Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/22/2004WO2004008054A1 Variable heater element for low to high temperature ranges
01/22/2004WO2004008052A2 System and method for cooling a thermal processing apparatus
01/22/2004WO2004008008A2 Control of a gaseous environment in a wafer loading chamber
01/22/2004WO2004007816A1 Method of fabricating substrates, in particular for optics, electronics or optoelectronics________________________________________
01/22/2004WO2004007815A1 Silicon wafer for epitaxial growth, epitaxial wafer, and its manufacturing method
01/22/2004WO2004007800A1 Thermal processing apparatus and method for evacuating a process chamber
01/22/2004WO2004007798A1 Immersion plating of silver
01/22/2004WO2004007796A1 Vapor deposition of tungsten nitride
01/22/2004WO2004007795A1 Film formation method for semiconductor processing
01/22/2004WO2004007794A2 Pulsed nucleation deposition of tungsten layers
01/22/2004WO2004007793A2 Method and apparatus for providing gas to a processing chamber
01/22/2004WO2004007628A1 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
01/22/2004WO2004007608A2 Self-healing polymer compositions
01/22/2004WO2004007318A2 Loadport apparatus and method for use thereof
01/22/2004WO2004007150A1 Carriage robot system and its controlling method
01/22/2004WO2004007146A1 Polishing apparatus and method of dressing polishing tool
01/22/2004WO2004007105A1 Apparatus and method for backfilling a semiconductor wafer process chamber
01/22/2004WO2004007090A1 Apparatus and method for thermally controlled processing of microelectronic workpieces
01/22/2004WO2003096492A3 Automatic gas control system for a gas discharge laser
01/22/2004WO2003096392A3 Method of etching a trench in a silicon-on-insulator (soi) structure
01/22/2004WO2003094218A3 Method of growing monocrystalline oxide having a semiconductor device thereon
01/22/2004WO2003090272A3 Methods for the formation of thin film layers using short-time thermal processes
01/22/2004WO2003089681A3 Mixed frequency high temperature nitride cvd process
01/22/2004WO2003081663A3 Correlation of end-of-line data mining with process tool data mining
01/22/2004WO2003067653A3 Monitoring of contact hole production
01/22/2004WO2003067646A3 Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration
01/22/2004WO2003064962A3 Multi-axis interferometer
01/22/2004WO2003062926A3 Method for constructing an optical beam guide system
01/22/2004WO2003058345A3 Negative-working photoimageable bottom antireflective coating
01/22/2004WO2003054930A3 Device for etching, rinsing and drying substrates in ultra-clean atmosphere
01/22/2004WO2003045820A9 Front opening wafer carrier with path to ground effectuated by door
01/22/2004WO2003044852A3 Estimating reliability of components for testing and quality optimization
01/22/2004WO2003030252A3 Process for producing interconnects
01/22/2004WO2003023819A3 Apparatus with compliant electrical terminals, and methods for forming same
01/22/2004WO2003022519A3 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
01/22/2004WO2003010815A3 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit
01/22/2004WO2002050922A8 Gate electrode with depletion suppression and tunable workfunction
01/22/2004US20040015807 Semiconductor device and semiconductor integrated circuit
01/22/2004US20040015802 Layout design process and system for providing bypass capacitance and compliant density in an integrated circuit
01/22/2004US20040015794 Method of setting process parameter and method of setting process parameter and/or design rule
01/22/2004US20040015528 Programmable logic devices with function-specific blocks
01/22/2004US20040015341 Programmable single-chip device and related development environment
01/22/2004US20040015331 Remote monitoring system for chemical liquid delivery
01/22/2004US20040014842 Die-attaching paste and semiconductor device
01/22/2004US20040014833 Photopolymer technology, as well as photoinitiated colour forming reactions are achievable by applying a reactive substrate selected from a polymerisable and/or crosslinkable composition and a colour changing substance to a support,
01/22/2004US20040014820 Method of preparing a stable lead zircon-titanate sol and method for preparing films based on same
01/22/2004US20040014628 Using mixture of water alkanolamine and sugar alcohols
01/22/2004US20040014408 Method of mounting a rotating tool to a spindle
01/22/2004US20040014400 Polishing composition containing conducting polymer
01/22/2004US20040014398 Method of polishing a substrate with a polishing system containing conducting polymer
01/22/2004US20040014332 Large area, fast frame rate charge coupled device
01/22/2004US20040014331 Semiconductor device with capacitor and process for manufacturing the device
01/22/2004US20040014330 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer
01/22/2004US20040014329 Method for forming DRAM cell
01/22/2004US20040014328 Method of manufacturing semiconductor device
01/22/2004US20040014327 Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials
01/22/2004US20040014326 Bi-layer resist process
01/22/2004US20040014325 Plasma etching equipment
01/22/2004US20040014324 Method for preventing electrode deterioration in etching apparatus
01/22/2004US20040014323 Method of fabricating semiconductor device
01/22/2004US20040014322 Method for forming patterns of a semiconductor device
01/22/2004US20040014321 Methods for manufacturing contact plugs for semiconductor devices
01/22/2004US20040014320 Method and apparatus of generating PDMAT precursor
01/22/2004US20040014319 Prevention of precipitation defects on copper interconnects during cpm by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
01/22/2004US20040014318 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten
01/22/2004US20040014317 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
01/22/2004US20040014316 Method of manufacturing a electrode of capacitor
01/22/2004US20040014315 Formation of composite tungsten films
01/22/2004US20040014314 Evaporative deposition with enhanced film uniformity and stoichiometry
01/22/2004US20040014312 Semiconductor device and manufacturing method thereof
01/22/2004US20040014311 Method for manufacturing a semiconductor device
01/22/2004US20040014310 Method for producing an integrated circuit
01/22/2004US20040014309 Multilayer laser trim interconnect method
01/22/2004US20040014308 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
01/22/2004US20040014307 Method for fabricating semiconductor device
01/22/2004US20040014306 Ms type transistor and its manufacturing method
01/22/2004US20040014305 Two stage etching of silicon nitride to form a nitride spacer
01/22/2004US20040014304 Stable PD-SOI devices and methods
01/22/2004US20040014303 Method of ion implantation for achieving desired dopant concentration
01/22/2004US20040014302 Method of forming silicon on insulator wafers
01/22/2004US20040014301 Method of manufacturing a semiconductor wafer
01/22/2004US20040014300 Method of making device chips collectively from common material substrate
01/22/2004US20040014299 Method for making a stacked structure comprising a thin film adhering to a target substrate
01/22/2004US20040014298 Method and device for cleaning and then bonding substrates
01/22/2004US20040014297 Method for transferring epitaxy layer
01/22/2004US20040014296 Method for forming device isolation layer in semiconductor devices
01/22/2004US20040014295 Atomic layer deposition of titanium nitride using batch type chamber and method for fabricating capacitor by using the same
01/22/2004US20040014294 Method of forming high voltage junction in semiconductor device
01/22/2004US20040014293 Transistor circuit with varying resistance lightly doped diffused regions for electrostatic discharge ("ESD") protection
01/22/2004US20040014292 Sub-micron MOS transistor
01/22/2004US20040014291 Shallow trench isolation structure and method
01/22/2004US20040014290 Hard mask process for memory device without bitline shorts
01/22/2004US20040014289 Method for manufacturing semiconductor device and the device thereof
01/22/2004US20040014288 Method of manufacturing semiconductor devices
01/22/2004US20040014287 Integrated semiconductor memory and fabrication method
01/22/2004US20040014286 Method of forming a select line in a NAND type flash memory device
01/22/2004US20040014285 Method for manufacturing flash memory device
01/22/2004US20040014284 Semiconductor device having a flash memory cell and fabrication method thereof
01/22/2004US20040014283 Fabrication method of semiconductor device
01/22/2004US20040014282 Method for manufacturing nonvolatile semiconductor memory device