| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/27/2004 | US6682961 Thin film transistor array panel used for a liquid crystal display and a manufacturing method thereof |
| 01/27/2004 | US6682958 Method for manufacturing semiconductor device by using sealing apparatus |
| 01/27/2004 | US6682957 Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof |
| 01/27/2004 | US6682956 Method of fabricating package having metal runner |
| 01/27/2004 | US6682955 Stacked die module and techniques for forming a stacked die module |
| 01/27/2004 | US6682954 Method for employing piggyback multiple die #3 |
| 01/27/2004 | US6682952 Method of forming the resin sealed semiconductor device using the lead frame |
| 01/27/2004 | US6682948 Semiconductor device and method for manufacturing the same |
| 01/27/2004 | US6682944 Semiconductor device manufacturing method |
| 01/27/2004 | US6682943 Method for forming minimally spaced MRAM structures |
| 01/27/2004 | US6682873 Forming a masking layer over a surface of a substrate; screen printing plural masking particles over masking layer, removing a portion of masking layr using masking particle as a mask |
| 01/27/2004 | US6682797 Made of thermoplastic resins impervious to water, organics and fine dust |
| 01/27/2004 | US6682777 Substrate processing method |
| 01/27/2004 | US6682772 High temperature deposition of Pt/TiOx for bottom electrodes |
| 01/27/2004 | US6682659 Method for forming corrosion inhibited conductor layer |
| 01/27/2004 | US6682657 Three dimensional etching process |
| 01/27/2004 | US6682642 Seed repair and electroplating bath |
| 01/27/2004 | US6682629 Substrate processing unit |
| 01/27/2004 | US6682628 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 01/27/2004 | US6682617 Method for making wallboard or backerboard sheets including aerated concrete |
| 01/27/2004 | US6682607 Reconditioning of semiconductor substrates to remove photoresist during semiconductor device fabrication |
| 01/27/2004 | US6682605 Apparatus and method for removing coating layers from alignment marks |
| 01/27/2004 | US6682603 Substrate support with extended radio frequency electrode upper surface |
| 01/27/2004 | US6682602 Chemical vapor deposition systems including metal complexes with chelating O- and/or N-donor ligands |
| 01/27/2004 | US6682575 Methanol-containing silica-based CMP compositions |
| 01/27/2004 | US6682414 Article storage system for a clean room |
| 01/27/2004 | US6682408 Polishing apparatus |
| 01/27/2004 | US6682406 Abrasive cleaning tool for removing contamination |
| 01/27/2004 | US6682405 Polishing apparatus having a dresser and dresser adjusting method |
| 01/27/2004 | US6682404 Method for controlling a temperature of a polishing pad used in planarizing substrates |
| 01/27/2004 | US6682343 Substrate processing apparatus |
| 01/27/2004 | US6682295 Flatted object passive aligner |
| 01/27/2004 | US6682288 Substrate processing pallet and related substrate processing method and machine |
| 01/27/2004 | US6682270 Method of loading a sputter pallet |
| 01/27/2004 | US6682113 Wafer clamping mechanism |
| 01/27/2004 | US6681847 Radiator fin formed by sintering operation |
| 01/27/2004 | US6681829 Automatic separator and method to obtain circuits for microelectronics |
| 01/27/2004 | US6681787 System and method of operation of a digital mass flow controller |
| 01/27/2004 | US6681782 Housing end wall through which the vibrational energy is transmitted is thinner than the heat transfer member positioned between the probe and the transducer |
| 01/27/2004 | US6681781 Contacting surface with a solution with an ultradilute concentration of a gaseous cleaning enhancement substance in a liquid solvent; applying acoustic energy to the cleaning liquid. |
| 01/27/2004 | US6681640 Test fixture and method |
| 01/27/2004 | US6681499 Substrate drying method for use with a surface tension effect dryer with porous vessel walls |
| 01/27/2004 | CA2330862C Broadband diffractive diffuser and associated methods |
| 01/23/2004 | CA2433112A1 Cubic memory array |
| 01/22/2004 | WO2004008816A2 Method and device for substrate etching with very high power inductively coupled plasma |
| 01/22/2004 | WO2004008650A1 Direct conversion receiver using vertical bipolar junction transistor available in deep n-well cmos technology |
| 01/22/2004 | WO2004008546A1 Semiconductor component with an integrated radially symmetrical resistor |
| 01/22/2004 | WO2004008544A1 Semiconductor device, production method and production device thereof |
| 01/22/2004 | WO2004008543A1 Bipolar transistor |
| 01/22/2004 | WO2004008538A1 Photoelectric conversion device, image scanning apparatus, and manufacturing method of the photoelectric conversion device |
| 01/22/2004 | WO2004008536A1 Magnetic non-volatile memory element |
| 01/22/2004 | WO2004008529A1 Trench schottky barrier diode |
| 01/22/2004 | WO2004008528A1 Method and wafer for maintaining ultra clean bonding pads on a wafer |
| 01/22/2004 | WO2004008527A1 A method of increasing the area of a useful layer of material transferred onto a support |
| 01/22/2004 | WO2004008526A1 A layer transfer method |
| 01/22/2004 | WO2004008525A1 Method of smoothing the outline of a useful layer of material transferred onto a support substrate |
| 01/22/2004 | WO2004008524A1 Wafer cassette |
| 01/22/2004 | WO2004008523A2 Sealing ring assembly and mounting method |
| 01/22/2004 | WO2004008522A2 Method for producing a component having submerged connecting areas |
| 01/22/2004 | WO2004008521A1 High-resistance silicon wafer and process for producing the same |
| 01/22/2004 | WO2004008520A1 Method for structuring metal by means of a carbon mask |
| 01/22/2004 | WO2004008519A1 Method for forming oxide film and electronic device material |
| 01/22/2004 | WO2004008518A1 Film forming method and film forming apparatus |
| 01/22/2004 | WO2004008517A1 Organic siloxane copolymer film, method and deposition apparatus for producing same, and semiconductor device using such copolymer film |
| 01/22/2004 | WO2004008516A1 Method of forming film and film forming apparatus |
| 01/22/2004 | WO2004008515A1 Method of dry etching, dry etching gas and process for producing perfluoro-2-pentyne |
| 01/22/2004 | WO2004008514A1 Process for forming a fragile layer inside of a single crystalline substrate |
| 01/22/2004 | WO2004008513A1 Method for manufacturing semiconductor device and substrate processing apparatus |
| 01/22/2004 | WO2004008512A1 Semiconductor device and method for manufacturing same |
| 01/22/2004 | WO2004008511A1 Crystallizing apparatus and crystallizing method |
| 01/22/2004 | WO2004008510A1 Surface treating method for substrate |
| 01/22/2004 | WO2004008509A1 Defect reduction in semiconductor materials |
| 01/22/2004 | WO2004008508A1 Exposure transfer mask and exposure transfer mask pattern exchange method |
| 01/22/2004 | WO2004008507A1 Optical integrator, illumination optical device, exposure apparatus, and exposure method |
| 01/22/2004 | WO2004008506A1 Large-diameter sic wafer and manufacturing method thereof |
| 01/22/2004 | WO2004008505A2 Semiconductor substrate damage protection system |
| 01/22/2004 | WO2004008503A1 Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules |
| 01/22/2004 | WO2004008502A2 Multirate processing for metrology of plasma rf source |
| 01/22/2004 | WO2004008501A1 Method for detection and relocation of wafer defects |
| 01/22/2004 | WO2004008499A1 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
| 01/22/2004 | WO2004008496A2 Non-oriented optical character recognition of a wafer mark |
| 01/22/2004 | WO2004008495A2 Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses |
| 01/22/2004 | WO2004008494A2 Servomotor control system and method in a semiconductor manufacturing environment |
| 01/22/2004 | WO2004008493A2 Method and apparatus for supporting semiconductor wafers |
| 01/22/2004 | WO2004008491A2 Thermal processing system and configurable vertical chamber |
| 01/22/2004 | WO2004008489A2 Process for ultra-thin body soi devices that incorporate epi silicon tips and article made thereby |
| 01/22/2004 | WO2004008487A2 Test system and methodology |
| 01/22/2004 | WO2004008486A2 Wafer bonding of thinned electronic materials and circuits to high performance substrates |
| 01/22/2004 | WO2004008477A2 Heating jacket for plasma etching reactor, and etching method using same |
| 01/22/2004 | WO2004008476A1 Controlling the characteristics of ribbon-shaped implanter ion-beams |
| 01/22/2004 | WO2004008475A1 Ion beam device and ion beam processing method, and holder member |
| 01/22/2004 | WO2004008255A2 Method and apparatus for measuring critical dimensions with a particle beam |
| 01/22/2004 | WO2004008254A1 Projection optical system, exposure apparatus and device fabrication method |
| 01/22/2004 | WO2004008253A1 Composition for antireflection film formation |
| 01/22/2004 | WO2004008246A2 Method and system for context-specific mask writing |
| 01/22/2004 | WO2004008244A2 Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables |
| 01/22/2004 | WO2004008163A2 Assembly for connecting a test device to an object to be tested |
| 01/22/2004 | WO2004008119A1 Detection method and apparatus |
| 01/22/2004 | WO2004008118A1 Detection method and apparatus |
| 01/22/2004 | WO2004008068A1 Overlay error detection |