| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/29/2004 | US20040082194 Method for coating a thick spin-on-glass layer on a semiconductor structure |
| 04/29/2004 | US20040082193 Plasma enhanced cvd low k carbon-doped silicon oxide film deposition using vhf-rf power |
| 04/29/2004 | US20040082192 Method of securing a substrate in a semiconductor processing machine |
| 04/29/2004 | US20040082191 Wide bandgap semiconductor device construction |
| 04/29/2004 | US20040082190 Multimetal oxide materials |
| 04/29/2004 | US20040082186 Method for cleaning plasma etching apparatus, method for plasma etching, and method for manufacturing semiconductor device |
| 04/29/2004 | US20040082185 Method for plasma treatment |
| 04/29/2004 | US20040082184 Polysilicon etching method |
| 04/29/2004 | US20040082183 Pattern forming method and apparatus, and device fabrication method and device |
| 04/29/2004 | US20040082182 Method of making metallization and contact structures in an integrated circuit using a timed trench etch |
| 04/29/2004 | US20040082181 Methods of forming trench isolation regions |
| 04/29/2004 | US20040082180 Post-CMP treating liquid and method for manufacturing semiconductor device |
| 04/29/2004 | US20040082177 Method of forming isolation films in semiconductor devices |
| 04/29/2004 | US20040082176 Method of reworking structures incorporating low-k dielectric materials |
| 04/29/2004 | US20040082175 Process for high-dielectric constant metal-insulator metal capacitor in VLSI multi-level metallization systems |
| 04/29/2004 | US20040082174 Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad |
| 04/29/2004 | US20040082173 Micro pattern forming method and semiconductor device manufacturing method |
| 04/29/2004 | US20040082172 Method of manufacturing semiconductor device |
| 04/29/2004 | US20040082171 ALD apparatus and ALD method for manufacturing semiconductor device |
| 04/29/2004 | US20040082170 Method for forming fine pattern of semiconductor device |
| 04/29/2004 | US20040082169 Deposition of barrier metal in damascene interconnects using metal carbonyl |
| 04/29/2004 | US20040082168 Method for forming metal silicide layer in active area of semiconductor device |
| 04/29/2004 | US20040082167 Methods of forming aluminum structures in microelectronic articles and articles fabricated thereby |
| 04/29/2004 | US20040082166 Barrrier layer and a method for suppressing diffusion processes during the production of semiconductor devices |
| 04/29/2004 | US20040082165 Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate |
| 04/29/2004 | US20040082164 Chemistry for liner removal in a dual damascene process |
| 04/29/2004 | US20040082163 Film formation method as well as device manufactured by employing the same, and method of manufacturing device |
| 04/29/2004 | US20040082162 Method for fabricating semiconductor device capable of reducing seam generations |
| 04/29/2004 | US20040082161 Process of forming bonding columns |
| 04/29/2004 | US20040082160 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes |
| 04/29/2004 | US20040082159 Fabrication method for solder bump pattern of rear section wafer package |
| 04/29/2004 | US20040082158 Method of forming a self-aligned, selectively etched, double recess high electron mobility transistor |
| 04/29/2004 | US20040082157 Method for fabricating a gate mask of a semiconductor device |
| 04/29/2004 | US20040082156 Boron incorporated diffusion barrier material |
| 04/29/2004 | US20040082155 Method for forming word line of semiconductor device |
| 04/29/2004 | US20040082154 Method for fabricating image sensor using salicide process |
| 04/29/2004 | US20040082152 Process for fabricating a semiconductor diffraction grating using a sacrificial layer |
| 04/29/2004 | US20040082151 Fabrication of abrupt ultra-shallow junctions |
| 04/29/2004 | US20040082150 Single step pendeo-and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structures |
| 04/29/2004 | US20040082149 Thin-film semiconductor device and method of manufacturing the same |
| 04/29/2004 | US20040082148 Method of increasing the area of a useful layer of material transferred onto a support |
| 04/29/2004 | US20040082147 Layer transfer methods |
| 04/29/2004 | US20040082146 Separating apparatus, separating method, and method of manufacturing semiconductor substrate |
| 04/29/2004 | US20040082145 Method for joining a silicon plate to a second plate |
| 04/29/2004 | US20040082144 Method for forming device isolation film of semiconductor device |
| 04/29/2004 | US20040082143 Method and device for forming an STI type isolation in a semiconductor device |
| 04/29/2004 | US20040082142 Fabrication method for a semiconductor structure having a partly filled trench |
| 04/29/2004 | US20040082141 Method of fabricating a semiconductor device having trenches |
| 04/29/2004 | US20040082140 Deep trench isolation structure of a high-voltage device and method for forming thereof |
| 04/29/2004 | US20040082139 Method for manufacturing a semiconductor device and semiconductor device with overlay mark |
| 04/29/2004 | US20040082138 Method and preparing a mask for high energy particle bombardment |
| 04/29/2004 | US20040082137 Process for filling polysilicon seam |
| 04/29/2004 | US20040082136 Breakdown voltage adjustment for bipolar transistors |
| 04/29/2004 | US20040082135 Structure and method for forming self-aligned bipolar junction transistor with expitaxy base |
| 04/29/2004 | US20040082134 Method for using thin spacers and oxidation in gate oxides |
| 04/29/2004 | US20040082133 Eliminating substrate noise by an electrically isolated high-voltage I/O transistor |
| 04/29/2004 | US20040082132 Integration of semiconductor on implanted insulator |
| 04/29/2004 | US20040082131 Semiconductor device and production method thereof |
| 04/29/2004 | US20040082130 Method for manufacturing semiconductor device and semiconductor device |
| 04/29/2004 | US20040082129 Method of fabricating a semiconductor device including a tunnel oxide film |
| 04/29/2004 | US20040082128 Method for manufacturing a memory device |
| 04/29/2004 | US20040082127 Method and system for reducing short channel effects in a memory device by reduction of drain thermal cycling |
| 04/29/2004 | US20040082126 Semiconductor device incorporated therein high K capacitor dielectric and method for the manufacture thereof |
| 04/29/2004 | US20040082125 Novel dual gate dielectric scheme: SiON for high performance devices and high k for low power devices |
| 04/29/2004 | US20040082123 Semiconductor device and a method for forming patterns |
| 04/29/2004 | US20040082122 Method of fabricating a high-voltage transistor with a multi-layered extended drain structure |
| 04/29/2004 | US20040082119 Molded wafer scale cap array |
| 04/29/2004 | US20040082118 Semiconductor device with lightly doped drain and method of manufacturing the same |
| 04/29/2004 | US20040082117 Method for producing an integrated semiconductor memory configuration |
| 04/29/2004 | US20040082116 Vertical conducting power semiconductor devices implemented by deep etch |
| 04/29/2004 | US20040082115 Mold making method for wafer scale caps |
| 04/29/2004 | US20040082114 Fabrication method of window-type ball grid array semiconductor package |
| 04/29/2004 | US20040082111 Chip mounting method and apparatus therefor |
| 04/29/2004 | US20040082110 Molded wafer scale cap |
| 04/29/2004 | US20040082107 Flip-chip system and method of making same |
| 04/29/2004 | US20040082106 Method for manufacturing a wafer level chip scale package |
| 04/29/2004 | US20040082105 Wafer scale caps located by molding |
| 04/29/2004 | US20040082104 Chip with molded cap array |
| 04/29/2004 | US20040082101 Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin |
| 04/29/2004 | US20040082100 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 04/29/2004 | US20040082098 Substrate with semiconductor layer, electronic component, electronic circuit, printable composition and method for production thereof |
| 04/29/2004 | US20040082097 Thin-film solar cells and method of making |
| 04/29/2004 | US20040082096 Method for forming an image sensor having concave-shaped micro-lenses |
| 04/29/2004 | US20040082095 Method of fabricating a solid-state imaging device |
| 04/29/2004 | US20040082094 Method for making and packaging image sensor die using protective coating |
| 04/29/2004 | US20040082093 Image sensor having large micro-lenses at the peripheral regions |
| 04/29/2004 | US20040082092 Image sensor having integrated thin film infrared filter |
| 04/29/2004 | US20040082091 Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation |
| 04/29/2004 | US20040082090 Method for fabricating image display device |
| 04/29/2004 | US20040082089 Oled package and method for fabricating the same |
| 04/29/2004 | US20040082088 Method for fabricating ESI device using smile and delayed LOCOS techniques |
| 04/29/2004 | US20040082087 Device and method for detecting alignment of active areas and memory cell structures in dram devices |
| 04/29/2004 | US20040082084 Silicon oxide film evaluation method and semiconductor device fabrication method |
| 04/29/2004 | US20040082083 Process parameter event monitoring system and method for process |
| 04/29/2004 | US20040082082 Methods of increasing write selectivity in an mram |
| 04/29/2004 | US20040082081 Ultra-violet treatment for a tunnel barrier layer in a tunnel junction device |
| 04/29/2004 | US20040081924 Composition for releasing a resist and method for manufacturing semiconductor device using the same |
| 04/29/2004 | US20040081923 Method of preventing repeated collapse in a reworked photoresist layer |
| 04/29/2004 | US20040081922 Photoresist stripper composition |
| 04/29/2004 | US20040081918 Polysilicon hard mask etch defect particle removal |