| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/01/2004 | US20040060970 Under bump metallurgy for Lead-Tin bump over copper pad |
| 04/01/2004 | US20040060949 Photoresist applying device and applying method therefor |
| 04/01/2004 | US20040060920 Ceramic heater |
| 04/01/2004 | US20040060919 Semiconductor production device ceramic plate |
| 04/01/2004 | US20040060917 Advanced rapid thermal processing (RTP) using a linearly-moving heating assembly with an axisymmetric and radially-tunable thermal radiation profile |
| 04/01/2004 | US20040060915 Discharge electrode for a wire bonding apparatus |
| 04/01/2004 | US20040060910 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
| 04/01/2004 | US20040060906 Method for chemical-mechanical jet etching of semiconductor structures |
| 04/01/2004 | US20040060900 Apparatuses and methods for treating a silicon film |
| 04/01/2004 | US20040060899 Apparatuses and methods for treating a silicon film |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060814 Electrochemical mechanical planarization |
| 04/01/2004 | US20040060731 Patterned electrically conductive polymers |
| 04/01/2004 | US20040060724 Current-carrying electronic component and method of manufacturing same |
| 04/01/2004 | US20040060666 Electronic component component mounting equipment and component mounting method |
| 04/01/2004 | US20040060663 Offset measuring mechanism and offset measuring method in a bonding apparatus |
| 04/01/2004 | US20040060662 Inductively coupled plasma processing apparatus having internal linear antenna for large area processing |
| 04/01/2004 | US20040060660 Control of plasma density with broadband RF sensor |
| 04/01/2004 | US20040060659 Etching system and etching method |
| 04/01/2004 | US20040060658 Method and apparatus for an improved baffle plate in a plasma processing system |
| 04/01/2004 | US20040060657 Method and apparatus for an improved deposition shield in a plasma processing system |
| 04/01/2004 | US20040060656 Method and apparatus for an improved bellows shield in a plasma processing system |
| 04/01/2004 | US20040060645 Forming folded-stack packaged device using progressive folding tool |
| 04/01/2004 | US20040060617 Doping the liner with a passivating agent plasma (e.g., N2 or Cl2) to form a barrier prior to annealing to prevent diffusion of impurities such as silicon and fluorine |
| 04/01/2004 | US20040060592 Semiconductor device and its manufacturing method |
| 04/01/2004 | US20040060583 Composition for eliminating thermosetting resin |
| 04/01/2004 | US20040060582 Substrate processing apparatus |
| 04/01/2004 | US20040060581 Vertical proximity processor |
| 04/01/2004 | US20040060580 Meniscus, vacuum, IPA vapor, drying manifold |
| 04/01/2004 | US20040060579 Cleaning solution and method for cleaning ceramic parts using the same |
| 04/01/2004 | US20040060575 Drip manifold for uniform chemical delivery |
| 04/01/2004 | US20040060574 Substrate processing method and substrate processing apparatus |
| 04/01/2004 | US20040060573 Proximity head for drying a substrate; and a cleaning system for cleaning wafers |
| 04/01/2004 | US20040060519 Quartz to quartz seal using expanded PTFE gasket material |
| 04/01/2004 | US20040060518 Apparatus for inverted multi-wafer MOCVD fabrication |
| 04/01/2004 | US20040060516 Method and apparatus for an improved optical window deposition shield in a plasma processing system |
| 04/01/2004 | US20040060515 Semiconductor manufacturing apparatus and manufacturing method of thin film semiconductor device |
| 04/01/2004 | US20040060514 Gas distribution showerhead |
| 04/01/2004 | US20040060513 Processing method and processing apparatus |
| 04/01/2004 | US20040060506 Excimer laser crystallization of amorphous silicon film |
| 04/01/2004 | US20040060505 Substrate processing apparatus and substrate processing method |
| 04/01/2004 | US20040060504 Semiconductor thin film and process for production thereof |
| 04/01/2004 | US20040060502 Slurry for chemical mechanical polishing comprising bulk solution, plurality of particles and self-assembling adsorption additive of zwitterionic, anionic, nonionic, or cationic surfactant; semiconductors |
| 04/01/2004 | US20040060472 Selective polishing with slurries containing polyelectrolytes |
| 04/01/2004 | US20040060195 Methods and systems for processing a substrate using a dynamic Liquid meniscus |
| 04/01/2004 | US20040060190 Wafer spin drying apparatus with a plurality of supply nozzles and methods for using the same |
| 04/01/2004 | US20040060187 End effector alignment tool for substrate handling system |
| 04/01/2004 | US20040060186 Laser alignment tool |
| 04/01/2004 | US20040060174 Method for producing wiring substrate |
| 04/01/2004 | US20040060172 Electrostatic gripper and process for producing it |
| 04/01/2004 | US20040060164 High-performance substrate for magnetic isolator |
| 04/01/2004 | DE69530812T2 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 04/01/2004 | DE19714544B4 Verfahren zum Anbringen eines Trockenelektrolytkondensators auf einer Leiterplatine und Anordnung des Kondensators und der Platine A method for attaching a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the circuit board |
| 04/01/2004 | DE10343217A1 Chipbinder Chip Binder |
| 04/01/2004 | DE10332855A1 Verfahren zum Bilden einer Mikrostruktur auf einem Substrat unter Verwendung einer Resiststruktur, und Restistoberflächenbehandlungsmittel A method of forming a microstructure on a substrate using a resist pattern, and Restistoberflächenbehandlungsmittel |
| 04/01/2004 | DE10328347A1 Substratlade- und Substratentladevorrichtung Substrate loading and Substratentladevorrichtung |
| 04/01/2004 | DE10327928A1 Halbleiterbauelement mit reduzierter Gateüberlappungskapazitanz und Verfahren zur Herstellung des Halbleiterbauelements A semiconductor device with reduced Gateüberlappungskapazitanz and method of manufacturing the semiconductor device |
| 04/01/2004 | DE10260688A1 Verfahren zum Erzeugen einer flachen Isolierungskerbe A process for producing a flat insulation notch |
| 04/01/2004 | DE10255846A1 Production of a trench capacitor for a semiconductor memory cell comprises providing a trench in a substrate, providing a capacitor dielectric and an electrically conducting filling in trench regions, and further processing |
| 04/01/2004 | DE10244862A1 Verfahren zur Herstellung eines elektronischen Bauelements mit einer Praseodymoxid-Schicht A process for producing an electronic component with a praseodymium oxide layer |
| 04/01/2004 | DE10243981A1 Elektronische Baueinheit, insbesondere Regler für Generatoren in Kraftfahrzeugen The electronic package, in particular regulator for generators in motor vehicles |
| 04/01/2004 | DE10243757A1 Semiconductor chip manufacturing method, e.g. for LED manufacture, by matching thermal expansion coefficient to carrier to radiation profile and pulse length of laser beam used to separate from substrate |
| 04/01/2004 | DE10243406A1 Plasmaquelle Plasma source |
| 04/01/2004 | DE10243380A1 Verfahren zur Herstellung einer integrierten Halbleiterschaltung A process for producing a semiconductor integrated circuit |
| 04/01/2004 | DE10242629A1 Production of a semiconductor structure used in electronic devices comprises preparing a semiconductor structure having a trench, filling the trench with a filling, planarizing the filling, and sinking the filling in the trench |
| 04/01/2004 | DE10242402A1 Vorrichtung und Verfahren für das Verbinden von Objekten Device and method for connecting objects |
| 04/01/2004 | DE10241397A1 Halbleiterelement mit T-förmiger Gate-Struktur mit Seitenwandabstandselementen, die in-situ hergestellt sind, und ein Verfahren zur Herstellung des Halbleiterelements Semiconductor element having a T-shaped gate structure with sidewall spacers, which are prepared in-situ, and a method for manufacturing the semiconductor element |
| 04/01/2004 | DE10241396A1 Halbleiterelement mit T-förmiger Gate-Struktur und ein Verfahren zur Herstellung des Halbleiterelements Semiconductor element having a T-shaped gate structure and a method for manufacturing the semiconductor element |
| 04/01/2004 | DE10241390B3 Process for structuring a flat substrate made from glassy material for electrically contacting microelectronic or micromechanical components comprises preparing a semiconductor flat substrate, reducing its thickness, and further processing |
| 04/01/2004 | DE10236896A1 Vorrichtung und Verfahren zum thermischen Behandeln von Halbleiterwafern Device and method for the thermal treatment of semiconductor wafers |
| 04/01/2004 | DE10234952B3 Production of a semiconductor structure used as a trench capacitor comprises preparing a semiconductor substrate, and forming a trench in the substrate |
| 04/01/2004 | DE10223203B4 Elektronisches Bauelement-Modul und Verfahren zu dessen Herstellung The electronic component module and method for its production |
| 04/01/2004 | CA2499208A1 Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| 03/31/2004 | EP1403984A2 Laser light source device and surface inspection apparatus employing the same |
| 03/31/2004 | EP1403932A1 Nitride semiconductor device |
| 03/31/2004 | EP1403931A2 Method for growing a silicon film, method for manufacturing a solar cell, semiconductor substrate, and solar cell |
| 03/31/2004 | EP1403930A2 Semiconductor device and method of manufacturing the same |
| 03/31/2004 | EP1403929A1 Semiconductor layer and forming method therefor, and semiconductor device and production method therefor |
| 03/31/2004 | EP1403928A2 Nanometer-scale semiconductor devices and method of making |
| 03/31/2004 | EP1403927A1 High voltage transistor integrated with non-volatile memory cells |
| 03/31/2004 | EP1403925A2 Dielectric material for electronic devices |
| 03/31/2004 | EP1403924A2 Fuse arrangement and semiconductor memory device |
| 03/31/2004 | EP1403921A2 Electronic device with stacked semiconductor chips and associated manufacturing process |
| 03/31/2004 | EP1403919A2 Magnetic memory device and method of manufacturing the same |
| 03/31/2004 | EP1403918A1 A semiconductor device, its preparation |
| 03/31/2004 | EP1403917A1 Process for manufacturing semiconductor wafers incorporating differentiated isolating structures |
| 03/31/2004 | EP1403916A2 Production process for producing semiconductor devices, semiconductor devices produced thereby, and test system for carrying out yield-rate test in production of such semiconductor devices |
| 03/31/2004 | EP1403915A2 Method for fabricating a MOS transistor |
| 03/31/2004 | EP1403914A2 Method of making a semiconductor device having trenches |
| 03/31/2004 | EP1403913A1 Substrate treating device and substrate treating method, substrate flattening method |
| 03/31/2004 | EP1403912A1 Method of producing iii nitride compound semiconductor |
| 03/31/2004 | EP1403911A2 Thin film device and its fabrication method |
| 03/31/2004 | EP1403910A2 Semiconductor device having a nitride-based hetero-structure and method of manufacturing the same |
| 03/31/2004 | EP1403909A1 Process for manufactoring integrated resistive elements with silicidation protection |
| 03/31/2004 | EP1403908A2 Oled lamp |
| 03/31/2004 | EP1403907A1 Regeneration process of etching solution, etching process, and etching system |
| 03/31/2004 | EP1403898A2 Electron beam source, electron-optical apparatus comprising an electron beam source and method of operating an electron beam source |
| 03/31/2004 | EP1403878A2 Flash eprom intergrated circuit architecture |
| 03/31/2004 | EP1403876A1 Ferroelectric memory with wide operating voltage and multi-bit storage per cell |
| 03/31/2004 | EP1403875A2 Magnetoresistive element and magnetic memory allowing high density |