| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/25/2004 | DE10332590A1 Zeilendecodierer in einem Flashspeicher sowie Löschverfahren für eine Flashspeiicherzelle in diesem Row decoder in a flash memory and an erasing method for Flashspeiicherzelle in this |
| 03/25/2004 | DE10314534A1 Manufacture of metal film for semiconductor device, comprises treating metal film with nitrogen plasma to form insulation film containing nitrogen |
| 03/25/2004 | DE10309261A1 Kondensator, gebildet in einer Mehrlagen-Verdrahtungsstruktur eines Halbleiterbauelements Capacitor formed in a multilayer wiring structure of a semiconductor device |
| 03/25/2004 | DE10300523A1 Forming bottle-shaped trench for capacitor of dynamic random access memory involves forming pad layer and hard mask layer on semiconductor substrate, forming trench, and etching trench unmasked by spacer |
| 03/25/2004 | DE10261457B3 Integrated circuit with transistor array of vertical FET selection transistors has array diagnosis test structure with two offset word, bit line combs alternately connecting different word, bit lines |
| 03/25/2004 | DE10253161A1 Production of an optoelectronic semiconductor chip has a layer based on gallium nitride applied on the upper side of the semiconductor body or semiconductor arrangement |
| 03/25/2004 | DE10246283B3 Production of an electronic component used in semiconductor sensors comprises preparing a semiconductor chip on a switching substrate, applying a sacrificial part on the sensor region of the chip and further processing |
| 03/25/2004 | DE10242877A1 Semiconductor substrate used in the production of a DRAM memory cell has a dielectric layer formed on the surface of recesses and carrier substrate, and an electrically conducting layer formed in the recesses to produce capacitor electrodes |
| 03/25/2004 | DE10241990A1 Process for structuring a layer on the surface of a semiconductor component used in the production of NROM semiconductor memories comprises making the surface uneven before the layer to be structured is applied |
| 03/25/2004 | DE10241589A1 Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing |
| 03/25/2004 | DE10240916A1 Production of a memory cell field used in charge trapping memory cells, e.g. NROM memory cells comprises forming insulating trenches between trenches whilst a hard mask is applied on or above the upper side of the semiconductor body |
| 03/25/2004 | DE10240598A1 Catadioptric reflective/reduction lens for mapping an image pattern transfers a picture of the pattern in an object plane into an image plane |
| 03/25/2004 | DE10240408A1 Transistorelement mit einem Anisotropen Gate-Dielektrikum MI großem ε Transistor element with an anisotropic gate dielectric MI large ε |
| 03/25/2004 | DE10239312A1 Production of a semiconductor component e.g. IGBT with a drift and a field stop layer comprises preparing a semiconductor layer having a base doping and an exposed front side, and introducing doping atoms into a drift zone region |
| 03/25/2004 | DE10063469B4 Verfahren zur Herstellung eines elektronischen Chips und mit dem Verfahren hergestellter elektronischer Chip A process for producing an electronic chip and produced by the method of electronic chip |
| 03/25/2004 | CA2498669A1 Method for selectively covering a micro machined surface |
| 03/25/2004 | CA2495530A1 Nitrogen passivation of interface states in sio2/sic structures |
| 03/25/2004 | CA2441877A1 Semiconductor device having a nitride-based hetero-structure and method of manufacturing the same |
| 03/24/2004 | EP1401250A1 Electrodes with a mesh structure |
| 03/24/2004 | EP1401249A2 Plasma source |
| 03/24/2004 | EP1401247A2 Method and apparatus for offset voltage control in bipolar ionization systems |
| 03/24/2004 | EP1401102A2 Programmable semiconductor device including universal logic modules comprising multiplexers |
| 03/24/2004 | EP1401024A2 Semiconductor device and method for fabricating the same |
| 03/24/2004 | EP1401023A2 Manufacturing methods of semiconductor device and solid state image pickup device |
| 03/24/2004 | EP1401022A1 Method of manufacturing laminated wafer |
| 03/24/2004 | EP1401021A1 Power semiconductor device |
| 03/24/2004 | EP1401019A2 Electronic device, especially regulator for generators in engine driven vehicles |
| 03/24/2004 | EP1401016A2 Self aligned vias in dual damascene interconnect, buried mask approach |
| 03/24/2004 | EP1401015A1 Selective dry etching of tantalum and tantalum nitride |
| 03/24/2004 | EP1401014A1 Plasma processing device, and method of cleaning the same |
| 03/24/2004 | EP1401012A2 Method of forming organic spacers and using them to form semiconductor device features |
| 03/24/2004 | EP1401011A2 Board-conveying robot |
| 03/24/2004 | EP1401010A1 Device and method for measuring and compensating for the wear of brushes in brushing machines |
| 03/24/2004 | EP1401008A1 Element for coupling electrical energy into a processing chamber and processing system comprising such an element |
| 03/24/2004 | EP1400860A2 Lithographic marker structure, lithographic projection apparatus comprising such a lithographic marker structure and method for substrate alignment using such a lithographic marker structure |
| 03/24/2004 | EP1400858A1 Photoresist stripper composition |
| 03/24/2004 | EP1400850A1 Method of forming thick resist pattern |
| 03/24/2004 | EP1400848A1 Circuitry with embossed portions |
| 03/24/2004 | EP1400832A1 Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device |
| 03/24/2004 | EP1400804A1 Method and device for measuring thermoelectric characteristics of combinatorial specimen |
| 03/24/2004 | EP1400760A1 Substrate treating system and substrate treating method |
| 03/24/2004 | EP1400614A2 Process and apparatus for liquid phase epitaxy |
| 03/24/2004 | EP1400613A2 Tin plating method |
| 03/24/2004 | EP1400488A2 Fabrication of MEMS devices with spin-on glass |
| 03/24/2004 | EP1400159A1 Device for assembling components on a substrate |
| 03/24/2004 | EP1399974A1 Mosfets with strained semiconductor layers |
| 03/24/2004 | EP1399973A2 Transistor-arrangement, method for operating a transistor-arrangement as a data storage element and method for producing a transistor-arrangement |
| 03/24/2004 | EP1399972A2 Memory cell, memory cell configuration and method for producing the same |
| 03/24/2004 | EP1399971A2 Trench capacitor and corresponding method of production |
| 03/24/2004 | EP1399970A2 Cmos inverter circuits utilizing strained silicon surface channel mosfets |
| 03/24/2004 | EP1399968A2 Thyristor configuration and surge suppressor comprising a thyristor configuration of this type |
| 03/24/2004 | EP1399966A2 Power pads for application of high current per bond pad in silicon technology |
| 03/24/2004 | EP1399965A1 Isolation of sonos devices |
| 03/24/2004 | EP1399964A2 Ceramic electrostatic chuck and method of fabricating same |
| 03/24/2004 | EP1399963A2 High temperature electrostatic chuck |
| 03/24/2004 | EP1399962A1 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 03/24/2004 | EP1399961A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 03/24/2004 | EP1399960A1 In situ sensor based control of semiconductor processing procedure |
| 03/24/2004 | EP1399959A2 System and method for active control of spacer deposition |
| 03/24/2004 | EP1399958A1 Process for forming fusible links |
| 03/24/2004 | EP1399957A2 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 03/24/2004 | EP1399956A2 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| 03/24/2004 | EP1399955A1 Method for preparing low dielectric films |
| 03/24/2004 | EP1399953A1 Opto-electronic device integration |
| 03/24/2004 | EP1399952A1 Opto-electronic device integration |
| 03/24/2004 | EP1399951A2 Interchangeable microdeposition head apparatus and method |
| 03/24/2004 | EP1399950A2 Formation of printed circuit board structures using piezo microdeposition |
| 03/24/2004 | EP1399949A2 Device for wet cleaning disc-shaped substrates |
| 03/24/2004 | EP1399944A1 Apparatus and method for radio frequency de-coupling and bias voltage control in a plasma reactor |
| 03/24/2004 | EP1399924A2 Method and apparatus for boosting bitlines for low vcc read |
| 03/24/2004 | EP1399781A1 Repair of amplitude defects in a multilayer coating |
| 03/24/2004 | EP1399766A2 Optical element and manufacturing method therefor |
| 03/24/2004 | EP1399600A1 Compositions, methods and devices for high temperature lead-free solder |
| 03/24/2004 | EP1399517A2 Chemical mechanical polishing compositions and methods relating thereto |
| 03/24/2004 | EP1399306A1 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| 03/24/2004 | EP1399295A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 03/24/2004 | EP1399294A1 End point detection system for chemical mechanical polishing applications |
| 03/24/2004 | EP1399269A1 Waveform generator for microdeposition control system |
| 03/24/2004 | EP1399268A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 03/24/2004 | EP1399267A1 Microdeposition apparatus |
| 03/24/2004 | EP1274808B1 Die-attaching paste and semiconductor device |
| 03/24/2004 | EP1244534B1 Energy-efficient, laser-based method and system for processing target material |
| 03/24/2004 | EP1218807B1 Real-time fault detection |
| 03/24/2004 | EP1186054B9 Current controlled field effect transistor |
| 03/24/2004 | EP1154868A4 Non-corrosive cleaning composition and method for removing plasma etching residues |
| 03/24/2004 | EP1141775B1 Multilayer attenuating phase-shift masks |
| 03/24/2004 | EP1125003B1 Excess cvd reactant control |
| 03/24/2004 | EP0966553B1 Process for low temperature cvd using bi-amides |
| 03/24/2004 | EP0894339B1 Silicon carbide cmos and method of fabrication |
| 03/24/2004 | EP0879547B1 Model-based predictive control of thermal processing |
| 03/24/2004 | EP0852067B1 Low rc interconnection |
| 03/24/2004 | EP0843955B1 Method of forming raised metallic contacts on electrical circuits |
| 03/24/2004 | CN2607664Y Pressing point mechanism for frame-type clamp |
| 03/24/2004 | CN1484865A System and method for electrically induced breakdown of nanostructures |
| 03/24/2004 | CN1484862A Semiconductor device |
| 03/24/2004 | CN1484861A Non-volatile memory cells utilzing substrate trenches |
| 03/24/2004 | CN1484860A Semiconductor storage device and its manufacturing method |
| 03/24/2004 | CN1484859A Method for mfg of integated semiconductor memory arrangement |
| 03/24/2004 | CN1484858A Ferroelectric memory device and method of manufacturing the same |
| 03/24/2004 | CN1484857A Cu-pad/bonded/cu-wire with self-passivating cu-alloys |