| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/06/2004 | US6716659 Method and apparatus for shaping semiconductor surfaces |
| 04/06/2004 | US6716658 Method of preventing generation of particles in chamber |
| 04/06/2004 | US6716655 Group III nitride compound semiconductor element and method for producing the same |
| 04/06/2004 | US6716652 Method and system for adaptive sampling testing of assemblies |
| 04/06/2004 | US6716651 Method and apparatus for identifying a wafer cassette |
| 04/06/2004 | US6716650 Interface void monitoring in a damascene process |
| 04/06/2004 | US6716649 Method for improving substrate alignment |
| 04/06/2004 | US6716648 Method of manufacturing and testing semiconductor integrated circuit device |
| 04/06/2004 | US6716647 Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small productions runs |
| 04/06/2004 | US6716646 Method and apparatus for performing overlay measurements using scatterometry |
| 04/06/2004 | US6716645 MFMOS capacitors with high dielectric constant materials |
| 04/06/2004 | US6716644 Method for forming MRAM bit having a bottom sense layer utilizing electroless plating |
| 04/06/2004 | US6716643 Method for producing a semiconductor memory element |
| 04/06/2004 | US6716571 Selective photoresist hardening to facilitate lateral trimming |
| 04/06/2004 | US6716570 Low temperature ( less-than 20 degrees c.), high density oxygen and argon plasma and intense uv radiation is used to simultaneously trim and harden a photoresist linewidth in an icp chamber |
| 04/06/2004 | US6716564 Alkali-soluble resin,such as a phenolic resin, that has been modified with aniline or an aniline derivative |
| 04/06/2004 | US6716563 Azo dyes and azo-metal complexes for atomic force microscope lithography |
| 04/06/2004 | US6716478 Coating film forming apparatus and coating film forming method |
| 04/06/2004 | US6716477 Method and apparatus for monitoring process exhaust gas, semiconductor-manufacturing device and method and system for managing semiconductor-manufacturing device |
| 04/06/2004 | US6716403 Recovering a copper component from a cleaning agent that has been used for removing a phosphine or a silane contained as a harmful component in a harmful gas. |
| 04/06/2004 | US6716365 Method for wet etching and wet etching apparatus |
| 04/06/2004 | US6716362 Method for thin film laser reflectance correlation for substrate etch endpoint |
| 04/06/2004 | US6716334 Electroplating process chamber and method with pre-wetting and rinsing capability |
| 04/06/2004 | US6716330 Electroless plating apparatus and method |
| 04/06/2004 | US6716324 Sputtering, controlling bias voltage |
| 04/06/2004 | US6716304 Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder |
| 04/06/2004 | US6716302 Dielectric etch chamber with expanded process window |
| 04/06/2004 | US6716301 Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe |
| 04/06/2004 | US6716298 Method and apparatus for measuring and dispensing a wafer etchant |
| 04/06/2004 | US6716295 Protective tape applying and separating method |
| 04/06/2004 | US6716288 Reactor for manufacturing a semiconductor device |
| 04/06/2004 | US6716285 Spin coating of substrate with chemical |
| 04/06/2004 | US6716094 Chemical mechanical polishing retaining ring |
| 04/06/2004 | US6716090 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/06/2004 | US6716089 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/06/2004 | US6716087 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus |
| 04/06/2004 | US6716086 Edge contact loadcup |
| 04/06/2004 | US6716084 Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
| 04/06/2004 | US6716046 Damascene layer is patterned, the channel region is recessed by etch that is self-aligned to the patterned damascene layer, and the gate electrode is formed by depositing a material over the channel region and patterned damascene |
| 04/06/2004 | US6716027 When any of the boat parts experiences thermal deformation after long periods of use, the boat part may be readily replaced without damaging any part of the boat and without the costs associated with replacing the boat entirely |
| 04/06/2004 | US6715978 Interbay transfer interface between an automated material handling system and a stocker |
| 04/06/2004 | US6715944 Apparatus for removing photoresist film |
| 04/06/2004 | US6715943 Solution treatment method and solution treatment unit |
| 04/06/2004 | US6715871 Method of forming film pattern, device for forming film pattern, conductive film wiring, electro-optical device, electronic device, and non-contact card medium |
| 04/06/2004 | US6715666 Wire bonding method, method of forming bump and bump |
| 04/06/2004 | US6715663 Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method |
| 04/06/2004 | US6715660 Recognition device, bonding device, and method of manufacturing a circuit device |
| 04/06/2004 | US6715659 Apparatus for clamping semiconductor devices using sliding finger supports |
| 04/06/2004 | US6715658 Ultra fine pitch capillary |
| 04/06/2004 | US6715498 For processing wafers in a hybrid supercritical fluid processing vessel |
| 04/06/2004 | US6715497 Treatment to eliminate polysilicon defects induced by metallic contaminants |
| 04/06/2004 | US6715496 Turbomolecular pump coupled to a process chamber, using a fluorinated gas |
| 04/06/2004 | US6715495 Pellicle frame is filled with an absorbent material selected to scavenge optical contaminants comprising gaseous species occupying the space between the pellicle film and the reticle |
| 04/06/2004 | US6715348 Method and apparatus for detecting liquid level |
| 04/06/2004 | US6715204 Printed wiring board and method for producing the same |
| 04/06/2004 | US6715203 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 04/06/2004 | CA2245775C Method and device for bonding a wire conductor |
| 04/01/2004 | WO2004028228A1 Part mounting apparatus and part mounting method |
| 04/01/2004 | WO2004028208A1 Wafer holder and system for producing semiconductor |
| 04/01/2004 | WO2004027951A1 High power semiconductor laser diode and method for making such a diode |
| 04/01/2004 | WO2004027949A1 Semiconductor device |
| 04/01/2004 | WO2004027890A2 Organic thin film zener diodes |
| 04/01/2004 | WO2004027874A1 Photoelectric conversion apparatus and manufacturing method of same |
| 04/01/2004 | WO2004027873A2 N-p butting connections on soi substrates |
| 04/01/2004 | WO2004027871A1 Capacitor over plug structure |
| 04/01/2004 | WO2004027870A2 Series memory architecture |
| 04/01/2004 | WO2004027869A1 Semiconductor device |
| 04/01/2004 | WO2004027867A1 Method of manufacturing a wafer assembly |
| 04/01/2004 | WO2004027866A2 Method for creating a link in an integrated metal substrate |
| 04/01/2004 | WO2004027865A2 Support structures for wirebond regions of contact pads over low modulus materials |
| 04/01/2004 | WO2004027863A2 Hybrid card |
| 04/01/2004 | WO2004027861A1 Semi-conductor component with condensators buried in the substrate and insulated component layer thereof |
| 04/01/2004 | WO2004027860A1 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method |
| 04/01/2004 | WO2004027859A1 Method for the production of individual monolithically integrated semiconductor circuits |
| 04/01/2004 | WO2004027858A1 Formation of a relaxed useful layer from a wafer with no buffer layer |
| 04/01/2004 | WO2004027857A1 Method for processing semiconductor substrate |
| 04/01/2004 | WO2004027856A1 Method for supporting substrate, substrate supporting apparatus and exposure apparatus |
| 04/01/2004 | WO2004027855A1 Measurement of lateral diffusion of diffused layers |
| 04/01/2004 | WO2004027854A2 Method for the production of electrodes on a type ii or vi semiconductor material or on a compound of said material |
| 04/01/2004 | WO2004027853A1 Method for structuring layers on semiconductor components and semiconductor memory |
| 04/01/2004 | WO2004027852A1 Method for forming insulating film on substrate, method for manufacturing semiconductor device and substrate-processing apparatus |
| 04/01/2004 | WO2004027851A2 Method of forming and/or modifying a dielectric film on a semiconductor surface |
| 04/01/2004 | WO2004027850A1 Interlayer adhesion promoter for low k materials |
| 04/01/2004 | WO2004027849A1 Method for manufacturing semiconductor device and substrate processing apparatus |
| 04/01/2004 | WO2004027848A1 Metal spacer gate for metal oxide semiconductor device |
| 04/01/2004 | WO2004027847A1 Method of introducing impurity, device and element |
| 04/01/2004 | WO2004027846A1 Substrate processing apparatus and method of manufacturing semiconductor device |
| 04/01/2004 | WO2004027845A1 Heat-treating apparatus |
| 04/01/2004 | WO2004027844A2 Method for the production of a composite sicoi-type substrate comprising an epitaxy stage |
| 04/01/2004 | WO2004027843A1 Surface processing method |
| 04/01/2004 | WO2004027842A1 X-ray generator, e-ray exposure apparatus, and x-ray filter |
| 04/01/2004 | WO2004027841A2 Semiconductor memory cells |
| 04/01/2004 | WO2004027840A2 Process for etching silicon wafers |
| 04/01/2004 | WO2004027839A2 Electrostatic chuck having a low level of particle generation and method of fabricating same |
| 04/01/2004 | WO2004027838A2 Fast gas exchange for thermal conductivity modulation |
| 04/01/2004 | WO2004027837A1 Temperature-controlled substrate holder |
| 04/01/2004 | WO2004027835A2 Advanced microelectronic connector assembly and method of manufacturing |
| 04/01/2004 | WO2004027834A2 Mim capacitor structures and fabrication methods in dual-damascene structures |
| 04/01/2004 | WO2004027826A2 System and method for removing material |
| 04/01/2004 | WO2004027824A2 Nitride and polysilicon interface with titanium layer |