semiconductor materials on silicon
01/22/2004US20040012036 Hetero-junction bipolar transistor and a method for manufacturing the same
01/22/2004US20040012032 Nitride-based semiconductor device and method of fabricating the same
01/22/2004US20040012028 Active matrix organic electroluminescent device simplifying a fabricating process and a fabricating method thereof
01/22/2004US20040012024 Opaque low resistivity silicon carbide
01/22/2004US20040012023 Thin film transistor liquid crystal display and method of forming the same
01/22/2004US20040012022 Stack-type DRAM memory structure and its manufacturing method
01/22/2004US20040012018 Organic semiconductor device
01/22/2004US20040012016 Optoelectronic device
01/22/2004US20040012015 Strain compensated semiconductor structures and methods of fabricating strain compensated semiconductor structures
01/22/2004US20040011991 Use of a gettering agent in a chemical mechanical polishing and rinsing operation and apparatus therefor
01/22/2004US20040011966 Energy beam exposure method and exposure apparatus
01/22/2004US20040011959 Scanning electron microscope
01/22/2004US20040011856 Soldering method for mounting electric components
01/22/2004US20040011854 Shutter structure of an oven apparatus used in semiconductor or liquid crystal display processes
01/22/2004US20040011852 Method and device for applying pieces of material to a workpiece
01/22/2004US20040011849 Device with an electrode for the formation of a ball at the end of a wire
01/22/2004US20040011848 Bonding tool and wire bonder
01/22/2004US20040011782 Ceramic heater
01/22/2004US20040011781 Ceramic heater
01/22/2004US20040011780 Method for achieving a desired process uniformity by modifying surface topography of substrate heater
01/22/2004US20040011772 Method of forming semiconductor thin-film and laser apparatus used therefore
01/22/2004US20040011770 Method of and structure for controlling electrode temperature
01/22/2004US20040011764 Apparatus for producing and sustaining a glow discharge plasma under atmospheric conditions
01/22/2004US20040011763 For formation of a pattern such as a contact hole with a high aspect ratio
01/22/2004US20040011666 Positioning the counterelectrodes opposite the metal layer and spaced from metal layer and spaced from each other; passing an electric current for selectively removing a layer of electrolytically dissoluble metal from a substrate
01/22/2004US20040011653 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions
01/22/2004US20040011641 For forming a high density thin film; efficiency
01/22/2004US20040011554 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
01/22/2004US20040011504 Method and apparatus for gas temperature control in a semiconductor processing system
01/22/2004US20040011468 Gas introduction system for temperature adjustment of object to be processed
01/22/2004US20040011467 Materials and gas chemistries for processing systems
01/22/2004US20040011466 Plasma processing apparatus
01/22/2004US20040011465 Plasma Processing apparatus
01/22/2004US20040011464 Promotion of independence between degree of dissociation of reactive gas and the amount of ionization of dilutant gas via diverse gas injection
01/22/2004US20040011463 Resist stripping equipment
01/22/2004US20040011462 Method and apparatus for applying differential removal rates to a surface of a substrate
01/22/2004US20040011388 Cleaning apparatus for cleaning semiconductor substrate, and method of manufacturing semiconductor device
01/22/2004US20040011387 Holder for lifting workpiece such as a substrate used in magnetic disk or integrated circuit manufacturing from liquid bath
01/22/2004US20040011381 Method for removing carbon contamination from optic surfaces
01/22/2004US20040011380 Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials
01/22/2004US20040011379 Silicon oxyfluoride film is formed on a wafer using a plasma vapor deposition method; film remaining inside chamber is cleaned up using a gas containing nitrogen trifluoride
01/22/2004US20040011293 Susceptor pocket with beveled projection sidewall
01/22/2004US20040011292 Single-wafer-processing type CVD apparatus
01/22/2004US20040011289 Laser CVD device and laser CVD method
01/22/2004US20040011287 Electrode-built-in susceptor
01/22/2004US20040011286 Batch type atomic layer deposition apparatus and in-situ cleaning method thereof
01/22/2004US20040011281 Semiconductor manufacturing method
01/22/2004US20040011280 Device substrate and method for producing device substrate
01/22/2004US20040011279 Method of manufacturing semiconductor device
01/22/2004US20040011228 Method and stencil for extruding material on a substrate
01/22/2004US20040011176 Cutting machine having aligned dual spindles
01/22/2004US20040010933 Method and apparatus for liquid-treating and drying a substrate
01/22/2004US20040010932 Apparatus for drying semiconductor substrates using azeotrope effect and drying method using the apparatus
01/22/2004US20040010930 Cross flow processor
01/22/2004US20040010912 Method for making a heat sink device and product made thereby
01/22/2004US20040010910 Heating the interfaces between the lips and substrates, made of liquid crystal polymer layers, to form closures
01/22/2004DE19644504B4 Halbleitervorrichtung mit hoher Durchbruchspannung und Verfahren zu deren Herstellung A semiconductor device having high breakdown voltage and processes for their preparation
01/22/2004DE10330047A1 Halbleitersensor für eine dynamische Größe Semiconductor sensor dynamic quantity
01/22/2004DE10326555A1 Brücken für mikroelektromechanische Strukturen Bridges for microelectromechanical structures
01/22/2004DE10326158A1 Vertikaler Zugriffstransistor mit gekrümmtem Kanal Vertical access transistor with a curved channel
01/22/2004DE10325308A1 Abbildungsverfahren Imaging methods
01/22/2004DE10324836A1 Stabilisierung der Dotierungskonzentration in einem Halbleiterbauelement mit einem epitaxial gefüllten Graben Stabilization of the impurity concentration in a semiconductor device having a epitaxially filled trench
01/22/2004DE10323885A1 Verfahren zur Kristallherstellung und Gerät zur Kristallherstellung Method and apparatus for the production of crystal crystal manufacturing
01/22/2004DE10312642A1 Halbleitereinrichtung und Herstellungsverfahren von Kontakthöcker auf Halbleiterchips A semiconductor device and manufacturing method of bumps on semiconductor chips
01/22/2004DE10307926A1 Magnetische Dünnfilmspeichervorrichtung mit Unterdrückung interner magnetischer Störungen Thin film magnetic memory device with suppression of internal magnetic interference
01/22/2004DE10240356A1 Electrostatic holding element used in the lithographic structuring of semiconductor elements or substrates has a dielectric part with a specified thickness and having a structured surface
01/22/2004DE10235482B3 Vorrichtung zum Fixieren dünner und flexibler Substrate A device for fixing a thin and flexible substrates
01/22/2004DE10230755A1 Anordnung zur Herstellung von Photomasken Arrangement for the production of photomasks
01/22/2004DE10230674A1 Halbleiterkondensator und damit aufgebauter MOSFET Semiconductor capacitor and thus constructed MOSFET
01/22/2004DE10230354A1 Verfahren zur Herstellung einer Halbleiteranordnung auf einem Substrat A process for producing a semiconductor device on a substrate