Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/06/2004US6716770 Vapor deposition using organosilicon compound and fluorohydrocarbon plasma; dielectric
04/06/2004US6716769 Use of a plasma source to form a layer during the formation of a semiconductor device
04/06/2004US6716768 Method of manufacturing thin-film transistor, and liquid-crystal display
04/06/2004US6716767 Contact planarization materials that generate no volatile byproducts or residue during curing
04/06/2004US6716766 Process variation resistant self aligned contact etch
04/06/2004US6716765 Plasma clean for a semiconductor thin film deposition chamber
04/06/2004US6716764 Method of forming first level of metallization in DRAM chips
04/06/2004US6716763 Method of controlling striations and CD loss in contact oxide etch
04/06/2004US6716761 Method of forming fine patterns
04/06/2004US6716760 Method for forming a gate of a high integration semiconductor device including forming an etching prevention or etch stop layer and anti-reflection layer
04/06/2004US6716759 Etch of silicon nitride selective to silicon and silicon dioxide useful during the formation of a semiconductor device
04/06/2004US6716758 Aspect ratio controlled etch selectivity using time modulated DC bias voltage
04/06/2004US6716757 Method for forming bottle trenches
04/06/2004US6716756 Method for forming capacitor of semiconductor device
04/06/2004US6716755 Composition and method for planarizing surfaces
04/06/2004US6716754 Methods of forming patterns and molds for semiconductor constructions
04/06/2004US6716753 Method for forming a self-passivated copper interconnect structure
04/06/2004US6716752 Method of forming silicon oxide layer and method of manufacturing thin film transistor thereby
04/06/2004US6716751 Dopant precursors and processes
04/06/2004US6716749 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
04/06/2004US6716747 Method of manufacturing a semiconductor apparatus with a tapered aperture pattern to form a predetermined line width
04/06/2004US6716746 Semiconductor device having self-aligned contact and method of fabricating the same
04/06/2004US6716745 Silicide pattern structures and methods of fabricating the same
04/06/2004US6716744 Ultra thin tungsten metal films used as adhesion promoter between barrier metals and copper
04/06/2004US6716743 Method of manufacturing a semiconductor device
04/06/2004US6716742 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
04/06/2004US6716741 Method of patterning dielectric layer with low dielectric constant
04/06/2004US6716740 Method for depositing silicon oxide incorporating an outgassing step
04/06/2004US6716739 Bump manufacturing method
04/06/2004US6716738 Method of fabricating multilayered UBM for flip chip interconnections by electroplating
04/06/2004US6716737 Method of forming a through-substrate interconnect
04/06/2004US6716736 Method for manufacturing an under-bump metallurgy layer
04/06/2004US6716735 Method for forming metal lines of semiconductor device
04/06/2004US6716734 Low temperature sidewall oxidation of W/WN/poly-gatestack
04/06/2004US6716733 CVD-PVD deposition process
04/06/2004US6716732 Method for fabricating a contact pad of semiconductor device
04/06/2004US6716731 Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate
04/06/2004US6716730 Pattern formation method
04/06/2004US6716727 Methods and apparatus for plasma doping and ion implantation in an integrated processing system
04/06/2004US6716726 Thin film semiconductor device containing polycrystalline Si—Ge alloy and method for producing thereof
04/06/2004US6716725 Plasma processing method and semiconductor device
04/06/2004US6716724 Method of producing 3-5 group compound semiconductor and semiconductor element
04/06/2004US6716723 Wafer cutting using laser marking
04/06/2004US6716722 Method of producing a bonded wafer and the bonded wafer
04/06/2004US6716721 Method for manufacturing a silicon wafer
04/06/2004US6716720 Method for filling depressions on a semiconductor wafer
04/06/2004US6716719 Method of forming biasable isolation regions using epitaxially grown silicon between the isolation regions
04/06/2004US6716718 Method of producing a semiconductor device
04/06/2004US6716717 Method for fabricating capacitor of semiconductor device
04/06/2004US6716716 Even nucleation between silicon and oxide surfaces for thin silicon nitride film growth
04/06/2004US6716715 Dram bit lines
04/06/2004US6716714 Semiconductor diode and method for producing the same
04/06/2004US6716713 Dopant precursors and ion implantation processes
04/06/2004US6716712 Process for producing two differently doped adjacent regions in an integrated semiconductor
04/06/2004US6716711 Method for fabricating a self-aligned emitter in a bipolar transistor
04/06/2004US6716710 Using a first liner layer as a spacer in a semiconductor device
04/06/2004US6716709 Transistors formed with grid or island implantation masks to form reduced diffusion-depth regions without additional masks and process steps
04/06/2004US6716708 Self-aligned silicide process utilizing ion implants for reduced silicon consumption and control of the silicide formation temperature and structure formed thereby
04/06/2004US6716707 Method for making a semiconductor device having a high-k gate dielectric
04/06/2004US6716706 Method and system for forming a long channel device
04/06/2004US6716705 EEPROM device having a retrograde program junction region and process for fabricating the device
04/06/2004US6716704 Methods of fabricating read only memory devices including thermally oxidized transistor sidewalls
04/06/2004US6716703 Method of making semiconductor memory device having sources connected to source lines
04/06/2004US6716702 Method of forming flash memory having pre-interpoly dielectric treatment layer
04/06/2004US6716701 Method of manufacturing a semiconductor memory device
04/06/2004US6716699 Method for manufacturing flash memory device
04/06/2004US6716698 Virtual ground silicide bit line process for floating gate flash memory
04/06/2004US6716697 Method of manufacturing semiconductor device having capacitor
04/06/2004US6716696 Method of forming a bottle-shaped trench in a semiconductor substrate
04/06/2004US6716695 Semiconductor with a nitrided silicon gate oxide and method
04/06/2004US6716694 Semiconductor devices and methods for manufacturing semiconductor devices
04/06/2004US6716693 Method of forming a surface coating layer within an opening within a body by atomic layer deposition
04/06/2004US6716692 Fabrication process and structure of laminated capacitor
04/06/2004US6716691 Self-aligned shallow trench isolation process having improved polysilicon gate thickness control
04/06/2004US6716690 Uniformly doped source/drain junction in a double-gate MOSFET
04/06/2004US6716689 MOS transistor having a T-shaped gate electrode and method for fabricating the same
04/06/2004US6716688 Irradiation of manufacturing a thin film transistor by laser irradiation
04/06/2004US6716687 FET having epitaxial silicon growth
04/06/2004US6716686 Method for forming channels in a finfet device
04/06/2004US6716685 Methods for forming dual gate oxides
04/06/2004US6716684 Method of making a self-aligned triple gate silicon-on-insulator device
04/06/2004US6716682 SOI CMOS device with reduced DIBL
04/06/2004US6716681 Method for manufacturing thin film transistor panel
04/06/2004US6716680 Process for manufacturing reflective TFT-LCD with rough diffuser
04/06/2004US6716679 Methods of forming fuse box guard rings for integrated circuit devices
04/06/2004US6716678 Method for producing an antifuse and antifuse for the selective electrical connection of adjacent conductive regions
04/06/2004US6716677 Microwave monolithic integrated circuit package
04/06/2004US6716675 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
04/06/2004US6716674 Method of forming a semiconductor package
04/06/2004US6716672 Three dimensional interconnection method and electronic device obtained by same
04/06/2004US6716671 Methods of making microelectronic assemblies using compressed resilient layer
04/06/2004US6716670 Method of forming a three-dimensional stacked semiconductor package device
04/06/2004US6716669 High-density interconnection of temperature sensitive electronic devices
04/06/2004US6716668 Method for forming semiconductor device
04/06/2004US6716667 Semiconductor device manufacturing method, making negative pressure for fixing a chip on a substrate
04/06/2004US6716666 Wafer scale molding of protective caps
04/06/2004US6716665 Method of mounting chip onto printed circuit board in shortened working time
04/06/2004US6716664 Functional device and method of manufacturing the same
04/06/2004US6716663 Method for removing foreign matter, method for forming film, semiconductor device and film forming apparatus
04/06/2004US6716660 Method for fabricating a wiring line assembly for a thin film transistor array panel substrate