| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/25/2004 | US20040058471 Fabrication method for ball grid array semiconductor package |
| 03/25/2004 | US20040058470 Methods of forming a contact array in situ on a substrate and resulting substrate assemblies |
| 03/25/2004 | US20040058466 Aspherical microstructure, and method of fabricating the same |
| 03/25/2004 | US20040058465 Method for producing p-type Group III nitride compound semiconductor |
| 03/25/2004 | US20040058464 Method and device for treating semiconductor substrates |
| 03/25/2004 | US20040058462 Method for manufacturing an electron source substrate |
| 03/25/2004 | US20040058459 Method of optimizing seasoning recipe for etch process |
| 03/25/2004 | US20040058359 Erbin as a negative regulator of Ras-Raf-Erk signaling |
| 03/25/2004 | US20040058293 Assembly line processing system |
| 03/25/2004 | US20040058280 Forming a first insulation film including a conductive pattern on a semiconductor substrate; forming etch stop film and insulation film on insulation film; forming a via hole; forming a filling film; forming photoresist film; patterning |
| 03/25/2004 | US20040058279 For use in electron beam lithography |
| 03/25/2004 | US20040058278 Anti-reflective coating conformality control |
| 03/25/2004 | US20040058277 Mechanically robust interconnect for low-k dielectric material using post treatment |
| 03/25/2004 | US20040058272 Resist composition |
| 03/25/2004 | US20040058271 Pattern formation material, water-soluble material and pattern formation method |
| 03/25/2004 | US20040058270 Sensitivity and resolution |
| 03/25/2004 | US20040058269 Resolution |
| 03/25/2004 | US20040058256 Illuminating a mask with illumination light, which is disposed in projection exposure apparatus and in which a dose monitor pattern is formed, passing only a 0th-order diffracted light through a pupil surface of projection exposure apparatus |
| 03/25/2004 | US20040058255 Substrate topography compensation at mask design: 3D OPC topography anchored |
| 03/25/2004 | US20040058254 Phase shift mask blank, photo mask blank, and manufacturing apparatus and method of blanks |
| 03/25/2004 | US20040058253 For use in fabricating semiconductor devices |
| 03/25/2004 | US20040058199 Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus |
| 03/25/2004 | US20040058192 Can be applied to a wiring structure, a circuit |
| 03/25/2004 | US20040058155 Corrosion and erosion resistant thin film diamond coating and applications therefor |
| 03/25/2004 | US20040058144 Curable decorating ceramic substrates glass bottles |
| 03/25/2004 | US20040058139 Seed layer treatment |
| 03/25/2004 | US20040058090 Depositing a coating on a substrate with a solution comprising a resin molecule containing Si-H groups, Si-CH3 groups, exposing coating to ultraviolet radiation at a power to cause hydrolysis; evaporating solvent to form a porous network |
| 03/25/2004 | US20040058079 Method for forming porous silica film |
| 03/25/2004 | US20040058076 Forming a barrier layer on the substrate; forming a porous material layer on the barrier layer, forming an amorphous silicon layer on the porous material layer; performing a laser annealing to form a polysilicon layer |
| 03/25/2004 | US20040058070 Filling the holes of the internal member with padding plugs each of which has a core member made from a metal material and a metal- resin composite layer covering surface of core; forming a ceramic coating film; extracting the padding plugs |
| 03/25/2004 | US20040058067 For electroless plating |
| 03/25/2004 | US20040058066 Thin film of metal oxide and a method for preparing it |
| 03/25/2004 | US20040057719 Solid state image pick-up device and camera using the solid state image pick-up device |
| 03/25/2004 | US20040057611 Method for selecting reference images, method and apparatus for inspecting patterns on wafers, and method for dividing a wafer into application regions |
| 03/25/2004 | US20040057482 GaN structures having low dislocation density and methods of manufacture |
| 03/25/2004 | US20040057481 [nitride based semiconductor laser diode device with a bar mask] |
| 03/25/2004 | US20040057329 Semiconductor memory device |
| 03/25/2004 | US20040057328 Split gate flash memory cell |
| 03/25/2004 | US20040057327 Semiconductor memory device |
| 03/25/2004 | US20040057324 Semiconductor integrated circuit having controllable internal supply voltage |
| 03/25/2004 | US20040057311 Semiconductor integrated circuit |
| 03/25/2004 | US20040057303 Method and article for concentrating fields at sense |
| 03/25/2004 | US20040057301 Integrated circuit having electrical connecting elements |
| 03/25/2004 | US20040057300 Structure of power supply path utilized in design of integrated circuit |
| 03/25/2004 | US20040057295 Magnetic storage element, production method and driving method therefor, and memory array |
| 03/25/2004 | US20040057292 Test structure for measuring a junction resistance in a DRAM memory cell array |
| 03/25/2004 | US20040057288 Control method of non-volatile semiconductor memory cell and non-volatile semiconductor memory device |
| 03/25/2004 | US20040057286 Self-aligned split-gate NAND flash memory and fabrication process |
| 03/25/2004 | US20040057280 Current drive circuit avoiding effect of voltage drop caused by load and semiconductor memory device equipped therewith |
| 03/25/2004 | US20040057277 Magnetic random access memory |
| 03/25/2004 | US20040057266 Semiconductor memory device, electronic card and electronic device |
| 03/25/2004 | US20040057264 Multibit non-volatile memory and method |
| 03/25/2004 | US20040057222 Method of making a center bond flip chip semiconductor carrier |
| 03/25/2004 | US20040057215 Electronic component, in particular regulator for generators in motor vehicles |
| 03/25/2004 | US20040057193 Element Storage Layer in Integrated Circuits |
| 03/25/2004 | US20040057190 Method of offset voltage control for bipolar ionization systems |
| 03/25/2004 | US20040057173 Semiconductor integrated circuit device |
| 03/25/2004 | US20040057052 Measurement of lateral diffusion of diffused layers |
| 03/25/2004 | US20040057036 Exposure method |
| 03/25/2004 | US20040057035 Light energy detecting apparatus for exposure condition control in semiconductor manufacturing apparatus |
| 03/25/2004 | US20040057034 Exposure apparatus including micro mirror array and exposure method using the same |
| 03/25/2004 | US20040057033 Illumination system with spatially controllable partial coherence compensation for line width variances in a photolithographic system |
| 03/25/2004 | US20040057032 Exposure apparatus |
| 03/25/2004 | US20040057031 Exposure apparatus and method of manufacturing a semiconductor device using the same |
| 03/25/2004 | US20040057030 Reticle-holding pods and methods for holding thin, circular reticles, and reticle-handling systems utilizing same |
| 03/25/2004 | US20040057005 Liquid crystal display device |
| 03/25/2004 | US20040056915 Material arranging method, film-forming apparatus, electronic device and manufacturing method thereof, electro-optical device and manufacturing method thereof, and electronic apparatus |
| 03/25/2004 | US20040056855 Display device and manufacturing method thereof |
| 03/25/2004 | US20040056828 Organic light emitting display device and method of fabricating the same |
| 03/25/2004 | US20040056755 Integrated circuit devices including a resistor pattern |
| 03/25/2004 | US20040056729 Method of manufacturing mounting substrate and surface mount crystal oscillator |
| 03/25/2004 | US20040056725 Oscillation circuit and a communication semiconductor integrated circuit |
| 03/25/2004 | US20040056707 Efficient charge pump capable of high voltage operation |
| 03/25/2004 | US20040056703 Active well-bias transistor for programming a fuse |
| 03/25/2004 | US20040056688 Programmable semiconductor device including universal logic modules coping with as many user inverters |
| 03/25/2004 | US20040056674 Multi-point probe |
| 03/25/2004 | US20040056672 High resolution analytical probe station |
| 03/25/2004 | US20040056671 Electrical cable moisture barrier |
| 03/25/2004 | US20040056665 Power monitoring unit, control method therefor, and exposure apparatus |
| 03/25/2004 | US20040056578 Multibeam generating apparatus and electron beam drawing apparatus |
| 03/25/2004 | US20040056366 A method of forming surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement |
| 03/25/2004 | US20040056365 Flip-chip image sensor packages and methods of fabrication |
| 03/25/2004 | US20040056364 Improving the packaging of chips in a thinner package, a die is attached to a leadframe, back side of the die is exposed |
| 03/25/2004 | US20040056363 Semiconductor device and a method of manufacturing the same |
| 03/25/2004 | US20040056362 Semiconductor device |
| 03/25/2004 | US20040056361 Multi-layered copper bond pad for an integrated circuit |
| 03/25/2004 | US20040056359 Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same |
| 03/25/2004 | US20040056358 Interconnect structure |
| 03/25/2004 | US20040056357 Circuit device and method of manufacturing the same |
| 03/25/2004 | US20040056356 Methods and apparatus for forming a film on a substrate |
| 03/25/2004 | US20040056355 Semiconductor device |
| 03/25/2004 | US20040056354 Directing a controll energy to break atomic bonds in dielectric material, repairing the broken bonds with a reactive gas, to improve it's mechanical strength |
| 03/25/2004 | US20040056353 Semiconductor device having cell plugs |
| 03/25/2004 | US20040056352 Semiconductor package and method for producing heat-radiating substrate for it |
| 03/25/2004 | US20040056351 Contact pads and a plurality of bump electrodes, a conductive line for interconnecting at least two of the contact pads; photoresist, masking, etching |
| 03/25/2004 | US20040056350 Electrical connection through nonmetal |
| 03/25/2004 | US20040056345 Masking an electronic component substrate, applying a temporary mask material, forcing the filler through the hole in the temporary mask; printed circuit boards and integrated circuits |
| 03/25/2004 | US20040056344 Multi-chip circuit module and method for producing the same |
| 03/25/2004 | US20040056342 Stacked die module and techniques for forming a stacked die module |
| 03/25/2004 | US20040056337 Semiconductor device |