| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/22/2004 | WO2004034430A2 Apparatus for alignment and orientation of a wafer for processing |
| 04/22/2004 | WO2004034426A2 Non-volatile memory device and method for forming |
| 04/22/2004 | WO2004034423A2 Semiconductor photodetector with internal reflector |
| 04/22/2004 | WO2004034422A2 Wafer coating and singulation method |
| 04/22/2004 | WO2004034421A2 Method for electric field assisted deposition of films of nanoparticles |
| 04/22/2004 | WO2004034148A1 Composition for forming antireflection film for lithography |
| 04/22/2004 | WO2004034138A1 Method for eliminating punctual defects comprised in an electrochemical device |
| 04/22/2004 | WO2004033769A1 Fabrication method for crystalline semiconductor films on foreign substrates |
| 04/22/2004 | WO2004033768A1 Lateral movement of screw dislocations during homoepitaxial growth and devices yielded therefrom free of the detrimental effectsof the screw dislocations |
| 04/22/2004 | WO2004033764A1 Liquid treatment apparatus and method of liquid treatment |
| 04/22/2004 | WO2004033763A1 Cup type plating equipment |
| 04/22/2004 | WO2004033758A2 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof |
| 04/22/2004 | WO2004033752A2 Two-layer film for next generation damascene barrier application with good oxidation resistance |
| 04/22/2004 | WO2004033574A1 Cmp method utilizing amphiphilic non-ionic surfactants |
| 04/22/2004 | WO2004033370A1 Nanopellets and method of making nanopellets |
| 04/22/2004 | WO2004033366A1 Method for preparing nano-particle and nano-particle prepared by said preparation method |
| 04/22/2004 | WO2004033197A2 Support for substrates and compound comprising a support substrate and an extremely thin substrate |
| 04/22/2004 | WO2004033158A2 Substrate handling system for aligning and orienting substrates during a transfer operation |
| 04/22/2004 | WO2004033151A1 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 04/22/2004 | WO2004033103A2 High temperature, high strength, colorable materials for device processing systems |
| 04/22/2004 | WO2004032831A2 Metalization of microtubules |
| 04/22/2004 | WO2004032593A2 Extremely thin substrate support |
| 04/22/2004 | WO2004019375A3 Bonded structures for use in semiconductor processing environments |
| 04/22/2004 | WO2004013861A3 Magnetic element utilizing spin transfer and an mram device using the magnetic element |
| 04/22/2004 | WO2004012241A3 Radiation hardened visible p-i-n detector |
| 04/22/2004 | WO2004011691B1 Copper sputtering targets and methods of forming copper sputtering targets |
| 04/22/2004 | WO2004009289A3 Rising after chemical-mechanical planarization process applied on a wafer |
| 04/22/2004 | WO2004006300A3 Organic contact-enhancing layer for organic field effect transistors |
| 04/22/2004 | WO2003107425A3 Semiconductor memory device having a ferroelectric capacitor and a manufacturing method thereof |
| 04/22/2004 | WO2003107350A3 Magnetoresistive random access memory with reduced switching field |
| 04/22/2004 | WO2003100834A3 Method of forming semiconductor device with sidewall access gate |
| 04/22/2004 | WO2003100828A3 Method of depositing an oxide film by chemical vapor deposition |
| 04/22/2004 | WO2003085703A3 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 04/22/2004 | WO2003078301A3 Micro-electromechanical systems |
| 04/22/2004 | WO2003071596A3 Electronic component with an adhesive layer and method for the production thereof |
| 04/22/2004 | WO2003068421A3 Integrated system for processing semiconductor wafers |
| 04/22/2004 | WO2003060986A3 Method of forming a removable support with a sacrificial layers and of transferring devices |
| 04/22/2004 | WO2003060963A3 Electrochemical edge and bevel cleaning process and system |
| 04/22/2004 | WO2003054622A8 Thin film transistor substrate for liquid crystal display (lcd) and method of manufacturing the same |
| 04/22/2004 | WO2003046948A3 Bipolar semiconductor device and method for production thereof |
| 04/22/2004 | WO2003030223A3 Substrate processing apparatus and method |
| 04/22/2004 | WO2003029531A3 Electrolytic processing apparatus and method |
| 04/22/2004 | WO2003010070A8 A container |
| 04/22/2004 | WO2002095430A3 Test circuit |
| 04/22/2004 | WO2002080244A9 Improved process for deposition of semiconductor films |
| 04/22/2004 | WO2002062680A8 Conveyorized storage and transportation system |
| 04/22/2004 | WO2002059398A3 Plating apparatus and method |
| 04/22/2004 | WO2002031869A9 Method and apparatus for processing thin metal layers |
| 04/22/2004 | US20040078774 Semiconductor integrated circuit |
| 04/22/2004 | US20040078739 Semiconductor device |
| 04/22/2004 | US20040078676 Automatic computer-system-level integrated circuit testing system and method |
| 04/22/2004 | US20040078184 Logic emulator |
| 04/22/2004 | US20040078108 Using scatterometry to obtain measurements of in circuit structures |
| 04/22/2004 | US20040077512 Removing etching waste from copper wiring and silicon oxide surface without corrosion, oxidation or roughness; using such as tetramethylammonium hydroxide and 1,4-diisobutyl-1,4-dimethylbut-2-yne diol polyoxyethylene glycol ether |
| 04/22/2004 | US20040077305 Process for forming fast recovery diode with a single large area P/N junction |
| 04/22/2004 | US20040077297 Polishing apparatus and polishing method |
| 04/22/2004 | US20040077295 Process for reducing dishing and erosion during chemical mechanical planarization |
| 04/22/2004 | US20040077292 Real-time polishing pad stiffness control using magnetically controllable fluid |
| 04/22/2004 | US20040077185 Semiconductor device manufacturing method, heat treatment apparatus, and heat treatment method |
| 04/22/2004 | US20040077184 Apparatuses and methods for depositing an oxide film |
| 04/22/2004 | US20040077183 Titanium tantalum nitride silicide layer |
| 04/22/2004 | US20040077182 Method for forming introgen-containing oxide thin film using plasma enhanced atomic layer deposition |
| 04/22/2004 | US20040077181 Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslon |
| 04/22/2004 | US20040077180 Process and control device for the planarization of a semiconductor sample |
| 04/22/2004 | US20040077179 Laminate low K film |
| 04/22/2004 | US20040077178 Method for laterally etching a semiconductor structure |
| 04/22/2004 | US20040077177 Dielectric materials |
| 04/22/2004 | US20040077176 Process for forming shallow trench isolation region with corner protection layer |
| 04/22/2004 | US20040077175 Barc shaping for improved fabrication of dual damascene integrated circuit features |
| 04/22/2004 | US20040077174 Method for forming a high aspect ratio via |
| 04/22/2004 | US20040077173 Using water soluble bottom anti-reflective coating |
| 04/22/2004 | US20040077172 Wet etching narrow trenches |
| 04/22/2004 | US20040077171 Method and composition to improve a nitride/oxide wet etching selectivity |
| 04/22/2004 | US20040077170 Method for burying resist and method for manufacturing semiconductor device |
| 04/22/2004 | US20040077169 Method of fabricating a narrow polysilicon line |
| 04/22/2004 | US20040077168 Etchant and method for fabricating a semiconductor device using the same |
| 04/22/2004 | US20040077166 Semiconductor crystal growing method and semiconductor light-emitting device |
| 04/22/2004 | US20040077165 Hafnium nitride buffer layers for growth of GaN on silicon |
| 04/22/2004 | US20040077164 Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry |
| 04/22/2004 | US20040077163 Method for STI etching using endpoint detection |
| 04/22/2004 | US20040077162 Thermal activation of fluorine for use in a semiconductor chamber |
| 04/22/2004 | US20040077161 Method of depositing a material layer |
| 04/22/2004 | US20040077160 Method to control dimensions of features on a substrate with an organic anti-reflective coating |
| 04/22/2004 | US20040077159 Apparaus for manufacturing semiconductor devices |
| 04/22/2004 | US20040077158 Method of manufacturing semiconductor device through salicide process |
| 04/22/2004 | US20040077157 Fabrication of abrupt ultra-shallow junctions |
| 04/22/2004 | US20040077156 Methods of defect reduction in wide bandgap thin films using nanolithography |
| 04/22/2004 | US20040077155 Method for fabricating laminated silicon gate electrode |
| 04/22/2004 | US20040077153 Semiconductor substrate, SOI substrate and manufacturing method therefor |
| 04/22/2004 | US20040077152 Process for producing semiconductor device and semiconductor device produced thereby |
| 04/22/2004 | US20040077151 Field-shielded SOI-MOS structure free from floating body effect, and method of fabrication therefor |
| 04/22/2004 | US20040077149 Method and system for compensating for anneal non-uniformities |
| 04/22/2004 | US20040077148 Methods of manufacturing transistors and transistors having an anti-punchthrough region |
| 04/22/2004 | US20040077147 Stacked gate flash memory device and method of fabricating the same |
| 04/22/2004 | US20040077146 Method for producing nonvolatile semiconductor memory device and the device itself |
| 04/22/2004 | US20040077145 Method of fabricating semiconductor device |
| 04/22/2004 | US20040077144 Method to form self-aligned split gate flash with L-shaped wordline spacers |
| 04/22/2004 | US20040077143 Semiconductor device and method for fabricating the same using damascene process |
| 04/22/2004 | US20040077142 Atomic layer deposition and plasma treatment method for forming microelectronic capacitor structure with aluminum oxide containing dual dielectric layer |
| 04/22/2004 | US20040077141 Capacitor and fabrication method thereof |