Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2004
05/04/2004US6729040 Apparatus and method for drying a substrate using hydrophobic and polar organic compounds
05/04/2004US6729027 Method of forming recessed socket contacts
05/04/2004US6729019 Method of manufacturing a probe card
05/04/2004US6728989 Labyrinth seal for bearing in brush mounting assembly for semiconductor wafer scrubber
05/04/2004CA2300345C Semiconductor device capable of reducing noise
05/04/2004CA2157487C Polymeric resin for depositing catalytic palladium on a substrate
05/04/2004CA2140619C Bandgap tuning of semiconductor quantum well structures
04/2004
04/30/2004CA2441497A1 Container for the storage and transport of sensitive plate-like objects
04/29/2004WO2004036655A1 Silicon carbide semiconductor device and its manufacturing method
04/29/2004WO2004036652A1 Semiconductor apparatus and fabrication method of the same
04/29/2004WO2004036651A1 Semiconductor ferroelectric storage device and its manufacturing method
04/29/2004WO2004036650A1 High frequency semiconductor device and producing the same
04/29/2004WO2004036647A1 Method for cutting lead terminal of package type electronic component
04/29/2004WO2004036642A1 Semiconductor wafer protective device and semiconductor wafer treatment method
04/29/2004WO2004036641A1 Probe device that controls temperature of object to be inspected and probe inspection method
04/29/2004WO2004036640A1 Method of forming dielectric film
04/29/2004WO2004036639A1 Etching system and method for fabricating semiconductor device using it
04/29/2004WO2004036638A1 Method for fabricating semiconductor device
04/29/2004WO2004036637A1 Rotary silicon wafer cleaning apparatus
04/29/2004WO2004036636A1 A film stack having a silicon germanium layer and a thin amorphous seed layer
04/29/2004WO2004036635A1 Production method for thin-film crystal wafer, semiconductor device using it and production method therefor
04/29/2004WO2004036634A1 Thin film forming apparatus and thin film forming method and thin film forming system
04/29/2004WO2004036633A1 Liquid processing device
04/29/2004WO2004036630A2 Rapid thermal processing system for integrated circuits
04/29/2004WO2004036629A1 Spin-coating methods and apparatuses for spin-coating, including pressure sensor
04/29/2004WO2004036628A2 Device and method for transporting wafer-shaped articles
04/29/2004WO2004036627A2 Plasma system and method for anistropically etching structures into a substrate
04/29/2004WO2004036624A2 Two-step atomic layer deposition of copper layers
04/29/2004WO2004036621A2 Method for improved alignment tolerance in a bipolar transistor and related structure
04/29/2004WO2004036620A2 Method for generating oxide layers on semiconductor substrates
04/29/2004WO2004036611A2 Neutral particle beam processing apparatus with enhanced conversion performance from plasma ions to neutral particles
04/29/2004WO2004036607A1 Thin film capacitor and method for manufacturing same
04/29/2004WO2004036315A1 Photoresist base material, method for purification thereof, and photoresist compositions
04/29/2004WO2004036311A2 Anti-reflective compositions comprising triazine compounds
04/29/2004WO2004036303A1 A thin film translator array panel and a method for manufacturing the panel
04/29/2004WO2004035859A1 Apparatus and method for depositing an oxide film
04/29/2004WO2004035807A2 Method and system for compensating for anneal non-uniformities
04/29/2004WO2004035703A1 Melt-flow controlling method for elastomer by uv irradiation
04/29/2004WO2004035528A1 Method for the production of a multi-metal oxide material
04/29/2004WO2004035527A1 Multimetallic oxide composition
04/29/2004WO2004035423A1 Storage container for receiving precision substrates such as wafers
04/29/2004WO2004035265A1 Polishing state monitoring apparatus and polishing apparatus and method
04/29/2004WO2004035253A1 An apparatus and method for filling a ball grid array template
04/29/2004WO2004035105A2 Polymer microneedles
04/29/2004WO2004030050A3 Apparatus and method for controlling etch depth
04/29/2004WO2004025693A3 Method for the production of a semi-conductive structure comprising a plurality of gate stacks arranged on a semi-conductor substrate and corresponding semi-conductive structure
04/29/2004WO2004023533A3 Semiconductor component and method of manufacture
04/29/2004WO2004021082A3 Improved photomask having an intermediate inspection film layer
04/29/2004WO2004017393A3 Prevention of lateral oxidation in a transistor utilizing an ultra thin oxygen-diffusion barrier
04/29/2004WO2004017382A3 Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity within areas in such regions and edge areas thereof, and a structure of such film regions
04/29/2004WO2004016829A3 Electrolytic copper plating solutions
04/29/2004WO2004015745A3 A dmos device with a programmable threshold voltage
04/29/2004WO2004015727A3 Method for controlling a recess etch process
04/29/2004WO2004013902A3 Hot plate annealing
04/29/2004WO2004013723A3 Model and parameter selection for optical metrology
04/29/2004WO2004012227A3 Method for producing by vapour-phase epitaxy a gallium nitride film with low defect density
04/29/2004WO2004010466A3 Metal organic chemical vapor deposition and atomic layer deposition of metal oxynitride and metal silicon oxynitride
04/29/2004WO2004008523A8 Sealing ring assembly and mounting method
04/29/2004WO2004007794A3 Pulsed nucleation deposition of tungsten layers
04/29/2004WO2004007608A3 Self-healing polymer compositions
04/29/2004WO2004001926A3 Nano-architected/assembled solar electricity cell
04/29/2004WO2003106310A9 Universal reticle transfer system
04/29/2004WO2003103025A3 Method and apparatus of sealing wafer backside for full-face electrochemical plating
04/29/2004WO2003096123A8 Reversal imprint technique
04/29/2004WO2003090279A8 Semiconductor component comprising an integrated latticed capacitance structure
04/29/2004WO2003088327A3 Deposition of silicon layers for active matrix liquid crystal displays
04/29/2004WO2003083926A3 The microwave enhanced method of silicon etching and the system for microwave enhanced semiconductors etching
04/29/2004WO2003080796A9 Ordered biological nanostructures formed from chaperonin polypeptides
04/29/2004WO2003044849A3 Integrated void-free process for assembling a solder bumped chip
04/29/2004WO2003034501A9 Mos devices and corresponding manufacturing methods and circuits
04/29/2004WO2003022519A9 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
04/29/2004WO2003017337A9 Shield for capturing fluids displaced from a substrate
04/29/2004WO2003003435A3 Method for improving inversion layer mobility in a silicon carbide metal-oxide semiconductor field-effect transistor
04/29/2004WO2002103792A3 Method of manufacturing a semiconductor device and semiconductor device
04/29/2004WO2002045132A9 Low defect density, thin-layer, soi substrates
04/29/2004US20040083445 Method of fabricating a semiconductor device and a method of generating a mask pattern
04/29/2004US20040083444 Pattern transfer mask related to formation of dual damascene structure and method of forming dual damascene structure
04/29/2004US20040083440 Integrated circuit cells
04/29/2004US20040083438 Method, program, and apparatus for designing a semiconductor device
04/29/2004US20040083435 System and method for designing dynamic circuits in a SOI process
04/29/2004US20040083329 Semiconductor memory apparatus, semiconductor apparatus, data processing apparatus and computer system
04/29/2004US20040083328 Method for operating an MRAM semiconductor memory configuration
04/29/2004US20040083073 Probe testing method and apparatus for determining acceptable/defective end shape of contact probe through image analysis
04/29/2004US20040083021 Multi-tool control system, method and medium
04/29/2004US20040082289 Conductive polishing article for electrochemical mechanical polishing
04/29/2004US20040082288 Fixed abrasive articles
04/29/2004US20040082279 Polishing agent and lapping method
04/29/2004US20040082278 Processing tool, method of producing processing tool, processing method and processing apparatus
04/29/2004US20040082276 Transparent microporous materials for CMP
04/29/2004US20040082275 Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers
04/29/2004US20040082274 Polishing slurry used for copper chemical mechanical polishing (CMP) process
04/29/2004US20040082273 Abrasive machine and method of abrading work piece
04/29/2004US20040082252 Detection and repair system and method thereof
04/29/2004US20040082201 Ultra-violet treatment of a tunnel barrier layer through an overlayer a tunnel junction device
04/29/2004US20040082200 Method for forming a silicon nitride layer
04/29/2004US20040082199 Plasma processes for depositing low dielectric constant films
04/29/2004US20040082198 Method of manufacturing semiconductor device
04/29/2004US20040082197 Orientation independent oxidation of nitrided silicon
04/29/2004US20040082196 Semiconductor device and method of manufacturing same
04/29/2004US20040082195 Production method of a thin film device, production method of a transistor, electro-optical apparatus and electronic equipment