| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/31/2004 | EP1403874A1 Memory device |
| 03/31/2004 | EP1403717A1 Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device |
| 03/31/2004 | EP1403714A2 Lithographic apparatus and a measurement system |
| 03/31/2004 | EP1403691A1 Electro-optical display device and its manufacturing method including the transfer of a chip |
| 03/31/2004 | EP1403686A2 Liquid crystal display device |
| 03/31/2004 | EP1403685A2 Liquid crystal display device |
| 03/31/2004 | EP1403651A2 Testing integrated circuits |
| 03/31/2004 | EP1403629A2 Apparatus for detecting an amount of strain and method for manufacturing same |
| 03/31/2004 | EP1403401A2 Precious alloyed metal solder plating process |
| 03/31/2004 | EP1403351A1 Polishing composition and polishing method using the same |
| 03/31/2004 | EP1403228A1 Ceramic component and production method therefor |
| 03/31/2004 | EP1402963A2 Processing of semiconductor components with dense processing fluids and ultrasonic energy |
| 03/31/2004 | EP1402636A2 Integrated circuit and method for testing the integrated circuit |
| 03/31/2004 | EP1402584A1 Arrangement for reducing the piezoelectric effects in at least one electrical component which is sensitive to piezoelectric effects and arranged in an active layer of semiconductor material |
| 03/31/2004 | EP1402580A1 Symmetric trench mosfet device and method of making same |
| 03/31/2004 | EP1402577A2 Integration of two memory types |
| 03/31/2004 | EP1402576A2 Structure and method of fabricating embedded vertical dram arrays with silicided bitline and polysilicon interconnect |
| 03/31/2004 | EP1402574A2 Electrostatic discharge (esd) protection device with simultaneous and distributed self-biasing for multi-finger turn-on |
| 03/31/2004 | EP1402573A1 Method and structure for buried circuits and devices |
| 03/31/2004 | EP1402572A1 Method for producing miniature amplifier and signal processing unit |
| 03/31/2004 | EP1402571A2 Method of transferring a substantially disc-shaped workpiece |
| 03/31/2004 | EP1402570A2 Control of solid state dimensional features |
| 03/31/2004 | EP1402569A2 Lithography method for forming semiconductor devices on a wafer and apparatus |
| 03/31/2004 | EP1402568A2 Method and apparatus for controlling a plating process |
| 03/31/2004 | EP1402567A2 Film or layer made of semi-conductive material and method for producing said film or layer |
| 03/31/2004 | EP1402566A2 Megasonic cleaner and dryer system |
| 03/31/2004 | EP1402565A2 Holding device for wafers |
| 03/31/2004 | EP1402560A1 Configurable plasma volume etch chamber |
| 03/31/2004 | EP1402559A1 Methods and apparatus for ion implantation with variable spatial frequency scan lines |
| 03/31/2004 | EP1402542A2 Passivating overcoat bilayer |
| 03/31/2004 | EP1402427A2 Method and system for design selection by interactive visualization |
| 03/31/2004 | EP1402426A2 Method for generating design constraints for modulates in a hierarchical integrated circuit design system |
| 03/31/2004 | EP1402318A1 A stamp having an antisticking layer and a method of forming of repairing such a stamp |
| 03/31/2004 | EP1402316A2 Mask repair with electron beam-induced chemical etching |
| 03/31/2004 | EP1402242A2 Using scatterometry to develop real time etch image |
| 03/31/2004 | EP1402081A1 Ring-type sputtering target |
| 03/31/2004 | EP1401994A1 Aqueous buffered fluoride-containing etch residue removers and cleaners |
| 03/31/2004 | EP1401617A1 Edge grip aligner with buffering capabilities |
| 03/31/2004 | EP1401614A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 03/31/2004 | EP1358021A4 Inverted pressure vessel with shielded closure mechanism |
| 03/31/2004 | EP1339550B1 A process and an apparatus for the formation of patterns in films using temperature gradients |
| 03/31/2004 | EP1320913B1 High-peak-power laser device and application to the generation of light in the extreme ultraviolet |
| 03/31/2004 | EP1315605B1 Mold and method for encapsulating an electronic device |
| 03/31/2004 | EP1314191B1 Composite structure for electronic microsystems and method for production of said composite structure |
| 03/31/2004 | EP1234010B1 Use of cesium hydroxide in a dielectric cmp slurry |
| 03/31/2004 | EP1208521A4 Unitary package identification and dimensioning system employing ladar-based scanning methods |
| 03/31/2004 | EP1208047A4 Inverted pressure vessel with horizontal through loading |
| 03/31/2004 | EP1200228B1 Improvement in and relating to edge grinding |
| 03/31/2004 | EP1173375B1 Method for contactlessly gripping and positioning components |
| 03/31/2004 | EP1057212B1 System for the treatment of wafers |
| 03/31/2004 | EP1010245A4 System for compensating for temperature induced delay variation in an integrated circuit |
| 03/31/2004 | EP0985154B1 Broadband impedance matching probe |
| 03/31/2004 | CN2609312Y Organic electroluminescence panel structure |
| 03/31/2004 | CN2609311Y Packaged structure of organic electroluminescence panel |
| 03/31/2004 | CN2609180Y Testing head and testing fixed piece |
| 03/31/2004 | CN2609179Y Improved structure of chip testing machine |
| 03/31/2004 | CN2609178Y Automatic all heating device for production of semiconductor device |
| 03/31/2004 | CN1486513A Compound semiconductor element based on group III element nitride |
| 03/31/2004 | CN1486512A Semiconductor device and method for fabricating the same |
| 03/31/2004 | CN1486511A Apparatus and method for forming a battery in an integrated circuit |
| 03/31/2004 | CN1486510A Method for forming a flip chip on leadframe semiconductor package |
| 03/31/2004 | CN1486507A Method and device for alignment |
| 03/31/2004 | CN1486506A Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
| 03/31/2004 | CN1486505A Ammonium oxalate-containing polishing system and method |
| 03/31/2004 | CN1486504A Chromium adhesion layer for copper vias in low-K technology |
| 03/31/2004 | CN1486449A Multilayer elements containing photoresist compositions and their use in microlithography |
| 03/31/2004 | CN1486431A Input/output continuity test mode circuit |
| 03/31/2004 | CN1486430A Pusher and electronic part-testing apparatus with the same |
| 03/31/2004 | CN1486388A Laterally floating latch hub assembly |
| 03/31/2004 | CN1486281A Method for preparing a stable lead zircon-titanate sol and method for preparing films based on same |
| 03/31/2004 | CN1486279A Composition comprising an oxidizing and complexing compound |
| 03/31/2004 | CN1486233A Polishing pad and method of use thereof |
| 03/31/2004 | CN1486215A Spheres and method of forming a plurality of spheres |
| 03/31/2004 | CN1485927A Semiconductor substrate and method of manufacturing the same, and semiconductor device,and method of manufacturing the same |
| 03/31/2004 | CN1485926A Sram formed on soi substrate |
| 03/31/2004 | CN1485924A Integrated metal-insulator-metal capacitor and metal gate transistor |
| 03/31/2004 | CN1485921A Shielding layer structure of semiconductor component and forming method thereof |
| 03/31/2004 | CN1485920A Single electron memory using vertical stratification carbon nanometer transistor at double ends and its manufacturing method |
| 03/31/2004 | CN1485919A 半导体器件 Semiconductor devices |
| 03/31/2004 | CN1485915A Single electron memory using vertical stratification carbon nanometer transistor for design and its manufacturing method |
| 03/31/2004 | CN1485910A Semiconductor devices |
| 03/31/2004 | CN1485909A Method to improve performance of microelectronic circuits |
| 03/31/2004 | CN1485908A Semiconductor device and manufacturing process thereof |
| 03/31/2004 | CN1485907A Structure and method without using silver glue and crystal grain metallic pad in process flow of conducting wire framework |
| 03/31/2004 | CN1485903A Adhesion manufacture method of heat sink and base plate and packaging members of heat sink |
| 03/31/2004 | CN1485902A Packaging structure and manufacturing method of flip chip |
| 03/31/2004 | CN1485901A Method of fabricating 1t1r resistive memory array |
| 03/31/2004 | CN1485900A Manufacturing method of mixing analog component capacitor |
| 03/31/2004 | CN1485899A Manufacturing method of mixing analog component capacitor with double grid electrode oxide layers |
| 03/31/2004 | CN1485898A Low-power consumption related bi-sampling circuit structure |
| 03/31/2004 | CN1485897A Method for fabricating semiconductor device by forming damascene interconnections |
| 03/31/2004 | CN1485896A Process for preparing metallic interconnection wire |
| 03/31/2004 | CN1485895A Method for fabricating low well of semiconductor device using low energy ion implantation |
| 03/31/2004 | CN1485894A Circuit simulation method |
| 03/31/2004 | CN1485893A Manufacturing method of packaging base plate and its structure |
| 03/31/2004 | CN1485892A 激光处理方法 Laser treatment |
| 03/31/2004 | CN1485891A Semiconductor memory device and method for manufacturing semiconductor device |
| 03/31/2004 | CN1485890A Definition method of silicon oxide/silicon nitride/ silicon oxide dielectric layer |
| 03/31/2004 | CN1485889A Manufacturing method of dielectric layer |
| 03/31/2004 | CN1485888A Magma flow control method and system utilizing compound control mode |