Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/29/2004US20040079989 Multilayer; semiconductors, barrier forming layer, dielectric, electrode; controlling width of barrier; narrow band gap; high speed, high voltage switches
04/29/2004US20040079988 Flash memory cell arrays having dual control gates per memory cell charge storage element
04/29/2004US20040079987 Nonvolatile semiconductor memory device and manufacturing method thereof
04/29/2004US20040079986 Memory cell array comprising individually addressable memory cells and method of making the same
04/29/2004US20040079985 Semiconductor memory device having a gate electrode and a diffusion layer and a manufacturing method thereof
04/29/2004US20040079984 Polysilicon self-aligned contact and a polysilicon common source line and method of forming the same
04/29/2004US20040079983 Nonvolatile silicon/oxide/nitride/silicon/nitride/oxide/silicon memory
04/29/2004US20040079982 Semiconductor memory and process for fabricating the same
04/29/2004US20040079981 Semiconductor device having capacitor
04/29/2004US20040079980 Semiconductor device and method of manufacturing the same
04/29/2004US20040079979 semiconductor substrate, forming a deep trench in the substrate, forming a thin sacrificial layer on a surface of the trench, and forming a hemispherical silicon grain layer over sacrificial layer which has a thickness to act as an etch stop during removal of silicone layer, and is electroconductive
04/29/2004US20040079976 Semiconductor transistor using L-shaped spacer and method of fabricating the same
04/29/2004US20040079975 Method of manufacturing and structure of semiconductor device with floating ring structure
04/29/2004US20040079974 Nondeforming; reduce shrinkage of photoresist; forming integrated circuits
04/29/2004US20040079972 Flash EEPROM unit cell and memory array architecture including the same
04/29/2004US20040079969 High density; miniaturization; connecting transistors
04/29/2004US20040079967 Semiconductor light emitting device
04/29/2004US20040079966 Chip structure and process for forming the same
04/29/2004US20040079965 Heterojunction field effect transistor and manufacturing method thereof
04/29/2004US20040079964 Semiconductor element
04/29/2004US20040079963 Optoelectronic circuit employing a heterojunction thyristor device that performs high speed sampling
04/29/2004US20040079962 Impurities precipitation zone into silicone substrate; heat treatment; anisotropic etching, masking; sharp cone body
04/29/2004US20040079961 Photonic digital-to-analog converter employing a plurality of heterojunction thyristor devices
04/29/2004US20040079958 Method for manufacturing gallium nitride compound semiconductor
04/29/2004US20040079954 Semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
04/29/2004US20040079952 Semiconductor device and method of fabricating the same
04/29/2004US20040079949 Compound semiconductor element based on group III element nitride
04/29/2004US20040079946 Capacitor in a pixel structure
04/29/2004US20040079945 Device including OLED controlled by n-type transistor
04/29/2004US20040079944 Semiconductor device and manufacturing method for same
04/29/2004US20040079941 Semiconductor apparatus and fabrication method of the same
04/29/2004US20040079939 Photonic serial digital-to-analog converter employing a heterojunction thyristor device
04/29/2004US20040079937 Wiring substrate, electronic device, electro-optical device, and electronic apparatus
04/29/2004US20040079898 Cooling of voice coil motors in lithographic projection apparatus
04/29/2004US20040079883 Electron beam irradiation apparatus, electron beam exposure apparatus, and defect detection method
04/29/2004US20040079862 Two part mold for wafer scale caps
04/29/2004US20040079855 Microfabrication tool pedestal and method of use
04/29/2004US20040079790 Method for determining optimum bond parameters when bonding with a wire bonder
04/29/2004US20040079746 Stepped reflector plate
04/29/2004US20040079729 Process for etching metal layer
04/29/2004US20040079728 Reactive ion etching for semiconductor device feature topography modification
04/29/2004US20040079727 Method and compositions for hardening photoresist in etching processes
04/29/2004US20040079726 Method of using an amorphous carbon layer for improved reticle fabrication
04/29/2004US20040079725 Dry etching apparatus, dry etching method, and plate and tray used therein
04/29/2004US20040079723 Method for fabricating integrated LC/ESI device using SMILE,latent masking, and delayed LOCOS techniques
04/29/2004US20040079722 Method for controlling CD during an etch process
04/29/2004US20040079646 Pretreatment; removal bubbles adsorbed on substrate; rotation, immersion in plating solution
04/29/2004US20040079633 Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
04/29/2004US20040079632 High density plasma CVD process for gapfill into high aspect ratio features
04/29/2004US20040079518 Method and apparatus for cooling a reticle during lithographic exposure
04/29/2004US20040079485 Inductively coupled plasma generating apparatus incorporating serpentine coil antenna
04/29/2004US20040079464 Manufacturing method for electric device
04/29/2004US20040079408 Isoelectronic surfactant suppression of threading dislocations in metamorphic epitaxial layers
04/29/2004US20040079403 Single workpiece processing system
04/29/2004US20040079396 Apparatus and method for treating surfaces of semiconductor wafers using ozone
04/29/2004US20040079393 Spraying with dilute solution of chelate compound; rinsing with aqueous solution containing surfactant
04/29/2004US20040079389 Post-chemical mechanical polishing (CMP) cleaning method
04/29/2004US20040079388 Using supercritical carbon dioxide
04/29/2004US20040079387 Processing-Subject cleaning method and apparatus, and device manufacturing method and device
04/29/2004US20040079386 Removal surface impurities from surface of mask using aqueous solution
04/29/2004US20040079289 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
04/29/2004US20040079287 Toroidal low-field reactive gas source
04/29/2004US20040079285 Automation of oxide material growth in molecular beam epitaxy systems
04/29/2004US20040079254 Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus
04/29/2004US20040079195 Method for patterning metal using nanopraticle containing percursors
04/29/2004US20040079193 Overcoating metal particles with high electroconductive paste; high density integrated circuits
04/29/2004US20040079055 Apparatus for populating transport tapes
04/29/2004US20040078969 Method of manufacturing circuit board and communication appliance
04/29/2004US20040078967 Z-axis electrical contact for microelectronic devices
04/29/2004US20040078966 Method of mounting electronic parts on wiring board
04/29/2004US20040078963 Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
04/29/2004US20040078946 Semiconductor manufacturing apparatus and its diagnosis apparatus and operating system
04/29/2004DE19922936B4 Anlage zur Bearbeitung von Wafern Plant for the processing of wafers
04/29/2004DE19906398B4 Verfahren und Vorrichtung zum Behandeln von Substraten Method and apparatus for treating substrates
04/29/2004DE19905749B4 Bereitschaftsschaltung mit verringerter Stromaufnahme Maintained mode with reduced power consumption
04/29/2004DE19852763B4 Verfahren zur Herstellung eines Graben-Kondensators A method of fabricating a trench capacitor
04/29/2004DE19509284B4 Vorrichtung zur Erzeugung eines ebenen Plasmas unter Verwendung variierender Magnetpole A device for generating a planar plasma using varying magnetic poles
04/29/2004DE10390695T5 Schutzelement und Schleifverfahren für Halbleiterwafer Guard member and grinding method for semiconductor wafers
04/29/2004DE10296953T5 Doppelgatetransistor und Herstellungsverfahren Double-gate transistor and manufacturing method
04/29/2004DE10296913T5 Segmentiertes Laserschneiden Segmented laser cutting
04/29/2004DE10296742T5 Effizientes Hochleistungsdatenoperationselement zur Verwendung in einer Umgebung einer umkonfigurierbaren Logik Efficient high-data operation element for use in an environment of a reconfigurable logic
04/29/2004DE10296723T5 Verfahren zur Herstellung von Extremultraviolett-Lithographie-Substraten A process for producing extreme ultraviolet lithographic substrates
04/29/2004DE10296457T5 Leistungshalbleitervorrichtung mit einer Grabengateelektrode und Verfahren zum Herstellen derselben Power semiconductor device having a gate electrode grave and method for manufacturing the same
04/29/2004DE10295940T5 Plattenförmiger Schaltungsblock und Verfahren zu dessen Herstellung A plate-shaped circuit block and method of producing the
04/29/2004DE10250369B3 Formation of capacitor dielectric structure, involves forming silicon nitride layer on capacitor structure on semiconductor substrate, growing oxide layer, and forming nitridation layer on oxide layer
04/29/2004DE10248683A1 Passive component for integration into a high power circuit module has multiplayer structure with electrically contactable external metallized layers
04/29/2004DE10247610A1 Elektronisches Bauelement mit einem Systemträger Electronic component with a carrier system
04/29/2004DE10247200A1 Process for simultaneously removing material on both sides of one or more semiconductor wafers comprises using a plate which has chemically inert abrasion- and adhesion-resistant coating in partial regions on the front and rear sides
04/29/2004DE10240176A1 Ein dielektrischer Schichtstapel mit kleiner Dielektrizitätskonstante einschliesslich einer Ätzindikatorschicht zur Anwendung in der dualen Damaszenertechnik A dielectric layer stack having a low dielectric constant including a Ätzindikatorschicht for use in the dual damascene technique
04/29/2004DE10239490B3 Halbleiterspeicher Semiconductor memory
04/29/2004DE10217875B4 Verfahren zur Herstellung einer sublithographischen Maske A process for preparing a sublithographic mask
04/29/2004DE10195745T5 Eine neue chromfreie Wechselmaske zur Produktion von Halbleiter-Bauelement Features A new chrome-free exchange mask for production of semiconductor device features
04/29/2004DE10130936B4 Herstellungsverfahren für ein Halbleiterbauelement mittels Atomschichtabscheidung/ALD Manufacturing method of a semiconductor device by means of atomic layer deposition / ALD
04/29/2004DE10110697B4 Vorrichtung und Verfahren zum Züchten von Halbleitereinkristallen An apparatus and method for growing semiconductor single crystals
04/29/2004DE10059773B4 Halbleitervorrichtung Semiconductor device
04/29/2004DE10007946B4 Verfahren und Vorrichtung zur Herstellung von Keramikschichten Method and device for producing ceramic layers
04/29/2004CA2465875A1 Rotary silicon wafer cleaning apparatus
04/28/2004EP1414118A1 Contact for spiral contactor and spiral contactor
04/28/2004EP1414082A2 Doping of source-drain contacts
04/28/2004EP1414077A2 Method for making and packaging image sensor die using protective coating