Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2004
03/25/2004US20040056335 Superconducting integrated circuit and method for fabrication thereof
03/25/2004US20040056333 Electromagnetic traps in integrated circuit for minimizing cross-talk
03/25/2004US20040056332 Apparatus and method for forming a silicon film across the surface of a glass substrate
03/25/2004US20040056330 Fine line circuitization
03/25/2004US20040056329 Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement
03/25/2004US20040056327 Discontinuous dielectric interface for bipolar transistors
03/25/2004US20040056326 Method and structure for controlling surface properties of dielectric layers in a thin film component for improved trimming
03/25/2004US20040056324 MIM capacitor structures and fabrication methods in dual-damascene structures
03/25/2004US20040056323 Capacitance reduction by tunnel formation for use with a semiconductor device
03/25/2004US20040056319 Non volatile embedded memory with poly protection layer
03/25/2004US20040056317 Structure for preventing salicide bridging and method thereof
03/25/2004US20040056316 Method and apparatus for a flash memory device comprising a source local interconnect
03/25/2004US20040056315 Semiconductor device and manufacturing method thereof
03/25/2004US20040056314 Improve performance of high-frequency circuit, increase the electrical resistance of substrate, by control the concentration of dissolved oxygen at not more than 8 x 1017 atoms/cm3
03/25/2004US20040056312 Semiconductor device and method for fabricating the same
03/25/2004US20040056309 SOI structure and method of producing same
03/25/2004US20040056308 Semiconductor device and manufacturing method therefor
03/25/2004US20040056307 Ultra small-sized soi mosfet and method of fabricating the same
03/25/2004US20040056306 Power semiconductor device
03/25/2004US20040056304 Method of forming transistor having insulating spacers on gate sidewalls
03/25/2004US20040056301 Transistor having insulating spacers on gate sidewalls to reduce overlap between the gate and doped extension regions of the source and drain
03/25/2004US20040056300 Flash memory device and fabricating method therefor
03/25/2004US20040056299 Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate
03/25/2004US20040056297 Substrate device, method of manufacturing the same, electro-optical device, and electronic apparatus
03/25/2004US20040056296 Semiconductor device and method of manufacturing the semiconductor device
03/25/2004US20040056295 Structurally-stabilized capacitors and method of making of same
03/25/2004US20040056294 Semiconductor memory and method for fabricating the same
03/25/2004US20040056293 Semiconductor device and method of fabricating the same
03/25/2004US20040056292 Electrode line structure having fine line width and method of forming the same
03/25/2004US20040056291 Semiconductor memory device
03/25/2004US20040056290 Semiconductor device and method for manufacturing the same
03/25/2004US20040056289 Semiconductor memory device, nonvolatile memory device and magnetic memory device provided with memory elements and interconnections
03/25/2004US20040056288 Magnetic memory device and method of manufacturing the same
03/25/2004US20040056287 Series memory architecture
03/25/2004US20040056286 Memory architecture with memory cell groups
03/25/2004US20040056285 Metal spacer gate for CMOS FET
03/25/2004US20040056283 Semiconductor device and manufacturing method of the same
03/25/2004US20040056282 Semiconductor device
03/25/2004US20040056281 Method for forming a self-aligned contact of a semiconductor device and method for manufacturing a semiconductor device using the same
03/25/2004US20040056280 Electrical and electronic apparatus having wires connected between different layers; electromigration resistance
03/25/2004US20040056278 Soft error resistant semiconductor memory device
03/25/2004US20040056276 Method and device using titanium doped aluminum oxide for passivation of ferroelectric materials
03/25/2004US20040056274 Semiconductor device and method for manufacturing the same
03/25/2004US20040056272 Silicon or gallium arsenide substrates having integrated circuits on the surfaces and thermoconductive underlayers containtg capacitors, coils or resistors; heat exchanging
03/25/2004US20040056271 Nanostructure filament layouts formed by exposing substrate to gas mixtures to form masks, then selectively etching; print heads; light emitting diodes
03/25/2004US20040056270 Memory system capable of operating at high temperatures and method for fabricating the same
03/25/2004US20040056267 Gallium nitride semiconductor device and method of producing the same
03/25/2004US20040056259 Electrical and electronic apparatus comoprising multilayer nitrides of gallium, indium and aluminum, used as lasers, light emitting diodes or quantum wells having durability
03/25/2004US20040056258 Multi-wavelength luminous element
03/25/2004US20040056253 Semiconductor device
03/25/2004US20040056251 Thin film transistor array panel and manufacturing method thereof
03/25/2004US20040056249 Chemically enhanced focused ion beam micro-machining of copper
03/25/2004US20040056247 Bitline of semiconductor device having stud type capping layer and method for fabricating the same
03/25/2004US20040056246 Organic thin film transistor (OTFT) and manufacturing process thereof
03/25/2004US20040056216 Wafer prealignment apparatus, its method for judging wafer presence, method for sensing wafer edge position, computer-readable record medium with recorded program for executing this position sensing method, apparatus for sensing wafer edge position, and prelignment sensor
03/25/2004US20040056215 Electron beam exposure mask, electron beam exposure method, method of fabricating semiconductor device, and electron beam exposure apparatus
03/25/2004US20040056214 Ion implanting apparatus for manufacturing semiconductor devices
03/25/2004US20040056196 Method and apparatus for monitoring environment and apparatus for producing semiconductor
03/25/2004US20040056193 Applications operating with beams of charged particles
03/25/2004US20040056176 Non-volatile solid state image pickup device and its drive
03/25/2004US20040056073 Wafer-bonding using solder and method of making the same
03/25/2004US20040056072 Concave face wire bond capillary and method
03/25/2004US20040056017 System and method for heating and cooling wafer at accelerated rates
03/25/2004US20040056008 Apparatus for cutting a non-metallic substrate using a laser beam
03/25/2004US20040056000 Surface processing method for a molded metal housing
03/25/2004US20040055999 Method for planarizing polysilicon
03/25/2004US20040055998 Method for providing a smooth wafer surface
03/25/2004US20040055997 Etchant for wires, a method for manufacturing the wires using the etchant, a thin film transistor array substrate and a method for manufacturing the same including the method
03/25/2004US20040055995 Notch-free etching of high aspect SOI structures using alternating deposition and etching and pulsed plasma
03/25/2004US20040055967 Applying voltage while distributing cleaning liquid in order to ionize; oxidation/reduction
03/25/2004US20040055895 Electrodeposition of noble metal and one other metal for alloying with noble metal on the surface of a microelectronic workpiece, using an acid bath; electrolysis
03/25/2004US20040055894 Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus
03/25/2004US20040055893 Utilizes a vacuum chuck-type substrate holder configured to secure a substrate thereto with the back side of the substrate being in contact with the vacuum chuck and the production side being exposed to an electrolyte solution
03/25/2004US20040055890 ProvideS a film having a highly uniform thickness by plating; electric current limiting member limits horizontal flow of an electric current in the plating liquid between second electrode and substrate within plating vessel during plating
03/25/2004US20040055889 Using ultraviolet light; joining semiconductor die to substrate; prevent short circuiting
03/25/2004US20040055880 Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
03/25/2004US20040055876 Cam driven paddle assembly for a plating cell
03/25/2004US20040055869 High voltage, alternating current; pulsed direct current; fluid flow of dielectric over electrode
03/25/2004US20040055709 Electrostatic chuck having a low level of particle generation and method of fabricating same
03/25/2004US20040055707 Substrate processing apparatus and substrate processing system
03/25/2004US20040055650 Wafer container
03/25/2004US20040055634 Cutting method and apparatus for ingot, wafer, and manufacturing method of solar cell
03/25/2004US20040055625 Supplying fluid through nozzle; forming air, fluid interface; vapor drying; for semiconductor
03/25/2004US20040055621 Separate sealed pressurized vessels; using critical fluid
03/25/2004US20040055540 Wafer stage for wafer processing apparatus
03/25/2004US20040055537 Transfer chamber for vacuum processing system
03/25/2004US20040055530 Micro electron gun of quantum size effect type and flat display using such electron guns as well as methods of their manufacture
03/25/2004US20040055509 Mixture containing nonionic surfactant and stabilizer; overcoating substrate with bismuth ferrite; heat treatment
03/25/2004US20040055397 Shared sensors for detecting substrate position/presence
03/25/2004US20040055389 Electrical cable moisture barrier with strain relief bridge
03/25/2004US20040055336 Optical apparatus
03/25/2004US20040055155 System for providing an open-cavity low profile encapsulated semiconductor package
03/25/2004US20040055141 Method for assembling a scrubber
03/25/2004DE19857094B4 Verfahren zum Verringern/zum lokalen Verringern eines Resistmusters in einer Hableitervorrichtung A method for reducing / to local decrease a resist pattern in a Hableitervorrichtung
03/25/2004DE19818452B4 Elektronische Schaltung mit einer in Gießharz eingebetteten Leiterplatte und Verfahren zu ihrer Herstellung An electronic circuit comprising an embedded in cast resin printed circuit board and process for its preparation
03/25/2004DE19738409B4 Vorrichtung zur wellenlängen-dispersiven Analyse von Fluoreszenzstrahlung An apparatus for wavelength-dispersive analysis of fluorescence radiation
03/25/2004DE19716480B4 Verfahren zum Herstellen einer Vorrichtung mit einem Hohlraum zur Aufnahme eines Lichtwellenleiters A method of manufacturing a device having a cavity for receiving an optical fiber
03/25/2004DE19549563B4 Semiconductor chip electronic component with current input and output conductor
03/25/2004DE10342028A1 Manufacture of integrated circuit involves doping portion of semiconductor substrate with nitrogen and charge carrier dopant source and forming thin dielectric on the doped portion of the substrate
03/25/2004DE10333248A1 Optical lithography process for semiconductor chip fabrication, involves exposing photo-resist layer through trim mask to assist in exposing space between features that is defined by phase shifters of phase-shifting mask