Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/01/2004WO2004027820A2 Self-aligned npn transistor with raised extrinsic base
04/01/2004WO2004027816A2 A method and apparatus for the compensation of edge ring wear in a plasma processing chamber
04/01/2004WO2004027815A1 Plasma apparatus with device for reducing polymer deposition on a substrate and method for reducing polymer deposition
04/01/2004WO2004027810A2 System and method for removal of materials from an article
04/01/2004WO2004027782A1 Active well-bias transistor for programming a fuse
04/01/2004WO2004027778A1 Chain memory architecture
04/01/2004WO2004027740A1 Display device and manufacturing method thereof
04/01/2004WO2004027684A2 Photolithography mask repair
04/01/2004WO2004027518A2 A method for the removal of an imaging layer from a semiconductor substrate stack
04/01/2004WO2004027460A2 Replication and transfer of microstructures and nanostructures
04/01/2004WO2004027411A1 System and method for metal residue detection and mapping within a multi-step sequence
04/01/2004WO2004027367A1 Soi component comprising margins for separation
04/01/2004WO2004027126A1 Semiconductor crystal of group iii-v compound
04/01/2004WO2004027114A1 Electroless plating apparatus and electroless plating method
04/01/2004WO2004027111A1 Electrode, solid element and device using the same
04/01/2004WO2004027110A2 Additives to prevent degradation of alkyl-hydrogen siloxanes
04/01/2004WO2004026765A1 Method for modifying porous film, modified porous film and use of same
04/01/2004WO2004026757A2 Controlling electromechanical behavior of structures within a microelectromechanical systems device
04/01/2004WO2004026531A2 Device and method for connecting objects
04/01/2004WO2004026527A1 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device
04/01/2004WO2004026526A1 Bonding material and bonding method
04/01/2004WO2004026524A1 Method of photo-thermal induced diffusion and apparatus with electrically conductive trace
04/01/2004WO2004026096A2 Viewing window cleaning apparatus
04/01/2004WO2004021399A3 Dielectric storage memory cell (monos) having high permittivity top dielectric and method therefor
04/01/2004WO2004015157A3 Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission
04/01/2004WO2004012301A3 Method of curing an anisotropic conductive compound
04/01/2004WO2004012234A3 Superlattice nanopatterning of wires and complex patterns
04/01/2004WO2004008495A3 Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses
04/01/2004WO2004003991A3 Electronic component with a housing packaging
04/01/2004WO2004003962A3 Thermal sprayed yttria-containing coating for plasma reactor
04/01/2004WO2004001789A3 Multi directional mechanical scanning in an ion implanter
04/01/2004WO2003107093A3 Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds
04/01/2004WO2003105195A3 Method to perform deep implants without scattering to adjacent areas
04/01/2004WO2003105190A3 System and method for hydrogen-rich selective oxidation
04/01/2004WO2003104896A3 Photomask and method for repairing defects
04/01/2004WO2003103024A3 Method and apparatus for monitoring tool performance
04/01/2004WO2003102771A3 Specialization of active software agents in an automated manufacturing environment
04/01/2004WO2003098668A3 Pre-aligner
04/01/2004WO2003096407A8 Method for forming a nickel silicide layer on a silicon substrate
04/01/2004WO2003096389A3 Metal object to be at least partially coated with a substance
04/01/2004WO2003092041B1 Method for fabricating a soi substrate a high resistivity support substrate
04/01/2004WO2003092011A3 Semiconductor memory device and operating method for a semiconductor memory device
04/01/2004WO2003090276A3 Method for the production of contact pads on a substrate and device for carrying out said method
04/01/2004WO2003090260A3 Apparatus for depositing a multilayer coating on discrete sheets
04/01/2004WO2003089684A3 Method and device for depositing thin layers on a substrate in a height-adjustable process chamber
04/01/2004WO2003088334A3 Deposition of gate metallization and passivation layers for active matrix liquid crystal display (amlcd) applications
04/01/2004WO2003088328A3 Method for production of a capacitive structure above a metallisation level of an electronic component
04/01/2004WO2003088322A3 Semiconductor device
04/01/2004WO2003087935A3 Nanoimprint resist
04/01/2004WO2003087590A3 Method of self-assembly and self-assembled structures
04/01/2004WO2003081664A3 Method for transferring elements between substrates
04/01/2004WO2003079412A9 Facilities connection bucket for pre-facilitation of wafer fabrication equipment
04/01/2004WO2003075326A3 A semiconductor device having different metal-semiconductor portions formed in a semiconductor region and a method for fabricating the semiconductor device
04/01/2004WO2003072669A9 Polishing composition
04/01/2004WO2003069015A3 Aperture masks for circuit fabrication
04/01/2004WO2003041131A3 Single wafer dryer and drying methods
04/01/2004WO2003034490A3 Semiconductor structure with one or more through-holes
04/01/2004WO2003028949A3 Method of machining substrates
04/01/2004WO2002091809A8 Method and device for generating an activated gas curtain for surface treatment
04/01/2004WO2002074473A3 Method of producing tantalum and niobium alkoxides
04/01/2004WO2002061836A9 High voltage semiconductor device
04/01/2004WO1998028794A8 Direct contact die attach
04/01/2004US20040064465 Expert knowledge methods and systems for data analysis
04/01/2004US20040064277 Manufacturing apparatus and method for predicting life of a manufacturing apparatus which uses a rotary machine
04/01/2004US20040064269 Method and apparatus for analyzing defect data and a review system
04/01/2004US20040064214 Process control at an interconnect level
04/01/2004US20040063915 Comprises protein polymers coated with metal for preparation of tubulin-based cytoskeltal fibers
04/01/2004US20040063895 Poly-o-hydroxyamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic components
04/01/2004US20040063883 Process for producing an organic polymer film whereby when using it as an interlayer insulating film in a semiconductor device, the film exhibits higher adhesiveness at its interface where other semiconductor materials are in contact with the
04/01/2004US20040063827 Positive resist composition and pattern formation method using the same
04/01/2004US20040063595 For removing a photoresist pattern from an underlying layer; for manufacturing a semiconductor device
04/01/2004US20040063385 Method of controlling carrier head with multiple chambers
04/01/2004US20040063374 Method of manufacturing flat panel display device
04/01/2004US20040063337 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
04/01/2004US20040063336 First nonwoven layer has a Fiber Orientation Ratio within +-20 degrees from a primary fiber direction of at least about 65%; exhibits elasticity without mechanical stretching; disposable diapers
04/01/2004US20040063335 Haze-free BST films
04/01/2004US20040063334 Method for forming a mask pattern
04/01/2004US20040063332 COF semiconductor device and a manufacturing method for the same
04/01/2004US20040063331 Etching method
04/01/2004US20040063330 FIB/RIE method for in-line circuit modification of microelectronic chips containing organic dielectric
04/01/2004US20040063329 Multi-step local dry etching method for SOI wafer
04/01/2004US20040063328 Method of etching shaped features on a substrate
04/01/2004US20040063327 Method of dry-etching semiconductor devices
04/01/2004US20040063324 Method of forming dummy wafer
04/01/2004US20040063323 Method of manufacturing a semiconductor apparatus with a tapered aperture pattern to form a predetermined line width
04/01/2004US20040063322 Wafer-level transfer of membranes with gas-phase etching and wet etching methods
04/01/2004US20040063321 Method for fabricating a semiconductor configuration
04/01/2004US20040063319 Substrate processing apparatus and substrate processing method
04/01/2004US20040063318 Method of selectively removing metal residues from a dielectric layer by chemical mechanical polishing
04/01/2004US20040063317 Etch-back method for dielectric layer
04/01/2004US20040063316 Method for reducing wafer arcing
04/01/2004US20040063315 Method of dry etching a semiconductor device in the absence of a plasma
04/01/2004US20040063314 Method of forming a conductive contact
04/01/2004US20040063313 Semiconductor device manufacturing method
04/01/2004US20040063312 Method and apparatus for active temperature control of susceptors
04/01/2004US20040063311 Structure of thin film transistor and manufacturing method thereof
04/01/2004US20040063310 Interconnects with improved barrier layer adhesion
04/01/2004US20040063309 Selectively-etched nanochannel electrophoretic and electrochemical devices
04/01/2004US20040063308 Method for forming openings in low-k dielectric layers
04/01/2004US20040063307 Method to avoid copper contamination of a via or dual damascene structure