Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2004
03/30/2004US6712081 Pressure processing device
03/30/2004US6712078 Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same
03/30/2004US6712077 Amorphous silicon film on the cylinder core layer is removed; cylinder core pattern is etched and oxide film is removed with potassium hydroxide
03/30/2004US6712020 Toroidal plasma source for plasma processing
03/30/2004US6711956 Method and apparatus for regulating exhaust pressure in evacuation system of semiconductor process chamber
03/30/2004US6711948 Method and apparatus for testing of sheet material
03/30/2004US6711873 Apparatus for loading electronic packages of varying sizes
03/30/2004US6711815 Fabricating method of semiconductor devices
03/30/2004US6711813 Planarizing outer surface; isostatic pressingl; lamination; etching
03/30/2004US6711775 System for cleaning a semiconductor wafer
03/30/2004CA2288480C A method for fabrication of multi-step structures using embedded etch stop layers
03/30/2004CA2266062C Dynamic content addressable memory cell
03/30/2004CA2257232C Silicon carbide metal-insulator semiconductor field effect transistor
03/26/2004CA2442642A1 Process for manufacturing an aluminum nitride ain substrate
03/25/2004WO2004026004A1 Organic electroluminescence display and its manufacturing method
03/25/2004WO2004025848A1 Improved inspection system for integrated applications
03/25/2004WO2004025746A2 Method for treating a photovoltaic active layer and organic photovoltaic element
03/25/2004WO2004025740A1 Method of enhancing the photoconductive properties of a semiconductor and method of producing a semiconductor with enhanced photoconductive properties
03/25/2004WO2004025739A2 Method for producing an integrated pin diode and corresponding circuit
03/25/2004WO2004025737A1 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system
03/25/2004WO2004025736A1 Solar cell and its manufacturing method
03/25/2004WO2004025735A1 Semiconductor device
03/25/2004WO2004025733A1 Non-planar nitride-based semiconductor structure and metehod for fabricating the same
03/25/2004WO2004025731A2 Method for the production of sonos memory cells, sonos memory cell, and memory cell field
03/25/2004WO2004025729A2 Integrated circuit comprising intermediate materials and corresponding components
03/25/2004WO2004025727A1 Method for sealing a microcavity and package comprising at least one microcavity
03/25/2004WO2004025726A2 Method for selectively covering a micro machined surface
03/25/2004WO2004025725A2 Method for producing a memory cell field comprising memory transistors that are located in trenches
03/25/2004WO2004025724A1 Jet singulation of a substrate
03/25/2004WO2004025723A1 Dopant interface formation of an interconnect
03/25/2004WO2004025722A1 A method of increasing the area of a useful layer of material transferred onto a support
03/25/2004WO2004025721A1 Substrate-storing container
03/25/2004WO2004025720A1 Manufacturing an ic
03/25/2004WO2004025719A2 Nitrogen passivation of interface states in sio2/sic structures
03/25/2004WO2004025718A1 Etchant and etching method
03/25/2004WO2004025717A1 Device and method for polishing edges of semiconductor wafer
03/25/2004WO2004025716A1 Flow-type thin film deposition apparatus and injector assembly therefor
03/25/2004WO2004025715A1 Method for production of a layered structure with nanocrystals in a dielectric layer
03/25/2004WO2004025714A2 Method for production of a semiconductor structure
03/25/2004WO2004025713A1 Substrate end effector
03/25/2004WO2004025712A2 Method for p-type doping wide band gap oxide semiconductors
03/25/2004WO2004025711A2 Large area substrate processing system
03/25/2004WO2004025710A2 Method of heating a substrate in a variable temperature process using a fixed temperature chuck
03/25/2004WO2004025709A2 Method for fabricating an ohmic contact in a semiconductor device
03/25/2004WO2004025708A2 Support plate for semiconductor components
03/25/2004WO2004025707A2 Active electronic devices based on gallium nitride and its alloys grown on silicon substrates with buffer layers of sicain
03/25/2004WO2004025705A2 Organic photosensitive optoelectronic device
03/25/2004WO2004025701A2 Load lock optimization method and system
03/25/2004WO2004025697A2 Thermal process station with heated lid
03/25/2004WO2004025696A2 Active matrix backplane for controlling controlled elements and method of manufacture thereof
03/25/2004WO2004025695A2 Semiconductor device with wire bond inductor and method
03/25/2004WO2004025693A2 Method for the production of a semi-conductive structure comprising a plurality of gate stacks arranged on a semi-conductor substrate and corresponding semi-conductive structure
03/25/2004WO2004025675A1 Process for preparing nano-porous metal oxide semiconductor layers
03/25/2004WO2004025660A1 Memory cell
03/25/2004WO2004025468A1 Semiconductor device
03/25/2004WO2004025378A2 Holographic or optically variable printing material and method for customized printing
03/25/2004WO2004025370A1 Optical reproduction system, in particular catadioptric reduction lens
03/25/2004WO2004025360A1 Tiled silicon wafers on a common glass substrate and method of manufacture thereof
03/25/2004WO2004025313A1 Reduced chip testing scheme at wafer level
03/25/2004WO2004025199A1 Processing device, and processing device maintenance method
03/25/2004WO2004024983A2 Method and apparatus for electroless deposition with temperature-controlled chuck
03/25/2004WO2004024982A1 Film forming device
03/25/2004WO2004024976A1 Component protected against corrosion and method for the production thereof and device for carrying out said method
03/25/2004WO2004024619A1 Method for processing substrate
03/25/2004WO2004024594A1 Carrier with tacky surfaces
03/25/2004WO2004024401A1 Teaching method and processing system
03/25/2004WO2004024394A1 Control of removal profile in electrochemically assisted cmp
03/25/2004WO2004024393A1 A polishing pad support that improves polishing performance and longevity
03/25/2004WO2004024391A1 Novel finishing pad design for multidirectional use
03/25/2004WO2004016532A3 Modular belt carrier for electronic components
03/25/2004WO2004013674A9 Method and system for correction of intrinsic birefringence in uv microlithography
03/25/2004WO2004006016A3 Mask and manufacturing method using mask
03/25/2004WO2004001799A3 Method for fabricating a gate structure of a field effect transistor
03/25/2004WO2003107399A3 Method for improving nitrogen profile in plasma nitrided gate dielectric layers
03/25/2004WO2003100841A3 Method for the production of a memory cell, memory cell and memory cell arrangement
03/25/2004WO2003096402A3 Methods of controlling oxygen partial pressure during annealing of a perovskite dielectric layer, and structures fabricated thereby
03/25/2004WO2003092077A3 Electronic displays
03/25/2004WO2003092040A3 Method for processing a wafer
03/25/2004WO2003088354A3 Method for producing a copy protection for an electronic circuit and corresponding component
03/25/2004WO2003088303A3 Multi-directional scanning of movable member and ion beam monitoring arrangement therefor
03/25/2004WO2003083908A3 Packaging system for semiconductor devices
03/25/2004WO2003079410A3 Supporting control gate connection on a package using additional bumps
03/25/2004WO2003078859A3 Reinforced chemical mechanical planarization belt
03/25/2004WO2003077285A3 Thin-film capacitor having multi-layer dielectric film including silicon dioxide and tantalum pentoxide
03/25/2004WO2003065447A3 No-flow underfill encapsulant
03/25/2004WO2003063233A3 Systems and methods for closed loop defect reduction
03/25/2004WO2003063172A3 Method for enhancing electrode surface area in dram cell capacitors
03/25/2004WO2003060959A3 Method for applying metal features onto barrier layers using electrochemical deposition
03/25/2004WO2003060958A3 Air bearing-sealed micro-processing chamber
03/25/2004WO2003059027A8 System for producing electrical and integrated circuits
03/25/2004WO2003056619A3 Selective deposition of a barrier layer on a dielectric material
03/25/2004WO2003056066A3 Apparatus for the generation and supply of fluorine gas
03/25/2004WO2003034501A3 Mos devices and corresponding manufacturing methods and circuits
03/25/2004WO2003028087A3 Manufacturing process of integrated circuits in flip-chip technology
03/25/2004WO2003028071A3 Wafer cassette transport cart with self correcting fault alignment block and method
03/25/2004WO2002025698A3 Cooling body, especially for cooling electronic components
03/25/2004WO2001082335A3 Real-time evaluation of stress fields and properties in line features formed on substrates
03/25/2004US20040060033 Mask data processor
03/25/2004US20040060030 Power supply wiring method for semiconductor integrated circuit and semiconductor integrated circuit
03/25/2004US20040060028 Exposed and embedded overlay structure